CN113678472A - Mems电容传感器及其制备方法、电子设备 - Google Patents
Mems电容传感器及其制备方法、电子设备 Download PDFInfo
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- CN113678472A CN113678472A CN201980087006.8A CN201980087006A CN113678472A CN 113678472 A CN113678472 A CN 113678472A CN 201980087006 A CN201980087006 A CN 201980087006A CN 113678472 A CN113678472 A CN 113678472A
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
Abstract
一种MEMS电容传感器及其制备方法，该传感器包括第一电极结构(200)，该第一电极结构(200)包括位于中间区域的第一导电区域(230a)以及所述第一导电区域周围的绝缘区域(240)，第一导电区域(230a)和绝缘区域(240)为一整体结构，且其中至少一个通过掺杂方式形成。上述MEMS电容式传感器，通过在第一电极结构中设置在中间区域的第一导电区域导电，第一导电区域周围的绝缘区域绝缘，降低了MEMS电容式传感器的寄生电容，并且无需设置多层绝缘薄膜，避免了残余应力控制复杂、多层薄膜剥离和弯曲的问题。
Description
PCT国内申请，说明书已公开。
Claims (30)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2019/089601 WO2020237651A1 (zh) | 2019-05-31 | 2019-05-31 | Mems电容传感器及其制备方法、电子设备 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113678472A true CN113678472A (zh) | 2021-11-19 |
| CN113678472B CN113678472B (zh) | 2024-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201980087006.8A Active CN113678472B (zh) | 2019-05-31 | 2019-05-31 | Mems电容传感器及其制备方法、电子设备 |
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| CN (1) | CN113678472B (zh) |
| WO (1) | WO2020237651A1 (zh) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070286438A1 (en) * | 2006-03-29 | 2007-12-13 | Yamaha Corporation | Condenser microphone |
| JP2011064688A (ja) * | 2010-10-18 | 2011-03-31 | Seiko Epson Corp | 微小電気機械装置、半導体装置、微小電気機械装置の製造方法、および半導体装置の製造方法 |
| CN104671186A (zh) * | 2013-11-27 | 2015-06-03 | 英飞凌科技股份有限公司 | Mems器件 |
| CN105142086A (zh) * | 2015-09-24 | 2015-12-09 | 歌尔声学股份有限公司 | 一种mems麦克风芯片、传声器和音频设备 |
| CN205283813U (zh) * | 2015-11-30 | 2016-06-01 | 歌尔声学股份有限公司 | 一种mems麦克风芯片及mems麦克风 |
| CN105681990A (zh) * | 2014-11-19 | 2016-06-15 | 北京卓锐微技术有限公司 | 一种硅电容麦克风 |
| CN106303867A (zh) * | 2015-05-13 | 2017-01-04 | 无锡华润上华半导体有限公司 | Mems麦克风 |
| CN106465022A (zh) * | 2014-04-01 | 2017-02-22 | 罗伯特·博世有限公司 | Mems麦克风中的经掺杂的基板区 |
| CN107176584A (zh) * | 2016-03-10 | 2017-09-19 | 英飞凌科技股份有限公司 | Mems器件和mems真空扩音器 |
| CN108467005A (zh) * | 2017-02-09 | 2018-08-31 | 英飞凌科技股份有限公司 | 半导体装置和用于形成半导体装置的方法 |
| CN108540911A (zh) * | 2017-03-01 | 2018-09-14 | 英飞凌科技股份有限公司 | Mems设备、声换能器、形成mems设备的方法以及操作mems设备的方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0605576D0 (en) * | 2006-03-20 | 2006-04-26 | Oligon Ltd | MEMS device |
| CN101272636B (zh) * | 2007-03-21 | 2012-07-18 | 歌尔声学股份有限公司 | 电容式传声器芯片 |
| US8218286B2 (en) * | 2008-11-12 | 2012-07-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | MEMS microphone with single polysilicon film |
| CN101489170B (zh) * | 2009-02-20 | 2012-08-22 | 浙江工业大学 | 自检测硅微机械电容式麦克风及其制备方法 |
| CN202153165U (zh) * | 2011-07-14 | 2012-02-29 | 无锡芯感智半导体有限公司 | 一种电容式mems压力传感器 |
| US20150060956A1 (en) * | 2013-09-03 | 2015-03-05 | Windtop Technology Corp. | Integrated mems pressure sensor with mechanical electrical isolation |
| TWI547181B (zh) * | 2015-02-12 | 2016-08-21 | 加高電子股份有限公司 | 微機電麥克風感測器及其製備方法 |
| CN108226235B (zh) * | 2016-12-21 | 2020-12-15 | 中国矿业大学 | 一种电容式mems气体传感器 |
| CN108419193B (zh) * | 2018-05-22 | 2024-03-08 | 上饶市经纬自动化科技有限公司 | 具有频率选择功能的电容式mems麦克风及其制作方法 |
-
2019
- 2019-05-31 CN CN201980087006.8A patent/CN113678472B/zh active Active
- 2019-05-31 WO PCT/CN2019/089601 patent/WO2020237651A1/zh active Application Filing
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070286438A1 (en) * | 2006-03-29 | 2007-12-13 | Yamaha Corporation | Condenser microphone |
| JP2011064688A (ja) * | 2010-10-18 | 2011-03-31 | Seiko Epson Corp | 微小電気機械装置、半導体装置、微小電気機械装置の製造方法、および半導体装置の製造方法 |
| CN104671186A (zh) * | 2013-11-27 | 2015-06-03 | 英飞凌科技股份有限公司 | Mems器件 |
| CN106465022A (zh) * | 2014-04-01 | 2017-02-22 | 罗伯特·博世有限公司 | Mems麦克风中的经掺杂的基板区 |
| CN105681990A (zh) * | 2014-11-19 | 2016-06-15 | 北京卓锐微技术有限公司 | 一种硅电容麦克风 |
| CN106303867A (zh) * | 2015-05-13 | 2017-01-04 | 无锡华润上华半导体有限公司 | Mems麦克风 |
| CN105142086A (zh) * | 2015-09-24 | 2015-12-09 | 歌尔声学股份有限公司 | 一种mems麦克风芯片、传声器和音频设备 |
| CN205283813U (zh) * | 2015-11-30 | 2016-06-01 | 歌尔声学股份有限公司 | 一种mems麦克风芯片及mems麦克风 |
| CN107176584A (zh) * | 2016-03-10 | 2017-09-19 | 英飞凌科技股份有限公司 | Mems器件和mems真空扩音器 |
| CN108467005A (zh) * | 2017-02-09 | 2018-08-31 | 英飞凌科技股份有限公司 | 半导体装置和用于形成半导体装置的方法 |
| CN108540911A (zh) * | 2017-03-01 | 2018-09-14 | 英飞凌科技股份有限公司 | Mems设备、声换能器、形成mems设备的方法以及操作mems设备的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113678472B (zh) | 2024-04-12 |
| WO2020237651A1 (zh) | 2020-12-03 |
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