JP5305993B2 - 容量型機械電気変換素子の製造方法、及び容量型機械電気変換素子 - Google Patents

容量型機械電気変換素子の製造方法、及び容量型機械電気変換素子 Download PDF

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Publication number
JP5305993B2
JP5305993B2 JP2009057263A JP2009057263A JP5305993B2 JP 5305993 B2 JP5305993 B2 JP 5305993B2 JP 2009057263 A JP2009057263 A JP 2009057263A JP 2009057263 A JP2009057263 A JP 2009057263A JP 5305993 B2 JP5305993 B2 JP 5305993B2
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Japan
Prior art keywords
electrode
opening
sacrificial layer
cavity
substrate
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Expired - Fee Related
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JP2009057263A
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English (en)
Japanese (ja)
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JP2009296569A (ja
JP2009296569A5 (https=
Inventor
建六 張
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Canon Inc
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Canon Inc
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Priority to JP2009057263A priority Critical patent/JP5305993B2/ja
Application filed by Canon Inc filed Critical Canon Inc
Priority to TW098114039A priority patent/TW201002089A/zh
Priority to US12/918,660 priority patent/US8288192B2/en
Priority to PCT/JP2009/058720 priority patent/WO2009133961A1/en
Priority to CN2009801150893A priority patent/CN102015127B/zh
Priority to EP09738898.7A priority patent/EP2274108B1/en
Publication of JP2009296569A publication Critical patent/JP2009296569A/ja
Publication of JP2009296569A5 publication Critical patent/JP2009296569A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/00468—Releasing structures
    • B81C1/00476—Releasing structures removing a sacrificial layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/03—Microengines and actuators
    • B81B2201/038—Microengines and actuators not provided for in B81B2201/031 - B81B2201/037
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/04—Electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0111—Bulk micromachining
    • B81C2201/0114—Electrochemical etching, anodic oxidation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Micromachines (AREA)
JP2009057263A 2008-05-02 2009-03-11 容量型機械電気変換素子の製造方法、及び容量型機械電気変換素子 Expired - Fee Related JP5305993B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2009057263A JP5305993B2 (ja) 2008-05-02 2009-03-11 容量型機械電気変換素子の製造方法、及び容量型機械電気変換素子
US12/918,660 US8288192B2 (en) 2008-05-02 2009-04-28 Method of manufacturing a capacitive electromechanical transducer
PCT/JP2009/058720 WO2009133961A1 (en) 2008-05-02 2009-04-28 Methods of manufacturing capacitive electromechanical transducer and capacitive electromechanical transducers
CN2009801150893A CN102015127B (zh) 2008-05-02 2009-04-28 电容型机电变换器的制造方法和电容型机电变换器
TW098114039A TW201002089A (en) 2008-05-02 2009-04-28 Method of manufacturing capacitive electromechanical transducer and capacitive electromechanical transducer
EP09738898.7A EP2274108B1 (en) 2008-05-02 2009-04-28 Methods of manufacturing a capacitive electromechanical transducer

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008120391 2008-05-02
JP2008120391 2008-05-02
JP2009057263A JP5305993B2 (ja) 2008-05-02 2009-03-11 容量型機械電気変換素子の製造方法、及び容量型機械電気変換素子

Publications (3)

Publication Number Publication Date
JP2009296569A JP2009296569A (ja) 2009-12-17
JP2009296569A5 JP2009296569A5 (https=) 2012-04-26
JP5305993B2 true JP5305993B2 (ja) 2013-10-02

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JP2009057263A Expired - Fee Related JP5305993B2 (ja) 2008-05-02 2009-03-11 容量型機械電気変換素子の製造方法、及び容量型機械電気変換素子

Country Status (6)

Country Link
US (1) US8288192B2 (https=)
EP (1) EP2274108B1 (https=)
JP (1) JP5305993B2 (https=)
CN (1) CN102015127B (https=)
TW (1) TW201002089A (https=)
WO (1) WO2009133961A1 (https=)

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JP5317826B2 (ja) * 2009-05-19 2013-10-16 キヤノン株式会社 容量型機械電気変換素子の製造方法
JP2012033806A (ja) * 2010-08-02 2012-02-16 Canon Inc 電気機械変換装置
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JP5921079B2 (ja) * 2011-04-06 2016-05-24 キヤノン株式会社 電気機械変換装置及びその作製方法
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JP2013051459A (ja) * 2011-08-30 2013-03-14 Canon Inc 電気機械変換装置及びその製造方法
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EP3604207A1 (en) * 2013-03-05 2020-02-05 Ams Ag Semiconductor device with capacitive sensor and integrated circuit
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EP2796209B1 (en) * 2013-04-25 2020-06-17 Canon Kabushiki Kaisha Capacitive transducer and method of manufacturing the same
JP6238556B2 (ja) 2013-04-25 2017-11-29 キヤノン株式会社 被検体情報取得装置およびその制御方法、ならびに探触子
EP2796210B1 (en) * 2013-04-25 2016-11-30 Canon Kabushiki Kaisha Capacitive transducer and method of manufacturing the same
US9955949B2 (en) * 2013-08-23 2018-05-01 Canon Kabushiki Kaisha Method for manufacturing a capacitive transducer
JP2015153978A (ja) * 2014-02-18 2015-08-24 キヤノン株式会社 貫通配線の作製方法
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
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Also Published As

Publication number Publication date
US8288192B2 (en) 2012-10-16
JP2009296569A (ja) 2009-12-17
CN102015127A (zh) 2011-04-13
CN102015127B (zh) 2013-05-29
WO2009133961A1 (en) 2009-11-05
EP2274108A1 (en) 2011-01-19
US20100327380A1 (en) 2010-12-30
EP2274108B1 (en) 2013-12-25
TW201002089A (en) 2010-01-01

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