JP6288935B2 - シート - Google Patents
シート Download PDFInfo
- Publication number
- JP6288935B2 JP6288935B2 JP2013087144A JP2013087144A JP6288935B2 JP 6288935 B2 JP6288935 B2 JP 6288935B2 JP 2013087144 A JP2013087144 A JP 2013087144A JP 2013087144 A JP2013087144 A JP 2013087144A JP 6288935 B2 JP6288935 B2 JP 6288935B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- sheet
- wafer
- plate
- supplied
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000853 adhesive Substances 0.000 claims description 56
- 230000001070 adhesive effect Effects 0.000 claims description 56
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000003851 corona treatment Methods 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 9
- 239000012790 adhesive layer Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- -1 polyethylene vinyl chloride Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000000181 anti-adherent effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 208000028659 discharge Diseases 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Description
11 半導体ウエーハ
12a 被貼着面
14 フッ素樹脂コーティング
16 支持台
18 接着剤
20 プレス装置
22 保持テーブル
24 吸引保持部
28 吸引源
30 紫外線ランプ
Claims (3)
- 接着剤を介して板状物が貼着されるシートであって、
該シートの該接着剤が供給される面の濡れ性が該接着剤をはじく程度に低くなり、該面に供給される該接着剤が、該接着剤と該板状物との間に空気が入り込まない程度に山状又は半球状に盛り上がるように、撥接着剤性を付与する処理が施された該面を有することを特徴とするシート。 - 前記撥接着剤性を付与する処理が施された面は、フッ素樹脂コーティングが施された面又はコロナ放電処理が施された面である請求項1に記載のシート。
- 前記接着剤は紫外線の照射によって硬化する紫外線硬化樹脂から構成され、
前記シートは紫外線を透過する請求項1又は2に記載のシート。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013087144A JP6288935B2 (ja) | 2013-04-18 | 2013-04-18 | シート |
TW103108731A TW201446925A (zh) | 2013-04-18 | 2014-03-12 | 片材 |
KR1020140040359A KR102116585B1 (ko) | 2013-04-18 | 2014-04-04 | 시트 |
CN201410138818.XA CN104108063B (zh) | 2013-04-18 | 2014-04-08 | 片材 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013087144A JP6288935B2 (ja) | 2013-04-18 | 2013-04-18 | シート |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014212187A JP2014212187A (ja) | 2014-11-13 |
JP6288935B2 true JP6288935B2 (ja) | 2018-03-07 |
Family
ID=51705154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013087144A Active JP6288935B2 (ja) | 2013-04-18 | 2013-04-18 | シート |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6288935B2 (ja) |
KR (1) | KR102116585B1 (ja) |
CN (1) | CN104108063B (ja) |
TW (1) | TW201446925A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017224670A (ja) * | 2016-06-14 | 2017-12-21 | 株式会社ディスコ | 保護部材形成装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1164154A1 (de) * | 2000-06-15 | 2001-12-19 | Ag Bayer | Haftklebstoffe mit verbesserter Scherfestigkeit bei erhöhten Temperaturen |
JP2002203827A (ja) * | 2000-12-28 | 2002-07-19 | Lintec Corp | 半導体ウエハの裏面研削方法 |
JP2005206664A (ja) * | 2004-01-21 | 2005-08-04 | Nitto Denko Corp | 半導体封止用樹脂組成物 |
JP2006066625A (ja) * | 2004-08-26 | 2006-03-09 | Nec Corp | ベアチップ実装装置、ベアチップ実装方法及びシート |
JP4954663B2 (ja) * | 2005-10-17 | 2012-06-20 | 東京エレクトロン株式会社 | 貼り合せ装置 |
JP2008194886A (ja) * | 2007-02-09 | 2008-08-28 | Nippon Shokubai Co Ltd | 表面保護フィルム |
JP5089370B2 (ja) | 2007-12-21 | 2012-12-05 | 株式会社ディスコ | 樹脂被覆方法および装置 |
JP2010062269A (ja) * | 2008-09-02 | 2010-03-18 | Three M Innovative Properties Co | ウェーハ積層体の製造方法、ウェーハ積層体製造装置、ウェーハ積層体、支持層剥離方法、及びウェーハの製造方法 |
JP5324212B2 (ja) * | 2008-12-26 | 2013-10-23 | 株式会社ディスコ | 樹脂被覆方法および樹脂被覆装置 |
JP5503951B2 (ja) * | 2009-12-07 | 2014-05-28 | 株式会社ディスコ | 貼着装置 |
EP2416633A1 (de) * | 2010-08-04 | 2012-02-08 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Verfahren ur Festlegung und/oder Einbettung eines elektronischen Bauteils sowie Kleber zur Verwendung in einem derartigen Verfahren |
-
2013
- 2013-04-18 JP JP2013087144A patent/JP6288935B2/ja active Active
-
2014
- 2014-03-12 TW TW103108731A patent/TW201446925A/zh unknown
- 2014-04-04 KR KR1020140040359A patent/KR102116585B1/ko active IP Right Grant
- 2014-04-08 CN CN201410138818.XA patent/CN104108063B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
TW201446925A (zh) | 2014-12-16 |
KR20140125295A (ko) | 2014-10-28 |
CN104108063B (zh) | 2019-01-01 |
KR102116585B1 (ko) | 2020-05-28 |
CN104108063A (zh) | 2014-10-22 |
JP2014212187A (ja) | 2014-11-13 |
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