CN102015127B - 电容型机电变换器的制造方法和电容型机电变换器 - Google Patents

电容型机电变换器的制造方法和电容型机电变换器 Download PDF

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Publication number
CN102015127B
CN102015127B CN2009801150893A CN200980115089A CN102015127B CN 102015127 B CN102015127 B CN 102015127B CN 2009801150893 A CN2009801150893 A CN 2009801150893A CN 200980115089 A CN200980115089 A CN 200980115089A CN 102015127 B CN102015127 B CN 102015127B
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CN
China
Prior art keywords
electrode
diaphragm
cavity
aperture
electromechanical transducer
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Expired - Fee Related
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CN2009801150893A
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English (en)
Chinese (zh)
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CN102015127A (zh
Inventor
张建六
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Canon Inc
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Canon Inc
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Publication of CN102015127A publication Critical patent/CN102015127A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/00468—Releasing structures
    • B81C1/00476—Releasing structures removing a sacrificial layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/03—Microengines and actuators
    • B81B2201/038—Microengines and actuators not provided for in B81B2201/031 - B81B2201/037
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/04—Electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0111—Bulk micromachining
    • B81C2201/0114—Electrochemical etching, anodic oxidation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Micromachines (AREA)
CN2009801150893A 2008-05-02 2009-04-28 电容型机电变换器的制造方法和电容型机电变换器 Expired - Fee Related CN102015127B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2008-120391 2008-05-02
JP2008120391 2008-05-02
JP2009-057263 2009-03-11
JP2009057263A JP5305993B2 (ja) 2008-05-02 2009-03-11 容量型機械電気変換素子の製造方法、及び容量型機械電気変換素子
PCT/JP2009/058720 WO2009133961A1 (en) 2008-05-02 2009-04-28 Methods of manufacturing capacitive electromechanical transducer and capacitive electromechanical transducers

Publications (2)

Publication Number Publication Date
CN102015127A CN102015127A (zh) 2011-04-13
CN102015127B true CN102015127B (zh) 2013-05-29

Family

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Family Applications (1)

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CN2009801150893A Expired - Fee Related CN102015127B (zh) 2008-05-02 2009-04-28 电容型机电变换器的制造方法和电容型机电变换器

Country Status (6)

Country Link
US (1) US8288192B2 (https=)
EP (1) EP2274108B1 (https=)
JP (1) JP5305993B2 (https=)
CN (1) CN102015127B (https=)
TW (1) TW201002089A (https=)
WO (1) WO2009133961A1 (https=)

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JP5317826B2 (ja) * 2009-05-19 2013-10-16 キヤノン株式会社 容量型機械電気変換素子の製造方法
JP2012033806A (ja) * 2010-08-02 2012-02-16 Canon Inc 電気機械変換装置
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JP5778914B2 (ja) * 2010-11-04 2015-09-16 キヤノン株式会社 電気機械変換装置の製造方法
JP5875244B2 (ja) * 2011-04-06 2016-03-02 キヤノン株式会社 電気機械変換装置及びその作製方法
JP5875243B2 (ja) * 2011-04-06 2016-03-02 キヤノン株式会社 電気機械変換装置及びその作製方法
JP5921079B2 (ja) * 2011-04-06 2016-05-24 キヤノン株式会社 電気機械変換装置及びその作製方法
JP5787586B2 (ja) * 2011-04-14 2015-09-30 キヤノン株式会社 電気機械変換装置
JP5812660B2 (ja) * 2011-04-19 2015-11-17 キヤノン株式会社 電気機械変換装置及びその製造方法
JP2013051459A (ja) * 2011-08-30 2013-03-14 Canon Inc 電気機械変換装置及びその製造方法
US8440523B1 (en) * 2011-12-07 2013-05-14 International Business Machines Corporation Micromechanical device and methods to fabricate same using hard mask resistant to structure release etch
MX2014008852A (es) * 2012-01-27 2014-10-06 Koninkl Philips Nv Transductor capacitivo micromaquinado y metodo de manufactura del mismo.
JP6209537B2 (ja) * 2012-01-27 2017-10-04 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 容量性マイクロマシン・トランスデューサ及びこれを製造する方法
TW201338092A (zh) * 2012-03-08 2013-09-16 Rexchip Electronics Corp 半導體之氣隙的形成方法
CN104379268B (zh) * 2012-05-31 2017-02-22 皇家飞利浦有限公司 晶片及其制造方法
US8900975B2 (en) 2013-01-03 2014-12-02 International Business Machines Corporation Nanopore sensor device
EP3604207A1 (en) * 2013-03-05 2020-02-05 Ams Ag Semiconductor device with capacitive sensor and integrated circuit
JP5901566B2 (ja) * 2013-04-18 2016-04-13 キヤノン株式会社 トランスデューサ、トランスデューサの製造方法、及び被検体情報取得装置
EP2796209B1 (en) * 2013-04-25 2020-06-17 Canon Kabushiki Kaisha Capacitive transducer and method of manufacturing the same
JP6238556B2 (ja) 2013-04-25 2017-11-29 キヤノン株式会社 被検体情報取得装置およびその制御方法、ならびに探触子
EP2796210B1 (en) * 2013-04-25 2016-11-30 Canon Kabushiki Kaisha Capacitive transducer and method of manufacturing the same
US9955949B2 (en) * 2013-08-23 2018-05-01 Canon Kabushiki Kaisha Method for manufacturing a capacitive transducer
JP2015153978A (ja) * 2014-02-18 2015-08-24 キヤノン株式会社 貫通配線の作製方法
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
KR101725788B1 (ko) * 2014-10-31 2017-04-12 에스케이 텔레콤주식회사 절연층 노출을 방지한 이온 트랩 장치 및 그 제작 방법
JP2016101417A (ja) * 2014-11-28 2016-06-02 キヤノン株式会社 静電容量型音響波トランスデューサ及びこれを備えた被検体情報取得装置
DE102015221193B4 (de) * 2015-10-29 2018-05-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung zur Steuerung einer Intensität eines transmittierenden Anteils von auf die Vorrichtung einfallender elektromagnetischer Strahlung und Verfahren zur Herstellung der Vorrichtung
JP6177375B2 (ja) * 2016-04-14 2017-08-09 キヤノン株式会社 電気機械変換装置及びその作製方法
US10062636B2 (en) * 2016-06-27 2018-08-28 Newport Fab, Llc Integration of thermally conductive but electrically isolating layers with semiconductor devices
US10662055B2 (en) 2017-04-27 2020-05-26 Seiko Epson Corporation MEMS element, sealing structure, electronic device, electronic apparatus, and vehicle
CN108423632A (zh) * 2018-05-04 2018-08-21 李扬渊 一种能够实现超声波传感的电子设备及其制造方法
CN108871389B (zh) * 2018-05-10 2020-03-31 京东方科技集团股份有限公司 超声波传感单元及制作方法、超声波传感器及显示装置
DE102018222749A1 (de) 2018-12-21 2020-06-25 Robert Bosch Gmbh Verfahren zum Verschließen von Zugängen in einem MEMS-Element
CN114555248A (zh) 2019-04-12 2022-05-27 布弗莱运营公司 用于微加工超声换能器器件的分段式吸气剂开口
US11845654B2 (en) * 2020-06-18 2023-12-19 The University Of British Columbia Methods of fabricating micro electro-mechanical systems structures

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Also Published As

Publication number Publication date
JP5305993B2 (ja) 2013-10-02
US8288192B2 (en) 2012-10-16
JP2009296569A (ja) 2009-12-17
CN102015127A (zh) 2011-04-13
WO2009133961A1 (en) 2009-11-05
EP2274108A1 (en) 2011-01-19
US20100327380A1 (en) 2010-12-30
EP2274108B1 (en) 2013-12-25
TW201002089A (en) 2010-01-01

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