JP5224630B2 - 接着剤の硬化促進方法 - Google Patents
接着剤の硬化促進方法 Download PDFInfo
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- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
- B29C65/36—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction
- B29C65/3604—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint
- B29C65/3608—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint comprising single particles, e.g. fillers or discontinuous fibre-reinforcements
- B29C65/3612—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint comprising single particles, e.g. fillers or discontinuous fibre-reinforcements comprising fillers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/481—Non-reactive adhesives, e.g. physically hardening adhesives
- B29C65/4815—Hot melt adhesives, e.g. thermoplastic adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/4835—Heat curing adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
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- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/484—Moisture curing adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/485—Multi-component adhesives, i.e. chemically curing as a result of the mixing of said multi-components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4855—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by their physical properties, e.g. being electrically-conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4865—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives
- B29C65/487—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their shape, e.g. being fibres or being spherical
- B29C65/4875—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their shape, e.g. being fibres or being spherical being spherical, e.g. particles or powders
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
- B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/16—Fillers
- B29K2105/162—Nanoparticles
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Description
本発明は、交番磁界を用いて、粒子を充填した接着剤組成物を加熱する方法に関する。本発明は、交番磁界を用いて、粒子を充填した接着剤を加熱することによって、金属および非金属材料を結合する方法にも関する。
多くの産業分野において、特に金属加工産業、例えば自動車産業において、多用途車の製造および関連する供給産業において、または機械および家庭用電気器具の製造において、および建設産業において、同じかまたは異なる金属および非金属基材を接着剤またはシーラントによって接合させることが多くなっている。結合/封止は多くの技術的利益を与えるので、構成要素を接合させるこの方法は、リベット締め、ネジ締めまたは溶接のような従来の接合法にますます取って代わりつつある。これは特に、金属をプラスチックおよび/または複合材料に接合する場合、または異なる金属を接合する場合、例えば鋼部品をアルミニウムまたはマグネシウム部品に接合する場合のような、組成の異なる材料を接合する場合に言えることである。
この先行技術背景に対して、本発明が解決しようとする課題は、接着剤を加熱するのに必要とされる熱に、電磁線を効果的に変換し、接着剤の特性に不利な影響を与えない方法を提供することである。
・ ナノスケール超常磁性粒子を含有する接着剤組成物を、場合によっては清浄化および/または表面処理の後に、接合させる基材表面の少なくとも1つに適用し;
・ 接着剤組成物が接合させる基材間にあるように基材を合わせ;
・ 交番磁界で加熱することによって接着剤組成物を硬化する。
・ ナノスケール超常磁性粒子を含有する接着剤組成物を、場合によっては清浄化および/または表面処理の後に、接合させる基材表面の少なくとも1つに適用し;
・ 交番磁界によって接着剤組成物を加熱し;
・ 接着剤組成物が接合させる基材間にあるように基材を合わす。
熱接着剤に対するナノスケール粒子の作用を調べる試験は、Henkel KGaAから入手できる3種類の熱可塑性ホットメルト接着剤を用いて行った。該ホットメルト接着剤は、標準的なエチレン/酢酸ビニルに基づく接着剤(Technomelt Q 3118;EVA1)、ならびに中耐熱性(Macromelt 6208;PA1)および高耐熱性(改質ポリアミド;PA2)の2種類のポリアミドに基づく接着剤であった。非改質接着剤の特徴的接着性または材料特性の選択を、表1に示す。
1.25℃で開始;、
2.10分間で25℃〜50℃に加熱;
3.5時間で50℃〜200℃に加熱;
4.200℃で20分間維持;
5.20分間で25℃に冷却。
改質接着剤の誘導加熱性に対する「信号受容体」粒子径の影響
基本的に、ナノスケールの「信号受容体」だけでなく、より大きい粒子径の信号受容体も、ポリマーマトリックスの誘導加熱に好適である。しかし、ここでは詳しく説明しない他の加熱メカニズムの結果として、ナノスケール粒子を使用した場合に導入しうるエネルギーの量は、大きい粒子を使用した場合よりかなり多い。これは、例えば改質ポリエステル系(Dynacoll 7360, Huels)を使用して行われる対応する試験によって示しうる。必要とされる交番磁界は、Huettinger TIG5/300発生器によって発生させた。加えた電圧は180Vであった。使用したコイルは、直径3.5cmおよび10巻きを有していた。それは、振動を発生する発振器回路の一部であった。上記電圧および寸法において、約250KHzの周波数を得た。実施例10および比較例から、本発明によってナノスケール充填剤を接着剤マトリックス中の「信号受容体」として使用する場合、「粗い」磁鉄鉱粒子を使用する場合よりかなり短い時間で、かなり高い温度に、改質ポリエステルを加熱することが明らかである。試験の結果を表4に示す。
改質接着剤の誘導加熱性に対する「信号受容体」充填レベルの影響
交番磁界における改質接着剤の加熱挙動は、使用される信号受容体の充填レベルにかなり依存する。例として磁鉄鉱改質EVA1を使用して、対応する試験を行った。必要とされた交番磁界は、Huettinger TIG5/300発生器を使用して発生させた。適用した電圧は180Vであった。使用したコイルは、直径3.5cmおよび10巻きを有していた。
試験の結果を表5に示す。
改質接着剤の誘導加熱性に対する交番磁界の強度の影響
磁鉄鉱改質接着剤の誘電加熱における重大な因子は、適用される磁界の強度である。コイルに生じる磁界の強度は、適用される電圧または流れる電流に特に依存する。種々の電圧の作用を測定する試験を、Huettinger TIG5/300発生器を使用して行った。適用した最大電圧は180Vであった。使用したコイルは、直径3.5cmおよび10巻きを有していた。実施例8の組成物を接着剤として使用した。結果を表6に示す。
改質接着剤の誘導加熱性に対するコイル形状の影響
交番磁界の磁界強度は、適用される電圧だけでなく、使用されるコイルの長さおよび巻き数にも依存する。定電圧において、種々の周波数または強度の磁界が、コイルの長さおよび巻き数に応じて得られる。180Vの最大定電圧において対応する試験を行った。20重量%の磁鉄鉱で改質したPA2を接着剤ベースとして使用した。使用したコイルは、3.5cmの定直径を有し、巻き数が異なっていた。これらの試験の結果を表7に示す。
Claims (13)
- 交番磁界によって接着剤組成物を加熱する方法であって、1〜100nmの平均粒子径を有するナノスケール超常磁性粒子を含有する接着剤組成物を加熱し、
・ 熱可塑性接着剤の場合は、熱可塑性結合剤の軟化点より高い温度に加熱し、
・ 反応性接着剤の場合は、結合剤マトリックスが結合剤の反応性基によって架橋される温度に加熱する、
ことを特徴とする方法。
- ナノスケール粒子が、3〜50nmの平均粒子径を有することを特徴とする請求項1に記載の方法。
- ナノスケール超常磁性粒子が、アルミニウム、コバルト、鉄、ニッケルまたはそれらの合金、n−磁赤鉄鉱型(γ−Fe2O3)およびn−磁鉄鉱型(Fe3O4)の金属酸化物または一般式:MeFe2O4のフェライト[式中、Meは、マンガン、銅、亜鉛、コバルト、ニッケル、マグネシウム、カルシウムまたはカドミウムから選択される二価の金属を表す]から選択されることを特徴とする請求項1または2に記載の方法。
- ナノスケール粒子が、全組成物に基づいて1〜30重量%の量で存在する請求項1〜3のいずれかに記載の方法。
- 接着剤組成物を暴露させる交番磁界が、50kHz〜300GHzの周波数を有することを特徴とする請求項1〜4のいずれかに記載の方法。
- 周波数が50kHz〜300MHzであることを特徴とする請求項5に記載の方法。
- 周波数が300MHz〜300GHzであることを特徴とする請求項5に記載の方法。
- 熱可塑性接着剤組成物が、エチレン/酢酸ビニルコポリマー、ポリブテン、スチレン/イソプレン/スチレンまたはスチレン/ブタジエン/スチレンコポリマー、熱可塑性エラストマー、非晶質ポリオレフィン、線状熱可塑性ポリウレタン、コポリエステル、ポリアミド樹脂、ポリアミド/EVAコポリマー、ダイマー脂肪酸に基づくポリアミノアミド、ポリエステルアミド、ポリエーテルアミド、またはPVCホモポリマーおよび/またはコポリマーに基づくプラスチゾル、(メタ)アクリレートホモ−および/またはコポリマーまたはスチレンコポリマーおよび可塑剤に基づくことを特徴とする請求項1に記載の方法。
- 反応性接着剤組成物が、一または二成分ポリウレタン、一または二成分ポリエポキシド、シリコーンポリマー、シラン改質ポリマー、一または二成分反応性ゴムまたは一成分ポリウレタンおよび表面失活固体ポリイソシアネートに基づくことを特徴とする請求項1に記載の方法。
- 非金属材料および/または複合材料を結合する方法であって、
・ 1〜100nmの平均粒子径を有するナノスケール超常磁性粒子を含有する接着剤組成物を、接合させる基材表面の少なくとも1つに適用し;
・ 接着剤組成物が接合させる基材間にあるように基材を合わせ;
・ 交番磁界により加熱することによって接着剤組成物を硬化する
工程を含んで成る方法。
- 金属材料および/または複合材料を接合する方法であって、
・ 1〜100nmの平均粒子径を有するナノスケール超常磁性粒子を含有する接着剤組成物を、接合させる基材表面の少なくとも1つに適用し;
・ 交番磁界により接着剤組成物を加熱し;
・ 接着剤組成物が接合させる基材間にあるように基材を合わせる
工程を含んで成る方法。
- 硬化を2段階で行い、第一段階において、熱予備硬化によるかまたは紫外線照射によって、接着剤マトリックスを部分的にのみ硬化し、次の段階において、交番磁界によって充分に硬化することを特徴とする請求項10または11に記載の方法。
- 硬化を2段階で行い、第一段階において、交番磁界によって接着剤マトリックスを部分的にのみ硬化し、次の段階において、熱硬化、湿分硬化または紫外線照射によって充分に硬化することを特徴とする請求項10または11に記載の方法。
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DE10037884A DE10037884A1 (de) | 2000-08-03 | 2000-08-03 | Verfahren zur beschleunigten Klebstoffaushärtung |
DE10037884.6 | 2000-08-03 | ||
PCT/EP2001/008600 WO2002012409A1 (de) | 2000-08-03 | 2001-07-25 | Verfahren zur beschleunigten klebstoffaushärtung |
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JP2004506065A JP2004506065A (ja) | 2004-02-26 |
JP2004506065A5 JP2004506065A5 (ja) | 2008-09-11 |
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JP2002517702A Expired - Fee Related JP5224630B2 (ja) | 2000-08-03 | 2001-07-25 | 接着剤の硬化促進方法 |
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US (1) | US7147742B2 (ja) |
EP (1) | EP1305376B1 (ja) |
JP (1) | JP5224630B2 (ja) |
AR (1) | AR030114A1 (ja) |
AT (1) | ATE277138T1 (ja) |
AU (1) | AU2001279785A1 (ja) |
DE (2) | DE10037884A1 (ja) |
ES (1) | ES2227248T3 (ja) |
WO (1) | WO2002012409A1 (ja) |
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- 2000-08-03 DE DE10037884A patent/DE10037884A1/de not_active Ceased
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2001
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- 2001-07-25 JP JP2002517702A patent/JP5224630B2/ja not_active Expired - Fee Related
- 2001-07-25 AT AT01958019T patent/ATE277138T1/de active
- 2001-07-25 ES ES01958019T patent/ES2227248T3/es not_active Expired - Lifetime
- 2001-07-25 EP EP01958019A patent/EP1305376B1/de not_active Expired - Lifetime
- 2001-07-25 WO PCT/EP2001/008600 patent/WO2002012409A1/de active IP Right Grant
- 2001-07-25 US US10/343,297 patent/US7147742B2/en not_active Expired - Fee Related
- 2001-07-25 DE DE50103784T patent/DE50103784D1/de not_active Expired - Lifetime
- 2001-08-03 AR ARP010103709A patent/AR030114A1/es not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP1305376B1 (de) | 2004-09-22 |
US20030168640A1 (en) | 2003-09-11 |
AR030114A1 (es) | 2003-08-13 |
US7147742B2 (en) | 2006-12-12 |
ES2227248T3 (es) | 2005-04-01 |
AU2001279785A1 (en) | 2002-02-18 |
JP2004506065A (ja) | 2004-02-26 |
DE10037884A1 (de) | 2002-02-21 |
DE50103784D1 (de) | 2004-10-28 |
EP1305376A1 (de) | 2003-05-02 |
WO2002012409A1 (de) | 2002-02-14 |
ATE277138T1 (de) | 2004-10-15 |
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