JP5277571B2 - ノズル基板の製造方法及び液滴吐出ヘッドの製造方法 - Google Patents
ノズル基板の製造方法及び液滴吐出ヘッドの製造方法 Download PDFInfo
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- JP5277571B2 JP5277571B2 JP2007159811A JP2007159811A JP5277571B2 JP 5277571 B2 JP5277571 B2 JP 5277571B2 JP 2007159811 A JP2007159811 A JP 2007159811A JP 2007159811 A JP2007159811 A JP 2007159811A JP 5277571 B2 JP5277571 B2 JP 5277571B2
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- 239000000758 substrate Substances 0.000 title claims abstract description 152
- 238000004519 manufacturing process Methods 0.000 title claims description 27
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 67
- 239000010703 silicon Substances 0.000 claims abstract description 67
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 66
- 238000007599 discharging Methods 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 27
- 238000001312 dry etching Methods 0.000 claims description 20
- 238000000347 anisotropic wet etching Methods 0.000 claims description 14
- 230000001681 protective effect Effects 0.000 claims description 11
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 7
- 239000013078 crystal Substances 0.000 claims description 5
- 230000007423 decrease Effects 0.000 claims description 4
- 239000007788 liquid Substances 0.000 abstract description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 30
- 239000000853 adhesive Substances 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 15
- 238000005530 etching Methods 0.000 description 12
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 8
- 238000007254 oxidation reaction Methods 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 230000002940 repellent Effects 0.000 description 5
- 239000005871 repellent Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 230000005499 meniscus Effects 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
- 238000009616 inductively coupled plasma Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011344 liquid material Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 230000002068 genetic effect Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000002493 microarray Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- LEIGGMIFKQLBRP-UHFFFAOYSA-N tetraethyl silicate Chemical compound CCO[Si](OCC)(OCC)OCC.CCO[Si](OCC)(OCC)OCC LEIGGMIFKQLBRP-UHFFFAOYSA-N 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/1433—Structure of nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/162—Manufacturing of the nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007159811A JP5277571B2 (ja) | 2007-06-18 | 2007-06-18 | ノズル基板の製造方法及び液滴吐出ヘッドの製造方法 |
| US12/120,403 US8485640B2 (en) | 2007-06-18 | 2008-05-14 | Nozzle plate, droplet discharge head, method for manufacturing the same and droplet discharge device |
| CN2008101266702A CN101327682B (zh) | 2007-06-18 | 2008-06-17 | 喷嘴基板、液滴喷头及其制造方法、以及液滴喷出装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007159811A JP5277571B2 (ja) | 2007-06-18 | 2007-06-18 | ノズル基板の製造方法及び液滴吐出ヘッドの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008307838A JP2008307838A (ja) | 2008-12-25 |
| JP2008307838A5 JP2008307838A5 (enExample) | 2010-08-05 |
| JP5277571B2 true JP5277571B2 (ja) | 2013-08-28 |
Family
ID=40131879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007159811A Active JP5277571B2 (ja) | 2007-06-18 | 2007-06-18 | ノズル基板の製造方法及び液滴吐出ヘッドの製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8485640B2 (enExample) |
| JP (1) | JP5277571B2 (enExample) |
| CN (1) | CN101327682B (enExample) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009260313A (ja) * | 2008-03-26 | 2009-11-05 | Semiconductor Energy Lab Co Ltd | Soi基板の作製方法及び半導体装置の作製方法 |
| CN102202797A (zh) * | 2008-10-31 | 2011-09-28 | 富士胶卷迪马蒂克斯股份有限公司 | 成形喷嘴出口 |
| US8197029B2 (en) | 2008-12-30 | 2012-06-12 | Fujifilm Corporation | Forming nozzles |
| JP5623786B2 (ja) | 2009-05-22 | 2014-11-12 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | 薄膜蒸着装置 |
| JP5620146B2 (ja) | 2009-05-22 | 2014-11-05 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | 薄膜蒸着装置 |
| JP5328726B2 (ja) | 2009-08-25 | 2013-10-30 | 三星ディスプレイ株式會社 | 薄膜蒸着装置及びこれを利用した有機発光ディスプレイ装置の製造方法 |
| JP5677785B2 (ja) | 2009-08-27 | 2015-02-25 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法 |
| US8876975B2 (en) * | 2009-10-19 | 2014-11-04 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
| KR101084184B1 (ko) | 2010-01-11 | 2011-11-17 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 |
| KR101174875B1 (ko) | 2010-01-14 | 2012-08-17 | 삼성디스플레이 주식회사 | 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
| KR101193186B1 (ko) | 2010-02-01 | 2012-10-19 | 삼성디스플레이 주식회사 | 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
| KR101156441B1 (ko) | 2010-03-11 | 2012-06-18 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 |
| US8567910B2 (en) * | 2010-03-31 | 2013-10-29 | Fujifilm Corporation | Durable non-wetting coating on fluid ejector |
| KR101202348B1 (ko) | 2010-04-06 | 2012-11-16 | 삼성디스플레이 주식회사 | 박막 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법 |
| US8894458B2 (en) | 2010-04-28 | 2014-11-25 | Samsung Display Co., Ltd. | Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method |
| KR101223723B1 (ko) | 2010-07-07 | 2013-01-18 | 삼성디스플레이 주식회사 | 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
| KR101738531B1 (ko) | 2010-10-22 | 2017-05-23 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
| KR101723506B1 (ko) | 2010-10-22 | 2017-04-19 | 삼성디스플레이 주식회사 | 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
| KR20120045865A (ko) | 2010-11-01 | 2012-05-09 | 삼성모바일디스플레이주식회사 | 유기층 증착 장치 |
| KR20120065789A (ko) | 2010-12-13 | 2012-06-21 | 삼성모바일디스플레이주식회사 | 유기층 증착 장치 |
| KR101760897B1 (ko) | 2011-01-12 | 2017-07-25 | 삼성디스플레이 주식회사 | 증착원 및 이를 구비하는 유기막 증착 장치 |
| JP6024076B2 (ja) * | 2011-01-13 | 2016-11-09 | セイコーエプソン株式会社 | シリコンデバイスの製造方法 |
| KR101840654B1 (ko) | 2011-05-25 | 2018-03-22 | 삼성디스플레이 주식회사 | 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
| KR101852517B1 (ko) | 2011-05-25 | 2018-04-27 | 삼성디스플레이 주식회사 | 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
| KR101857249B1 (ko) | 2011-05-27 | 2018-05-14 | 삼성디스플레이 주식회사 | 패터닝 슬릿 시트 어셈블리, 유기막 증착 장치, 유기 발광 표시장치제조 방법 및 유기 발광 표시 장치 |
| KR101826068B1 (ko) | 2011-07-04 | 2018-02-07 | 삼성디스플레이 주식회사 | 유기층 증착 장치 |
| KR20130060500A (ko) * | 2011-11-30 | 2013-06-10 | 삼성전기주식회사 | 실리콘 기판, 이의 제조 방법 및 잉크젯 프린트 헤드 |
| JP6399862B2 (ja) * | 2014-08-29 | 2018-10-03 | キヤノン株式会社 | 液体吐出装置および液体吐出ヘッド |
| JP2017159565A (ja) * | 2016-03-10 | 2017-09-14 | セイコーエプソン株式会社 | 液体吐出ヘッド、および、液体吐出装置 |
| CN117136139A (zh) * | 2021-03-31 | 2023-11-28 | 柯尼卡美能达株式会社 | 喷嘴板的制造方法、喷嘴板及流体喷头 |
| CN117769495A (zh) * | 2021-07-27 | 2024-03-26 | 柯尼卡美能达株式会社 | 喷嘴板、液滴排出头、液滴排出装置及喷嘴板的制造方法 |
| US20250206022A1 (en) * | 2022-03-17 | 2025-06-26 | Konica Minolta, Inc. | Nozzle plate, droplet ejection head, droplet ejecting apparatus, and nozzle plate manufacturing method |
| WO2024063030A1 (ja) * | 2022-09-22 | 2024-03-28 | コニカミノルタ株式会社 | ノズルプレートの製造方法 |
| WO2024063031A1 (ja) * | 2022-09-22 | 2024-03-28 | コニカミノルタ株式会社 | ノズルプレート、液滴吐出ヘッド及び液滴吐出装置 |
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|---|---|---|---|---|
| JPS56135075A (en) | 1980-03-26 | 1981-10-22 | Ricoh Co Ltd | Nozzle plate |
| KR100311880B1 (ko) * | 1996-11-11 | 2001-12-20 | 미다라이 후지오 | 관통구멍의제작방법,관통구멍을갖는실리콘기판,이기판을이용한디바이스,잉크제트헤드의제조방법및잉크제트헤드 |
| JP3820747B2 (ja) | 1997-05-14 | 2006-09-13 | セイコーエプソン株式会社 | 噴射装置の製造方法 |
| JPH10315461A (ja) | 1997-05-14 | 1998-12-02 | Seiko Epson Corp | インクジェットヘッドおよびその製造方法 |
| BE1012219A3 (fr) * | 1998-10-05 | 2000-07-04 | Solvay | Catalyseur destine a la polymerisation des olefines, procede pour sa fabrication et utilisation. |
| JP2000203030A (ja) | 1999-01-08 | 2000-07-25 | Seiko Epson Corp | インクジェットヘッドの製造方法とインクジェットヘッドとインクジェットプリンタ |
| US6260957B1 (en) * | 1999-12-20 | 2001-07-17 | Lexmark International, Inc. | Ink jet printhead with heater chip ink filter |
| KR100499118B1 (ko) * | 2000-02-24 | 2005-07-04 | 삼성전자주식회사 | 단결정 실리콘 웨이퍼를 이용한 일체형 유체 노즐어셈블리 및 그 제작방법 |
| JP3800317B2 (ja) * | 2001-01-10 | 2006-07-26 | セイコーエプソン株式会社 | インクジェット式記録ヘッド及びインクジェット式記録装置 |
| CN1267261C (zh) * | 2003-09-23 | 2006-08-02 | 南京林业大学 | 一种制备异氰酸树脂农作物秸秆板防止热压粘板的脱模剂 |
| JP4665455B2 (ja) | 2004-08-09 | 2011-04-06 | 富士ゼロックス株式会社 | シリコン構造体製造方法、モールド金型製造方法、成形部材製造方法、シリコン構造体、インクジェット記録ヘッド、及び、画像形成装置 |
| JP4660683B2 (ja) * | 2005-07-28 | 2011-03-30 | セイコーエプソン株式会社 | ノズルプレートの製造方法及び液滴吐出ヘッドの製造方法 |
| JP2007320254A (ja) | 2006-06-02 | 2007-12-13 | Seiko Epson Corp | ノズルプレートの製造方法、ノズルプレート、液滴吐出ヘッドの製造方法、液滴吐出ヘッド、液滴吐出装置の製造方法及び液滴吐出装置 |
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2007
- 2007-06-18 JP JP2007159811A patent/JP5277571B2/ja active Active
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2008
- 2008-05-14 US US12/120,403 patent/US8485640B2/en active Active
- 2008-06-17 CN CN2008101266702A patent/CN101327682B/zh active Active
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| Publication number | Publication date |
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| JP2008307838A (ja) | 2008-12-25 |
| CN101327682A (zh) | 2008-12-24 |
| CN101327682B (zh) | 2011-07-13 |
| US8485640B2 (en) | 2013-07-16 |
| US20080309718A1 (en) | 2008-12-18 |
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