JP5248240B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP5248240B2 JP5248240B2 JP2008213553A JP2008213553A JP5248240B2 JP 5248240 B2 JP5248240 B2 JP 5248240B2 JP 2008213553 A JP2008213553 A JP 2008213553A JP 2008213553 A JP2008213553 A JP 2008213553A JP 5248240 B2 JP5248240 B2 JP 5248240B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- layer
- sealing layer
- semiconductor device
- antenna
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/08—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/08—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means
- G06K19/10—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means at least one kind of marking being used for authentication, e.g. of credit or identity cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Thin Film Transistor (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008213553A JP5248240B2 (ja) | 2007-08-30 | 2008-08-22 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007223342 | 2007-08-30 | ||
| JP2007223342 | 2007-08-30 | ||
| JP2008213553A JP5248240B2 (ja) | 2007-08-30 | 2008-08-22 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009076065A JP2009076065A (ja) | 2009-04-09 |
| JP2009076065A5 JP2009076065A5 (enExample) | 2011-07-28 |
| JP5248240B2 true JP5248240B2 (ja) | 2013-07-31 |
Family
ID=40406131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008213553A Expired - Fee Related JP5248240B2 (ja) | 2007-08-30 | 2008-08-22 | 半導体装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7759788B2 (enExample) |
| JP (1) | JP5248240B2 (enExample) |
| KR (1) | KR101545650B1 (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1970951A3 (en) * | 2007-03-13 | 2009-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| EP2372756A1 (en) * | 2007-03-13 | 2011-10-05 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device and manufacturing method thereof |
| JP2008246104A (ja) * | 2007-03-30 | 2008-10-16 | Angel Shoji Kk | Rfidを内蔵したゲームカードおよびその製造方法 |
| CN101803008B (zh) | 2007-09-07 | 2012-11-28 | 株式会社半导体能源研究所 | 半导体装置及其制造方法 |
| US8284557B2 (en) * | 2007-10-18 | 2012-10-09 | Kyocera Corporation | Circuit board, mounting structure, and method for manufacturing circuit board |
| JP2009205669A (ja) * | 2008-01-31 | 2009-09-10 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| JP5460108B2 (ja) * | 2008-04-18 | 2014-04-02 | 株式会社半導体エネルギー研究所 | 半導体装置及び半導体装置の作製方法 |
| CN102057488B (zh) * | 2008-06-06 | 2013-09-18 | 株式会社半导体能源研究所 | 半导体装置的制造方法 |
| JP2010041040A (ja) * | 2008-07-10 | 2010-02-18 | Semiconductor Energy Lab Co Ltd | 光電変換装置および光電変換装置の製造方法 |
| WO2010005064A1 (en) * | 2008-07-10 | 2010-01-14 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and electronic device |
| WO2010032573A1 (en) | 2008-09-17 | 2010-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| WO2010032611A1 (en) * | 2008-09-19 | 2010-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| WO2010035625A1 (en) * | 2008-09-25 | 2010-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Semi conductor device |
| WO2010035627A1 (en) * | 2008-09-25 | 2010-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| WO2010140539A1 (en) * | 2009-06-05 | 2010-12-09 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and method for manufacturing the same |
| WO2010140522A1 (en) * | 2009-06-05 | 2010-12-09 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and manufacturing method thereof |
| KR101677076B1 (ko) * | 2009-06-05 | 2016-11-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 광전 변환 디바이스 및 그 제조 방법 |
| TWI517268B (zh) * | 2009-08-07 | 2016-01-11 | 半導體能源研究所股份有限公司 | 端子構造的製造方法和電子裝置的製造方法 |
| JP5719560B2 (ja) * | 2009-10-21 | 2015-05-20 | 株式会社半導体エネルギー研究所 | 端子構造の作製方法 |
| CN102804360B (zh) | 2009-12-25 | 2014-12-17 | 株式会社半导体能源研究所 | 半导体装置 |
| EP3124236A1 (en) | 2011-06-17 | 2017-02-01 | Fiberweb, Inc. | Vapor permeable, substantially water impermeable multilayer article |
| WO2012177996A2 (en) | 2011-06-23 | 2012-12-27 | Fiberweb, Inc. | Vapor permeable, substantially water impermeable multilayer article |
| WO2012178027A2 (en) | 2011-06-23 | 2012-12-27 | Fiberweb, Inc. | Vapor-permeable, substantially water-impermeable multilayer article |
| WO2012178011A2 (en) | 2011-06-24 | 2012-12-27 | Fiberweb, Inc. | Vapor-permeable, substantially water-impermeable multilayer article |
| DE102013210668A1 (de) * | 2013-06-07 | 2014-12-11 | Würth Elektronik GmbH & Co. KG | Verfahren zur Herstellung eines optischen Moduls |
| US10081894B2 (en) | 2014-05-23 | 2018-09-25 | Avery Dennison Retail Information Services, Llc | Merchandise tags incorporating a durable antenna |
| CN109808280B (zh) * | 2018-12-27 | 2021-11-05 | 浙江华正新材料股份有限公司 | 一种芳纶布高强度高柔韧性覆铜板的制备方法 |
Family Cites Families (72)
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|---|---|---|---|---|
| JPH0633020B2 (ja) * | 1988-03-04 | 1994-05-02 | シチズン時計株式会社 | 樹脂封止方法 |
| KR930003894B1 (ko) | 1989-01-25 | 1993-05-15 | 아사히가세이고오교가부시끼가이샤 | 신규한 프리프레그와 복합 성형체, 및 복합 성형체의 제조방법 |
| DE3907757A1 (de) | 1989-03-10 | 1990-09-13 | Mtu Muenchen Gmbh | Schutzfolie |
| JPH05190582A (ja) | 1992-01-08 | 1993-07-30 | Oki Electric Ind Co Ltd | 樹脂封止半導体装置及びその製造方法 |
| JP3024399B2 (ja) | 1992-11-13 | 2000-03-21 | 松下電器産業株式会社 | 半導体集積回路 |
| JP3523718B2 (ja) | 1995-02-06 | 2004-04-26 | 株式会社ルネサステクノロジ | 半導体装置 |
| JP3364081B2 (ja) | 1995-02-16 | 2003-01-08 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US5757456A (en) | 1995-03-10 | 1998-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method of fabricating involving peeling circuits from one substrate and mounting on other |
| CN1107922C (zh) | 1995-06-16 | 2003-05-07 | 罗姆股份有限公司 | 半导体器件,使用同样器件的ic卡和通信系统 |
| JPH1092980A (ja) | 1996-09-13 | 1998-04-10 | Toshiba Corp | 無線カードおよびその製造方法 |
| JPH10181261A (ja) * | 1996-12-20 | 1998-07-07 | Dainippon Printing Co Ltd | 非接触icカード |
| US6329213B1 (en) * | 1997-05-01 | 2001-12-11 | Micron Technology, Inc. | Methods for forming integrated circuits within substrates |
| JPH10307898A (ja) | 1997-05-09 | 1998-11-17 | Toppan Printing Co Ltd | 充電式非接触icカードシステム |
| JP3646472B2 (ja) | 1997-05-19 | 2005-05-11 | 株式会社日立製作所 | 非接触型icカードおよび送受信回路 |
| JP3566056B2 (ja) | 1997-12-26 | 2004-09-15 | セイコーインスツルメンツ株式会社 | 電子機器 |
| US6414318B1 (en) | 1998-11-06 | 2002-07-02 | Bridge Semiconductor Corporation | Electronic circuit |
| JP2004078991A (ja) | 1998-12-17 | 2004-03-11 | Hitachi Ltd | 半導体装置およびその製造方法 |
| TW484101B (en) | 1998-12-17 | 2002-04-21 | Hitachi Ltd | Semiconductor device and its manufacturing method |
| US6224965B1 (en) * | 1999-06-25 | 2001-05-01 | Honeywell International Inc. | Microfiber dielectrics which facilitate laser via drilling |
| JP4423779B2 (ja) | 1999-10-13 | 2010-03-03 | 味の素株式会社 | エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法 |
| US6509217B1 (en) | 1999-10-22 | 2003-01-21 | Damoder Reddy | Inexpensive, reliable, planar RFID tag structure and method for making same |
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| JP3835968B2 (ja) * | 2000-03-06 | 2006-10-18 | 松下電器産業株式会社 | 半導体集積回路 |
| JP3614747B2 (ja) | 2000-03-07 | 2005-01-26 | Necエレクトロニクス株式会社 | 昇圧回路、それを搭載したicカード及びそれを搭載した電子機器 |
| US20020049714A1 (en) * | 2000-05-11 | 2002-04-25 | Shunpei Yamazaki | Communication system |
| CA2411358C (en) * | 2000-06-14 | 2007-02-13 | Hyperion Catalysis International, Inc. | Multilayered polymeric structure |
| JP2002231545A (ja) | 2001-02-02 | 2002-08-16 | Matsushita Electric Ind Co Ltd | 非接触電源装置 |
| JP3905418B2 (ja) | 2001-05-18 | 2007-04-18 | セイコーインスツル株式会社 | 電源装置および電子機器 |
| JP2003006592A (ja) | 2001-06-21 | 2003-01-10 | Matsushita Electric Ind Co Ltd | 情報送受信装置 |
| US8415208B2 (en) * | 2001-07-16 | 2013-04-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and peeling off method and method of manufacturing semiconductor device |
| JP2003070187A (ja) | 2001-08-27 | 2003-03-07 | Toshiba Eng Co Ltd | 非接触データキャリア装置並びに内蔵二次電池の充電方法 |
| JP2003123033A (ja) | 2001-10-12 | 2003-04-25 | Nec Eng Ltd | Icチップ及びそれを用いる商品管理システム並びに商品管理方法 |
| US6737302B2 (en) | 2001-10-31 | 2004-05-18 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method for field-effect transistor |
| KR100430001B1 (ko) * | 2001-12-18 | 2004-05-03 | 엘지전자 주식회사 | 다층기판의 제조방법, 그 다층기판의 패드 형성방법 및 그다층기판을 이용한 반도체 패키지의 제조방법 |
| JP3915092B2 (ja) | 2002-01-21 | 2007-05-16 | 株式会社エフ・イー・シー | Icカード用のブースタアンテナ |
| JP4007932B2 (ja) | 2002-03-19 | 2007-11-14 | 株式会社タキオン | マイクロ波送電法、マイクロ波受電装置及びidタグシステム |
| JP2003299255A (ja) | 2002-04-02 | 2003-10-17 | Nippon Telegr & Teleph Corp <Ntt> | 携帯型充電装置 |
| US7485489B2 (en) * | 2002-06-19 | 2009-02-03 | Bjoersell Sten | Electronics circuit manufacture |
| AU2003253227A1 (en) | 2002-06-19 | 2004-01-06 | Sten Bjorsell | Electronics circuit manufacture |
| JP2004023765A (ja) * | 2002-06-20 | 2004-01-22 | Sanyo Electric Co Ltd | 無線型データ伝送装置 |
| JP2004064937A (ja) | 2002-07-31 | 2004-02-26 | Nec Corp | チャージポンプ型昇圧回路 |
| JP4719852B2 (ja) * | 2002-10-18 | 2011-07-06 | シンボル テクノロジーズ, インコーポレイテッド | パッシブrfidタグの不必要な再交渉を最小化するためのシステムおよび方法 |
| JP4015008B2 (ja) * | 2002-11-21 | 2007-11-28 | 株式会社ルネサステクノロジ | 通信用半導体集積回路および無線通信システム |
| US7652359B2 (en) * | 2002-12-27 | 2010-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Article having display device |
| JP2004343410A (ja) | 2003-05-15 | 2004-12-02 | Hitachi Maxell Ltd | 非接触通信式情報担体 |
| JP4828088B2 (ja) | 2003-06-05 | 2011-11-30 | 凸版印刷株式会社 | Icタグ |
| JP3902769B2 (ja) * | 2003-08-29 | 2007-04-11 | 松下電器産業株式会社 | 降圧電圧出力回路 |
| US7737658B2 (en) * | 2003-10-27 | 2010-06-15 | Sony Corporation | Battery packs having a charging mode and a discharging mode |
| JP2005229098A (ja) | 2003-12-12 | 2005-08-25 | Semiconductor Energy Lab Co Ltd | 半導体装置及び半導体装置の作製方法 |
| US7768405B2 (en) * | 2003-12-12 | 2010-08-03 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device and manufacturing method thereof |
| US7494066B2 (en) | 2003-12-19 | 2009-02-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2005210843A (ja) | 2004-01-23 | 2005-08-04 | Toyota Motor Corp | 電力供給システム、車載電源装置及び路側電源装置 |
| JP2005235615A (ja) * | 2004-02-20 | 2005-09-02 | Hitachi Maxell Ltd | アダプタパネル、電子機器、及びケーブルコネクタ認識システム |
| JP2005252853A (ja) | 2004-03-05 | 2005-09-15 | Fec Inc | Rf−id用アンテナ |
| US20050233122A1 (en) * | 2004-04-19 | 2005-10-20 | Mikio Nishimura | Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein |
| JP2005316724A (ja) | 2004-04-28 | 2005-11-10 | Matsushita Electric Works Ltd | アクティブ型rfidタグ |
| JP2005321911A (ja) | 2004-05-07 | 2005-11-17 | Dainippon Printing Co Ltd | 発光素子付き透明icカード |
| JP2005352434A (ja) | 2004-05-11 | 2005-12-22 | Seiko Epson Corp | 電気光学装置、電気光学装置の製造方法および電子機器 |
| JP4611093B2 (ja) * | 2004-05-12 | 2011-01-12 | セイコーインスツル株式会社 | 電波発電回路 |
| JP2006004015A (ja) | 2004-06-15 | 2006-01-05 | Ts Photon:Kk | バッテリーレス型プログラム制御可能な論理回路付きrfid応答器 |
| JP2006024087A (ja) * | 2004-07-09 | 2006-01-26 | Nec Corp | 無線デバイス、その製造方法、その検査方法及び検査装置並びに無線装置及びその製造方法 |
| CN101084616B (zh) | 2004-09-09 | 2012-06-27 | 株式会社半导体能源研究所 | 无线芯片 |
| JP2006180073A (ja) | 2004-12-21 | 2006-07-06 | Okayama Prefecture | 無線icタグ |
| JP4541246B2 (ja) | 2004-12-24 | 2010-09-08 | トッパン・フォームズ株式会社 | 非接触icモジュール |
| JP2006293690A (ja) | 2005-04-11 | 2006-10-26 | Sanyo Electric Co Ltd | 集積回路及び無線icタグ |
| JP4864649B2 (ja) * | 2005-11-11 | 2012-02-01 | 株式会社半導体エネルギー研究所 | 機能性を有する層、及びそれを有する可撓性基板の形成方法、並びに半導体装置の作製方法 |
| JP4831312B2 (ja) * | 2006-01-17 | 2011-12-07 | 大日本印刷株式会社 | 非接触icタグの製造方法 |
| WO2007105607A1 (en) * | 2006-03-10 | 2007-09-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| CN101385039B (zh) | 2006-03-15 | 2012-03-21 | 株式会社半导体能源研究所 | 半导体器件 |
| TWI431726B (zh) | 2006-06-01 | 2014-03-21 | Semiconductor Energy Lab | 非揮發性半導體記憶體裝置 |
| CN101479747B (zh) | 2006-06-26 | 2011-05-18 | 株式会社半导体能源研究所 | 包括半导体器件的纸及其制造方法 |
| KR101349880B1 (ko) | 2006-10-02 | 2014-01-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 |
-
2008
- 2008-08-22 JP JP2008213553A patent/JP5248240B2/ja not_active Expired - Fee Related
- 2008-08-26 KR KR1020080083443A patent/KR101545650B1/ko not_active Expired - Fee Related
- 2008-08-29 US US12/230,484 patent/US7759788B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009076065A (ja) | 2009-04-09 |
| KR101545650B1 (ko) | 2015-08-19 |
| US20090057875A1 (en) | 2009-03-05 |
| KR20090023175A (ko) | 2009-03-04 |
| US7759788B2 (en) | 2010-07-20 |
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Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110609 |
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