KR101545650B1 - 반도체장치 - Google Patents

반도체장치 Download PDF

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Publication number
KR101545650B1
KR101545650B1 KR1020080083443A KR20080083443A KR101545650B1 KR 101545650 B1 KR101545650 B1 KR 101545650B1 KR 1020080083443 A KR1020080083443 A KR 1020080083443A KR 20080083443 A KR20080083443 A KR 20080083443A KR 101545650 B1 KR101545650 B1 KR 101545650B1
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KR
South Korea
Prior art keywords
resin
layer
semiconductor device
chip
semiconductor element
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020080083443A
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English (en)
Korean (ko)
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KR20090023175A (ko
Inventor
토모유키 아오키
타쿠야 츠루메
히로키 아다치
히사시 오타니
Original Assignee
가부시키가이샤 한도오따이 에네루기 켄큐쇼
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Publication of KR20090023175A publication Critical patent/KR20090023175A/ko
Application granted granted Critical
Publication of KR101545650B1 publication Critical patent/KR101545650B1/ko
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/08—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/08—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means
    • G06K19/10—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means at least one kind of marking being used for authentication, e.g. of credit or identity cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Thin Film Transistor (AREA)
  • Formation Of Insulating Films (AREA)
KR1020080083443A 2007-08-30 2008-08-26 반도체장치 Expired - Fee Related KR101545650B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00223342 2007-08-30
JP2007223342 2007-08-30

Publications (2)

Publication Number Publication Date
KR20090023175A KR20090023175A (ko) 2009-03-04
KR101545650B1 true KR101545650B1 (ko) 2015-08-19

Family

ID=40406131

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080083443A Expired - Fee Related KR101545650B1 (ko) 2007-08-30 2008-08-26 반도체장치

Country Status (3)

Country Link
US (1) US7759788B2 (enExample)
JP (1) JP5248240B2 (enExample)
KR (1) KR101545650B1 (enExample)

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EP1970951A3 (en) * 2007-03-13 2009-05-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
EP2372756A1 (en) * 2007-03-13 2011-10-05 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device and manufacturing method thereof
JP2008246104A (ja) * 2007-03-30 2008-10-16 Angel Shoji Kk Ｒｆｉｄを内蔵したゲームカードおよびその製造方法
CN101803008B (zh) 2007-09-07 2012-11-28 株式会社半导体能源研究所 半导体装置及其制造方法
US8284557B2 (en) * 2007-10-18 2012-10-09 Kyocera Corporation Circuit board, mounting structure, and method for manufacturing circuit board
JP2009205669A (ja) * 2008-01-31 2009-09-10 Semiconductor Energy Lab Co Ltd 半導体装置
JP5460108B2 (ja) * 2008-04-18 2014-04-02 株式会社半導体エネルギー研究所 半導体装置及び半導体装置の作製方法
CN102057488B (zh) * 2008-06-06 2013-09-18 株式会社半导体能源研究所 半导体装置的制造方法
JP2010041040A (ja) * 2008-07-10 2010-02-18 Semiconductor Energy Lab Co Ltd 光電変換装置および光電変換装置の製造方法
WO2010005064A1 (en) * 2008-07-10 2010-01-14 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and electronic device
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WO2010032611A1 (en) * 2008-09-19 2010-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
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WO2010035627A1 (en) * 2008-09-25 2010-04-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2010140539A1 (en) * 2009-06-05 2010-12-09 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and method for manufacturing the same
WO2010140522A1 (en) * 2009-06-05 2010-12-09 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and manufacturing method thereof
KR101677076B1 (ko) * 2009-06-05 2016-11-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 광전 변환 디바이스 및 그 제조 방법
TWI517268B (zh) * 2009-08-07 2016-01-11 半導體能源研究所股份有限公司 端子構造的製造方法和電子裝置的製造方法
JP5719560B2 (ja) * 2009-10-21 2015-05-20 株式会社半導体エネルギー研究所 端子構造の作製方法
CN102804360B (zh) 2009-12-25 2014-12-17 株式会社半导体能源研究所 半导体装置
EP3124236A1 (en) 2011-06-17 2017-02-01 Fiberweb, Inc. Vapor permeable, substantially water impermeable multilayer article
WO2012177996A2 (en) 2011-06-23 2012-12-27 Fiberweb, Inc. Vapor permeable, substantially water impermeable multilayer article
WO2012178027A2 (en) 2011-06-23 2012-12-27 Fiberweb, Inc. Vapor-permeable, substantially water-impermeable multilayer article
WO2012178011A2 (en) 2011-06-24 2012-12-27 Fiberweb, Inc. Vapor-permeable, substantially water-impermeable multilayer article
DE102013210668A1 (de) * 2013-06-07 2014-12-11 Würth Elektronik GmbH & Co. KG Verfahren zur Herstellung eines optischen Moduls
US10081894B2 (en) 2014-05-23 2018-09-25 Avery Dennison Retail Information Services, Llc Merchandise tags incorporating a durable antenna
CN109808280B (zh) * 2018-12-27 2021-11-05 浙江华正新材料股份有限公司 一种芳纶布高强度高柔韧性覆铜板的制备方法

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JP2009076065A (ja) 2009-04-09
JP5248240B2 (ja) 2013-07-31
US20090057875A1 (en) 2009-03-05
KR20090023175A (ko) 2009-03-04
US7759788B2 (en) 2010-07-20

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