JP5270558B2 - S/temのサンプルを作成する方法およびサンプル構造 - Google Patents
S/temのサンプルを作成する方法およびサンプル構造 Download PDFInfo
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- JP5270558B2 JP5270558B2 JP2009533597A JP2009533597A JP5270558B2 JP 5270558 B2 JP5270558 B2 JP 5270558B2 JP 2009533597 A JP2009533597 A JP 2009533597A JP 2009533597 A JP2009533597 A JP 2009533597A JP 5270558 B2 JP5270558 B2 JP 5270558B2
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Images
Classifications
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- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/02—Devices for withdrawing samples
- G01N1/04—Devices for withdrawing samples in the solid state, e.g. by cutting
- G01N1/06—Devices for withdrawing samples in the solid state, e.g. by cutting providing a thin slice, e.g. microtome
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- G—PHYSICS
- G01—MEASURING; TESTING
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- G01N1/02—Devices for withdrawing samples
- G01N1/04—Devices for withdrawing samples in the solid state, e.g. by cutting
- G01N1/08—Devices for withdrawing samples in the solid state, e.g. by cutting involving an extracting tool, e.g. core bit
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
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- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/32—Polishing; Etching
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- H—ELECTRICITY
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
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- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
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- H—ELECTRICITY
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- H—ELECTRICITY
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- H—ELECTRICITY
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- H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
- H01J37/3056—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching for microworking, e. g. etching of gratings or trimming of electrical components
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- H—ELECTRICITY
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- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/204—Means for introducing and/or outputting objects
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- H—ELECTRICITY
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- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/208—Elements or methods for movement independent of sample stage for influencing or moving or contacting or transferring the sample or parts thereof, e.g. prober needles or transfer needles in FIB/SEM systems
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- H—ELECTRICITY
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
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- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/3174—Etching microareas
- H01J2237/31745—Etching microareas for preparing specimen to be viewed in microscopes or analyzed in microanalysers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31749—Focused ion beam
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Sampling And Sample Adjustment (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US85318306P | 2006-10-20 | 2006-10-20 | |
| US60/853,183 | 2006-10-20 | ||
| PCT/US2007/082163 WO2008049133A2 (en) | 2006-10-20 | 2007-10-22 | Method for creating s/tem sample and sample structure |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010507782A JP2010507782A (ja) | 2010-03-11 |
| JP2010507782A5 JP2010507782A5 (enExample) | 2012-12-20 |
| JP5270558B2 true JP5270558B2 (ja) | 2013-08-21 |
Family
ID=39314878
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009533597A Active JP5270558B2 (ja) | 2006-10-20 | 2007-10-22 | S/temのサンプルを作成する方法およびサンプル構造 |
| JP2009533596A Active JP5410286B2 (ja) | 2006-10-20 | 2007-10-22 | S/temのサンプルを作成する方法およびサンプル構造 |
| JP2009533599A Active JP5959139B2 (ja) | 2006-10-20 | 2007-10-22 | S/temのサンプルを分析する方法 |
| JP2012248393A Active JP5628882B2 (ja) | 2006-10-20 | 2012-11-12 | S/temのサンプルを作成する方法およびサンプル構造 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009533596A Active JP5410286B2 (ja) | 2006-10-20 | 2007-10-22 | S/temのサンプルを作成する方法およびサンプル構造 |
| JP2009533599A Active JP5959139B2 (ja) | 2006-10-20 | 2007-10-22 | S/temのサンプルを分析する方法 |
| JP2012248393A Active JP5628882B2 (ja) | 2006-10-20 | 2012-11-12 | S/temのサンプルを作成する方法およびサンプル構造 |
Country Status (4)
| Country | Link |
|---|---|
| US (9) | US8134124B2 (enExample) |
| EP (3) | EP2106555B1 (enExample) |
| JP (4) | JP5270558B2 (enExample) |
| WO (3) | WO2008051937A2 (enExample) |
Families Citing this family (87)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2106555B1 (en) | 2006-10-20 | 2015-01-07 | FEI Company | Method for s/tem sample analysis |
| WO2008051880A2 (en) | 2006-10-20 | 2008-05-02 | Fei Company | Method and apparatus for sample extraction and handling |
| US8835845B2 (en) | 2007-06-01 | 2014-09-16 | Fei Company | In-situ STEM sample preparation |
| US7880151B2 (en) | 2008-02-28 | 2011-02-01 | Fei Company | Beam positioning for beam processing |
| EP2151848A1 (en) | 2008-08-07 | 2010-02-10 | FEI Company | Method of machining a work piece with a focused particle beam |
| CN102272878B (zh) * | 2008-10-31 | 2014-07-23 | Fei公司 | 样本厚度的测量和终点确定 |
| DE102009008063A1 (de) | 2009-02-09 | 2010-08-19 | Carl Zeiss Nts Gmbh | Teilchenstrahlsystem |
| DE102009008166A1 (de) | 2009-02-10 | 2010-09-02 | Carl Zeiss Nts Gmbh | Verfahren zur Abscheidung von Schutzstrukturen |
| EP2233907A1 (en) * | 2009-03-27 | 2010-09-29 | FEI Company | Forming an image while milling a work piece |
| JP5537058B2 (ja) * | 2009-03-30 | 2014-07-02 | 株式会社日立ハイテクノロジーズ | 試料作製装置、及び試料作製装置における制御方法 |
| DE102009036701A1 (de) | 2009-08-07 | 2011-03-03 | Carl Zeiss Nts Gmbh | Teilchenstrahlsystem und Untersuchungsverfahren hierzu |
| KR101854287B1 (ko) * | 2010-04-07 | 2018-05-03 | 에프이아이 컴파니 | 레이저 및 하전 입자 빔 시스템 결합 |
| KR20110114026A (ko) * | 2010-04-12 | 2011-10-19 | 삼성전자주식회사 | 시편 제조 장치 및 방법 |
| US8721907B2 (en) * | 2010-10-31 | 2014-05-13 | Camtek Ltd. | Method and system for milling and imaging an object |
| JP5480110B2 (ja) | 2010-11-22 | 2014-04-23 | 株式会社日立ハイテクノロジーズ | イオンミリング装置及びイオンミリング加工方法 |
| JP5973466B2 (ja) | 2011-01-28 | 2016-08-23 | エフ・イ−・アイ・カンパニー | Tem試料の調製 |
| US8912490B2 (en) | 2011-06-03 | 2014-12-16 | Fei Company | Method for preparing samples for imaging |
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| US8859963B2 (en) | 2011-06-03 | 2014-10-14 | Fei Company | Methods for preparing thin samples for TEM imaging |
| CN102426119A (zh) * | 2011-08-25 | 2012-04-25 | 上海华碧检测技术有限公司 | 一种小尺寸晶圆样品结构截面观察的样品制备方法 |
| JP5858702B2 (ja) * | 2011-09-20 | 2016-02-10 | 株式会社日立ハイテクサイエンス | 複合荷電粒子ビーム装置 |
| SG11201402475YA (en) * | 2011-11-29 | 2014-06-27 | Kla Tencor Corp | Systems and methods for preparation of samples for sub-surface defect review |
| CN103946684B (zh) | 2011-12-01 | 2017-06-23 | Fei 公司 | 用于横截面视图薄层的背侧打薄的高吞吐量tem制备工艺和硬件 |
| JP6062628B2 (ja) * | 2011-12-08 | 2017-01-18 | 株式会社日立ハイテクサイエンス | 薄膜試料作製装置及び方法 |
| EP2610889A3 (en) | 2011-12-27 | 2015-05-06 | Fei Company | Drift control in a charged particle beam system |
| EP2813280B1 (en) * | 2012-02-09 | 2020-04-01 | Toyobo Co., Ltd. | Hollow fiber semipermeable membrane, method for manufacturing same, module, and water treatment method |
| JP6085150B2 (ja) * | 2012-03-16 | 2017-02-22 | 株式会社日立ハイテクサイエンス | 試料作製装置及び試料作製方法 |
| JP6188792B2 (ja) * | 2012-05-21 | 2017-08-30 | エフ・イ−・アイ・カンパニー | Tem観察用の薄片の調製 |
| CN104428867B (zh) * | 2012-07-16 | 2018-10-16 | Fei 公司 | 用于聚焦离子束处理的终点确定 |
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| US8884247B2 (en) * | 2012-09-25 | 2014-11-11 | Fei Company | System and method for ex situ analysis of a substrate |
| JP5887247B2 (ja) * | 2012-10-15 | 2016-03-16 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置および試料作製法 |
| US8912488B2 (en) | 2012-11-15 | 2014-12-16 | Fei Company | Automated sample orientation |
| CN103822806B (zh) * | 2012-11-16 | 2016-06-29 | 中芯国际集成电路制造(上海)有限公司 | Tem样品的制备方法 |
| US8895923B2 (en) | 2012-11-20 | 2014-11-25 | Dcg Systems, Inc. | System and method for non-contact microscopy for three-dimensional pre-characterization of a sample for fast and non-destructive on sample navigation during nanoprobing |
| TWI461653B (zh) * | 2013-02-06 | 2014-11-21 | Inotera Memories Inc | 測量樣本尺寸的方法 |
| US8729469B1 (en) | 2013-03-15 | 2014-05-20 | Fei Company | Multiple sample attachment to nano manipulator for high throughput sample preparation |
| US9857318B2 (en) * | 2013-03-19 | 2018-01-02 | Carl Zeiss Microscopy Gmbh | Method for generating image data relating to an object and particle beam device for carrying out this method |
| US9040908B2 (en) * | 2013-06-28 | 2015-05-26 | Fei Company | Plan view sample preparation |
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