JP5196703B2 - 接着フィルム - Google Patents

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Publication number
JP5196703B2
JP5196703B2 JP2004007492A JP2004007492A JP5196703B2 JP 5196703 B2 JP5196703 B2 JP 5196703B2 JP 2004007492 A JP2004007492 A JP 2004007492A JP 2004007492 A JP2004007492 A JP 2004007492A JP 5196703 B2 JP5196703 B2 JP 5196703B2
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JP
Japan
Prior art keywords
resin layer
resin
temperature
connection
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004007492A
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English (en)
Japanese (ja)
Other versions
JP2005200521A (ja
JP2005200521A5 (enrdf_load_stackoverflow
Inventor
憲明 工藤
恭志 阿久津
秀次 波木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2004007492A priority Critical patent/JP5196703B2/ja
Priority to TW093139608A priority patent/TWI265188B/zh
Priority to PCT/JP2004/019527 priority patent/WO2005068573A1/ja
Priority to KR1020067014078A priority patent/KR101151133B1/ko
Publication of JP2005200521A publication Critical patent/JP2005200521A/ja
Publication of JP2005200521A5 publication Critical patent/JP2005200521A5/ja
Application granted granted Critical
Publication of JP5196703B2 publication Critical patent/JP5196703B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
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    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • C09J11/02—Non-macromolecular additives
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    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
JP2004007492A 2004-01-15 2004-01-15 接着フィルム Expired - Lifetime JP5196703B2 (ja)

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TW093139608A TWI265188B (en) 2004-01-15 2004-12-20 Adhesive films and method for manufacturing adhesive film
PCT/JP2004/019527 WO2005068573A1 (ja) 2004-01-15 2004-12-27 接着フィルム、接着フィルムの製造方法
KR1020067014078A KR101151133B1 (ko) 2004-01-15 2004-12-27 접착 필름, 및 접착 필름의 제조 방법

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Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4735229B2 (ja) * 2005-12-12 2011-07-27 住友ベークライト株式会社 異方導電性フィルム
WO2009001605A1 (ja) * 2007-06-26 2008-12-31 Sony Chemical & Information Device Corporation 異方性導電材料、接続構造体及びその製造方法
JP5093482B2 (ja) 2007-06-26 2012-12-12 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電材料、接続構造体及びその製造方法
JP5311772B2 (ja) * 2007-06-27 2013-10-09 デクセリアルズ株式会社 接着フィルム
JP2009194359A (ja) * 2008-01-16 2009-08-27 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法
KR102121724B1 (ko) * 2009-08-05 2020-06-11 아지노모토 가부시키가이샤 필름
JP5631654B2 (ja) 2010-07-28 2014-11-26 デクセリアルズ株式会社 実装体の製造方法及び接続方法
JP5369163B2 (ja) * 2011-10-19 2013-12-18 三菱電機株式会社 絶縁シートおよび半導体装置
EP2781568B1 (en) * 2011-11-14 2018-02-21 LG Chem, Ltd. Adhesive film and method for encapsulating organic electronic device using same
US9490048B2 (en) * 2012-03-29 2016-11-08 Cam Holding Corporation Electrical contacts in layered structures
EP2851406A4 (en) 2012-05-14 2015-12-23 Lg Chemical Ltd METHOD FOR PRODUCING AN ADHESIVE ARTICLE
JP5880283B2 (ja) * 2012-05-29 2016-03-08 富士通セミコンダクター株式会社 半導体装置の製造方法
JP2015079586A (ja) * 2013-10-15 2015-04-23 デクセリアルズ株式会社 異方性導電フィルム
US20150371916A1 (en) * 2014-06-23 2015-12-24 Rohm And Haas Electronic Materials Llc Pre-applied underfill
WO2016114314A1 (ja) 2015-01-13 2016-07-21 デクセリアルズ株式会社 異方導電性フィルム
TWI691977B (zh) * 2015-05-27 2020-04-21 日商迪睿合股份有限公司 異向導電性膜及連接構造體
JP6750197B2 (ja) * 2015-07-13 2020-09-02 デクセリアルズ株式会社 異方性導電フィルム及び接続構造体
KR102786355B1 (ko) * 2016-01-29 2025-03-24 가부시끼가이샤 레조낙 접착제 필름 및 그의 제조 방법, 접착제 테이프, 및 접착제 필름용 릴
TW202234983A (zh) * 2021-01-19 2022-09-01 日商昭和電工材料股份有限公司 導電性構件、電子裝置之製造方法、連接結構體及電子裝置
KR20230056826A (ko) * 2021-10-20 2023-04-28 에이치엔에스하이텍 (주) 도전입자의 유동성을 제어한 이방도전성 접착필름
KR20230056827A (ko) * 2021-10-20 2023-04-28 에이치엔에스하이텍 (주) 도전입자의 유동성을 제어한 이방도전성 접착필름의 제조방법

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61195179A (ja) * 1985-02-25 1986-08-29 Matsushita Electric Ind Co Ltd 異方導電性接着シ−ト
JPH01236588A (ja) * 1988-03-17 1989-09-21 Matsushita Electric Ind Co Ltd 異方導電性接着体
JPH03107888A (ja) * 1989-09-21 1991-05-08 Sharp Corp 回路基板の接続構造
JPH04366630A (ja) * 1991-06-13 1992-12-18 Sharp Corp 異方性導電接着テープ
JPH0645024A (ja) * 1992-07-22 1994-02-18 Hitachi Chem Co Ltd 異方導電性接着フィルム
JPH079821B2 (ja) * 1993-03-25 1995-02-01 日本黒鉛工業株式会社 三層構造異方性導電膜部材の製造方法
JPH07224252A (ja) * 1994-02-10 1995-08-22 Hitachi Chem Co Ltd 絶縁接着材料シート及び銅箔付き絶縁接着材料シート並びにその製造法とそれを用いた多層配線板の製造法
JPH07230840A (ja) * 1994-02-17 1995-08-29 Hitachi Chem Co Ltd 接続部材及びこれを用いた電極の接続構造
JP4032439B2 (ja) * 1996-05-23 2008-01-16 日立化成工業株式会社 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
JPH08279388A (ja) * 1995-04-04 1996-10-22 Idemitsu Kosan Co Ltd 電気回路の接続方法
EP0914027B1 (en) * 1996-07-15 2002-10-09 Hitachi Chemical Company, Ltd. Film-like adhesive for connecting circuit and circuit board
US6583834B1 (en) * 1997-02-27 2003-06-24 Seiko Epson Corporation Adhesive, liquid crystal device, process for manufacturing liquid crystal device, and electronic equipment
JP3871082B2 (ja) * 1997-03-28 2007-01-24 日立化成工業株式会社 フィルム状接着剤及び回路板の製造法
JP3678547B2 (ja) * 1997-07-24 2005-08-03 ソニーケミカル株式会社 多層異方導電性接着剤およびその製造方法
JP2000290613A (ja) * 1999-04-13 2000-10-17 Hitachi Chem Co Ltd 熱硬化性接着シート
JP2001052778A (ja) * 1999-08-06 2001-02-23 Hitachi Chem Co Ltd 異方導電性接着フィルムおよびその製造方法
JP3372511B2 (ja) * 1999-08-09 2003-02-04 ソニーケミカル株式会社 半導体素子の実装方法及び実装装置
JP4696360B2 (ja) * 2000-12-28 2011-06-08 日立化成工業株式会社 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP2002358825A (ja) * 2001-05-31 2002-12-13 Hitachi Chem Co Ltd 異方導電性接着フィルム
JP3912244B2 (ja) * 2002-09-24 2007-05-09 住友電気工業株式会社 異方導電膜
JP2004006417A (ja) * 2003-08-22 2004-01-08 Hitachi Chem Co Ltd 接続部材及びこれを用いた電極の接続構造

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KR101151133B1 (ko) 2012-06-01
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TW200525004A (en) 2005-08-01
WO2005068573A1 (ja) 2005-07-28
KR20060123491A (ko) 2006-12-01

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