WO2016114314A1 - 異方導電性フィルム - Google Patents
異方導電性フィルム Download PDFInfo
- Publication number
- WO2016114314A1 WO2016114314A1 PCT/JP2016/050858 JP2016050858W WO2016114314A1 WO 2016114314 A1 WO2016114314 A1 WO 2016114314A1 JP 2016050858 W JP2016050858 W JP 2016050858W WO 2016114314 A1 WO2016114314 A1 WO 2016114314A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- anisotropic conductive
- conductive
- conductive film
- conductive particles
- film
- Prior art date
Links
- 239000002245 particle Substances 0.000 claims abstract description 239
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- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 2
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- 150000001875 compounds Chemical class 0.000 description 2
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 2
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 241001422033 Thestylus Species 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- KQNZLOUWXSAZGD-UHFFFAOYSA-N benzylperoxymethylbenzene Chemical compound C=1C=CC=CC=1COOCC1=CC=CC=C1 KQNZLOUWXSAZGD-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
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- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
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- 239000002923 metal particle Substances 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
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- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
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Images
Classifications
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
Definitions
- the present invention relates to an anisotropic conductive film.
- Anisotropic conductive films are widely used when electronic parts such as IC chips are mounted on a substrate.
- insulating adhesives for anisotropic conductive films are used. It has been proposed that conductive particles be evenly arranged in a lattice shape in the layer, in particular, that conductive particles having a particle diameter of 5 ⁇ m or less be used and the arrangement be inclined at a predetermined angle with respect to the longitudinal direction of the anisotropic conductive film. (Patent Document 1).
- a ceramic module substrate is often used because of its excellent electrical insulation and thermal insulation (patents) Reference 2).
- the terminals on the ceramic substrate are obtained through sintering of a terminal pattern formed by printing, the height of the terminals themselves may vary.
- the problem is that the particle trapping property differs between the terminals on the ridges of the swell and the terminals on the recesses, and the conduction characteristics vary. Occurred. This is because the conductive particles on the terminals on the undulations are swept away when the resin forming the insulating adhesive layer melts and flows during anisotropic conductive connection, and is difficult to be captured by the terminals.
- this swell depends on the method of manufacturing the ceramic substrate, as an example, the height is 20 to 50 ⁇ m and the wavelength is several hundred ⁇ m or more.
- the problem of waviness is not limited to the ceramic substrate, but the height of the electrode surface such as an FR4 substrate (glass epoxy substrate) varies depending on the base material.
- the maximum height difference of the height variation of the electrode surface is 2 to 2 3 ⁇ m.
- the heating and pressurizing condition of the anisotropic conductive connection is set to a higher temperature and pressure, but since the image sensor and the lens are mounted on the module substrate, It is necessary to perform anisotropic conductive connection under low temperature and low pressure conditions of a temperature of 190 ° C. or lower and a pressure of 2 MPa or lower.
- the present invention provides an anisotropic conductive material that can be connected with stable conduction characteristics even with a terminal formed on a substrate having a undulation on the surface, such as a ceramic module substrate, or a terminal whose electrode surface itself has a height variation.
- the issue is to provide a protective film.
- the present inventor has made the conductive particles regularly arranged in the insulating adhesive layer larger than the conductive particle diameter of the anisotropic conductive film used for a fine pitch terminal such as COG (chip-on-glass), and further anisotropically.
- the present invention has been conceived by finding that the above-mentioned problems can be solved by defining the relationship between the thickness of the conductive film and the conductive particle diameter, and also defining the position of the conductive particles in the film thickness direction.
- the present invention is an anisotropic conductive film comprising an insulating adhesive layer and conductive particles regularly arranged in plan view on the insulating adhesive layer, the conductive particle diameter being 10 ⁇ m or more, and the thickness of the film
- the anisotropic conductive film having a thickness equal to or more than 3.5 times the conductive particle diameter and having a variation width of the position of the conductive particles in the thickness direction of the film is less than 10% of the conductive particle diameter.
- the present invention also provides a connection structure in which the first electronic component and the second electronic component are anisotropically conductively connected with the anisotropic conductive film described above.
- each connection terminal exhibits good conduction characteristics even when a camera module using a ceramic substrate is connected.
- FIG. 1A is a plan view of the anisotropic conductive film 1A of the example.
- FIG. 1B is a cross-sectional view of the anisotropic conductive film 1A of the example.
- FIG. 2 is a plan view of the anisotropic conductive film 1B of the example.
- FIG. 3 is a cross-sectional view of the anisotropic conductive film 1C of the example.
- FIG. 4 is a cross-sectional view of the anisotropic conductive film 1D of the example.
- FIG. 5 is a cross-sectional view of the anisotropic conductive film 1E of the example.
- FIG. 6A is a cross-sectional view of the camera module.
- FIG. 6B is a plan view of the terminal formation surface of the camera module.
- FIG. 7 is a plan view of the anisotropic conductive film 1F of the example.
- FIG. 8 is an explanatory view of a method for measuring the waviness of the ceramic substrate.
- FIG. 9 is a profile of the surface irregularities of the ceramic substrate.
- FIG. 10A is a plan view of the evaluation connection structure.
- FIG. 10B is a cross-sectional view of the evaluation connection structure.
- FIG. 1A is a plan view of an anisotropic conductive film 1A according to an embodiment of the present invention
- FIG. 1B is a cross-sectional view thereof.
- This anisotropic conductive film 1A is generally formed by arranging conductive particles 2 having a predetermined particle diameter regularly in a lattice pattern on the insulating adhesive layer 3, and having a predetermined film thickness.
- the particle diameter of the conductive particles 2 (that is, the conductive particle diameter D) is stable not only when the surface of the substrate to be connected is flat, but also when the surface is wavy like a ceramic module substrate.
- the thickness is 10 ⁇ m or more, preferably 15 ⁇ m or more, more preferably 20 ⁇ m or more.
- the conductive particles 2 are preferably 50 ⁇ m or less, more preferably 30 ⁇ m or less.
- the conductive particle diameter D means the average particle diameter of the conductive particles 2.
- the conductive particles 2 are regularly arranged on the insulating adhesive layer 3 in plan view, and in the anisotropic conductive film 1A of this embodiment, the conductive particles 2 are arranged in a square lattice in plan view.
- the regular arrangement of the conductive particles 2 only needs to be regularly arranged so that the planar arrangement of the conductive particles does not vary in density. For example, when 10 regions having an area of 1 mm ⁇ 1 mm are extracted in the longitudinal direction of the film and the particle density of the conductive particles in each region is measured, the difference between the maximum value and the minimum value of the particle density is the particle density in each region. Less than 20% of the average.
- the conductive particles may be arranged in a rhombic lattice, a rectangular lattice, a hexagonal lattice, or the like. By arranging them regularly in this way, even if the connection surface on which the terminals are formed has waviness, the conductive particles are easily captured by the terminals, and the occurrence of poor conduction and short-circuits can be significantly reduced. Further, when the electronic components are aligned and connected by the alignment mark, even if the alignment mark is displaced due to the undulation of the substrate surface, the conductive particles are captured by the terminal, and conduction can be ensured.
- the terminal when a portion having a low particle density of the conductive particles is disposed on the terminal on the undulation of the module substrate at the time of anisotropic conductive connection, the terminal The upper conductive particles flow, and the density of the particles in that portion is further reduced, the number of trapped conductive particles at the terminal is reduced, and continuity failure tends to occur.
- the conductive particles 2 are arranged in a lattice, it is preferable to tilt the lattice axis with respect to the longitudinal direction of the anisotropic conductive film from the viewpoint of stabilizing the particle trapping property at the terminal.
- the angle ⁇ formed by the lattice axis and the film longitudinal direction is preferably 10 to 40 °.
- position the electrically-conductive particle 2 so that the electrically-conductive particle 2a, 2b in an adjacent lattice axis may overlap in the film longitudinal direction from the point which improves the particle capture property in a terminal.
- the distance between the centers of adjacent conductive particles closest to each other is 1.2 to 100 times the conductive particle diameter D.
- the ratio is 1.5 to 80 times.
- the thickness L2 of the anisotropic conductive film 1A is equal to or greater than the conductive particle diameter D and equal to or less than 3.5 times, preferably equal to or less than 3.0 times, more preferably equal to or less than 2.5 times, and still more preferably conductive. It is 1.1 times or more and 2.3 times or less of the particle diameter D. If the thickness L2 of the anisotropic conductive film 1A is too thick, the resin forming the insulating adhesive layer 3 may protrude from the anisotropically connected portion, or the conduction stability of the terminal may decrease.
- the anisotropic conductive film is formed into a long length, wound on a reel and stored, there arises a problem that the insulating adhesive layer protrudes from the wound anisotropic conductive film.
- the thickness L2 of the anisotropic conductive film 1A is too thin, the formation surfaces of the terminals to be anisotropically conductive cannot be sufficiently bonded to each other, and particularly when the formation surfaces of the terminals have waviness. It becomes difficult to securely bond the undulating recesses.
- the thickness L2 of the anisotropic conductive film 1A is close to 3.5 times or less, preferably 3.0 times or less, more preferably 2.5 times or less of the conductive particle diameter D.
- the resin flow at the time of anisotropic conductive connection is relatively reduced by bringing the thickness L2 of the anisotropic conductive film 1A and the conductive particle diameter D close to each other, the anisotropic conductive film of the present invention is used.
- the ability to capture conductive particles at a terminal is improved not only when connecting a substrate without waviness (such as a glass substrate).
- the variation width of the positions of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter D.
- the variation width is different from the surface 1y on the adjacent side. It is measured as the variation width of the distance L4 with each conductive particle 2, and in other cases, it is measured as the variation width of the distance between any one surface and each conductive particle.
- 100 conductive particles 2 are extracted continuously in the longitudinal direction of the film, and the difference ⁇ L4 between the maximum value and the minimum value when the distance L4 is measured for each conductive particle 2 is obtained.
- the ratio of the variation width ⁇ L4 to the conductive particle diameter is a ratio of the variation width ⁇ L4 and the average conductive particle diameter D.
- the variation width ⁇ L4 is usually 5 ⁇ m or less, preferably 3 ⁇ m or less, more preferably 2 ⁇ m or less.
- the distance L3 between the surface 1x on the side where the conductive particles 2 are separated and the conductive particles 2 out of the two front and back surfaces of the anisotropic conductive film 1A is preferably 10% or more of the conductive particle diameter D. .
- the anisotropic conductive film is the first of the two electronic components to be anisotropically connected to the surface 1y on the side where the conductive particles are close, of the two surfaces of the anisotropic conductive film 1A. It is preferable to make an anisotropic conductive connection toward the electronic component to be attached. For example, when an anisotropic conductive connection is made between a flexible printed board having no waviness on the connection surface and a ceramic substrate having waviness, the surface 1y of the anisotropic conductive film is directed to the ceramic substrate having waviness.
- the stability of the indentation is improved, and the deflection of the substrate can be absorbed by the insulating adhesive layer 3 in the entire film, so that the conduction characteristics can be greatly improved.
- the variation width of the distance L4 is less than 10% of the conductive particle diameter D, but the variation width of the distance L3 may not be less than 10% of the conductive particle diameter.
- the conductive particle 2 is anisotropically conductive as shown in FIG. You may make it contact
- each conductive particle 2 is close to one surface 1y of the anisotropic conductive film 1A. More specifically, the distance L4 between the surface 1y of the anisotropic conductive film 1A and the conductive particles 2 is preferably less than equal to the conductive particle diameter D, and more preferably within 30% of the particle diameter. .
- the conductive particles 2 may be arranged flush with the surface 1y of the anisotropic conductive film 1A. In particular, when the thickness of the film is larger than 2.5 times the particle diameter, the resin flow at the time of pushing becomes relatively large. Therefore, it is preferable to provide the conductive particles in the vicinity of the terminal from the viewpoint of capturing properties.
- the structure of the conductive particles 2 itself can be appropriately selected from those used in known anisotropic conductive films.
- Examples thereof include metal particles such as nickel, cobalt, silver, copper, gold and palladium, and metal-coated resin particles obtained by metal-coating core resin particles. Two or more kinds can be used in combination.
- the metal coating of the metal-coated resin particles can be formed using a known metal film forming method such as an electroless plating method or a sputtering method.
- the core resin particles may be formed only from a resin, or conductive particles may be dispersed in order to improve conduction reliability.
- an insulating resin layer used in a known anisotropic conductive film can be appropriately employed.
- a cationic polymerization type resin layer, a thermal anion polymerization type resin layer containing an epoxy compound and a thermal anion polymerization initiator, or the like can be used.
- these resin layers can be polymerized as necessary.
- the insulating adhesive layer 3 may be formed from a single resin layer or a plurality of resin layers.
- the insulating adhesive layer 3 may be added with an insulating filler such as silica fine particles, alumina, or aluminum hydroxide as necessary.
- the blending amount of the insulating filler is preferably 3 to 40 parts by mass with respect to 100 parts by mass of the resin forming the insulating adhesive layer.
- the tackiness of the insulating adhesive layer 3 is preferably high. This is to improve the sticking property with the substrate with waviness.
- the distance L3 between the conductive particle 2 and one film surface 1x cannot be 10% or more of the conductive particle diameter D, it is strongly required to improve the tackiness of the insulating adhesive layer 3.
- the minimum melt viscosity of the insulating adhesive layer 3 (the total minimum melt viscosity when the anisotropic conductive film is formed of a multilayer resin layer) can accurately arrange the conductive particles, Further, from the point that it is possible to prevent the resin flow from hindering the trapping property of the conductive particles due to the indentation at the time of anisotropic conductive connection, 100 to 30000 Pa ⁇ s is preferable, 500 to 20000 Pa ⁇ s is more preferable, and 1000 is particularly preferable. ⁇ 10000 Pa ⁇ s. Using a rotary rheometer (TA Instruments), the temperature is measured at 10 ° C./min, the measurement pressure is constant 5 g, and the measurement plate diameter is 8 mm.
- the conductive particles 2 may be arranged.
- Resin mold in which unevenness is reversed by making a mold with corresponding convex parts on a flat metal plate by machining, laser processing, photolithography, etc., filling the mold with curable resin and curing Then, this resin mold is used as a microcavity for conductive particles, conductive particles are placed in the recesses, the composition for forming an insulating adhesive layer is filled thereon, cured, and taken out from the mold.
- a resin layer for forming an insulating adhesive layer may be further laminated on the resin layer taken out from the mold, if necessary.
- the conductive particles can be kept at the bottom of the mold by separately performing the process of filling the mold with the conductive particles and the process of filling and peeling the insulating adhesive layer into the mold. Variation width in the thickness direction can be suppressed.
- the conductive particles are arranged in the above-mentioned mold. Filling, filling the composition for forming an insulating adhesive layer thereon, curing it, taking it out of the mold, and then pressing the conductive particles into the insulating adhesive layer to form the insulating adhesive layer into a single layer It is preferable.
- the anisotropic conductive film of the present invention can take various forms.
- the insulating adhesive layer 3 is formed from the adhesive layer 4 and the UV cured layer 5 as in the anisotropic conductive film 1D shown in FIG.
- Each conductive particle 2 is disposed so as to contact the surface of the UV cured layer 5.
- a tack layer 6 is provided on the UV cured layer 5.
- the adhesive layer 4 and the tack layer 6 can be formed from the above-described resin layer that is polymerized by heat or light.
- the UV cured layer 5 makes it possible to perform anisotropic conductive connection of the conductive particles 2 at a lower temperature by UV curing a UV curable resin. Thereby, it can respond also to the board
- substrate for example, plastic substrate etc.
- the tack layer 6 is a resin layer having tackiness.
- the presence of the tack layer 6 can prevent the anisotropic conductive film from being displaced at the time of anisotropic conductive connection even if the formation surface of the terminal is wavy.
- anisotropic conductive film is connected after aligning the anisotropic conductive film so that the conductive particle arrangement region of the anisotropic conductive film corresponds to the formation position of the terminal of the electronic component or the substrate, in particular, This effect is remarkable.
- the tack layer 6 can be formed by laminating an insulating adhesive on the conductive particles 2 held by the adhesive layer 4 and the UV cured layer 5.
- the minimum melt viscosity of the insulating adhesive layer 3 is the same as the case where the insulating adhesive layer 3 exists as a single layer as the resin layer of the anisotropic conductive film.
- the minimum melt viscosity preferably has a relationship of adhesive layer 4 ⁇ UV cured layer 5 ⁇ tack layer 6.
- the adhesive layer 4 has a melt viscosity at 80 ° C. of preferably 3000 Pa ⁇ s or less, more preferably 1000 Pa ⁇ s.
- the melt viscosity of the UV cured layer 5 is preferably 1000 to 20000 Pa ⁇ s at 80 ° C., more preferably 3000 to 15000 Pa ⁇ s.
- the melt viscosity of the tack layer 6 is preferably 1000 to 20000 Pa ⁇ s at 80 ° C., more preferably 3000 to 15000 Pa ⁇ s.
- These viscosities are numerical values measured using, for example, a rotary rheometer (TA Instruments) under the conditions of a heating rate of 10 ° C./min, a constant measurement pressure of 5 g, and a measurement plate diameter of 8 mm.
- the adhesive layer 4 may be provided on both front and back surfaces of the insulating adhesive layer 3 to which the conductive particles 2 are fixed. Thereby, even when the bump thickness of the electronic component to be anisotropically connected is thick, the resin can be filled between the bumps, so that the anisotropic conductive connection can be satisfactorily performed.
- an alignment mark for an electronic component to be anisotropically connected can be formed as necessary.
- a lens 12, an optical filter 13, and a chip 14 such as a CMOS are mounted on a ceramic substrate 11.
- the terminals 15 are arranged along the sides and the alignment marks 16 are formed in the vicinity of the two corners, and the flexible printed circuit board is anisotropically conductively connected to the terminal formation surface, the anisotropic conductivity shown in FIG.
- the conductive particle arrangement region 2A in which the conductive particles are arranged in a lattice shape is formed so as to correspond to the arrangement region of the terminals 15, and the alignment mark 7 is formed at a position corresponding to the alignment mark 16 of the ceramic substrate 11.
- the alignment mark 7 can be formed by arranging the alignment mark particles.
- the alignment mark particles the same conductive particles as the conductive particles 2 for conductive connection can be used.
- the particle diameter of the alignment mark particles is smaller than the particle size of the conductive particles 2, for example, The conductive particle diameter may be 1/5 to 1/3.
- the conductive particles are regularly arranged at the time of manufacturing the anisotropic conductive film.
- a mold having a recess (microcavity for alignment mark) smaller than a mold having a recess (conductive particle microcavity) used for the formation of the conductive mark is first put into this cavity, and then Put particles for alignment mark in. Since the alignment mark microcavity is smaller than the diameter of the conductive particle for conductive connection, the conductive particle for conductive connection does not enter the microcavity for alignment mark.
- the composition for forming an insulating adhesive layer is filled on the microcavities and cured, and then removed from the cavities.
- an anisotropic conductive film having the alignment mark 7 can be manufactured.
- the anisotropic conductive film 1 ⁇ / b> F is formed with the alignment mark 7 separated from the conductive particle arrangement region 2 ⁇ / b> A and provided with a margin 8. This facilitates cutting when the anisotropic conductive film 1F is used for anisotropic conductive connection.
- the alignment mark may be formed by locally curing an insulating binder by laser irradiation or the like.
- the anisotropic conductive film 1A is used for anisotropic conductive connection between a connection terminal of a first electronic component such as a flexible substrate or a glass substrate and a connection terminal of a second electronic component such as a camera module, IC module, or IC chip. can do.
- a connection terminal of a first electronic component such as a flexible substrate or a glass substrate
- a connection terminal of a second electronic component such as a camera module, IC module, or IC chip.
- a connection terminal of a first electronic component such as a flexible substrate or a glass substrate
- a connection terminal of a second electronic component such as a camera module, IC module, or IC chip.
- the present invention includes a connection structure in which the first electronic component and the second electronic component are anisotropically conductively connected using the anisotropic conductive film of the present invention.
- the first electronic component is a wiring board.
- the second electronic component is a camera module.
- an insulating adhesive layer 60 parts by mass of phenoxy resin (Nippon Steel & Sumikin Chemical Co., Ltd., YP-50), microcapsule type latent curing agent (Asahi Kasei E-Materials Co., Ltd., NovaCure HX3941HP)
- An anionic epoxy resin composition was prepared from 40 parts by mass and 20 parts by mass of silica filler (Nippon Aerosil Co., Ltd., AEROSIL R200), applied on a PET film having a film thickness of 50 ⁇ m, and then heated in an oven at 80 ° C. After drying for a minute, an adhesive layer made of an insulating resin was formed on the PET film.
- a mold having a density shown in Table 1A and Table 1B and a pattern of convex lattices in a tetragonal lattice is prepared by cutting a nickel plate, and the pellets of a known transparent resin are melted.
- the resin mold having the pattern shown in the same table was formed by pouring into a mold, cooling and solidifying.
- the resin-shaped recess was filled with conductive particles, and the above-mentioned insulating resin adhesive layer was placed thereon, and ultraviolet rays were irradiated to cure the curable resin contained in the insulating resin.
- insulating resin was peeled from the type
- the anisotropic conductive films of Comparative Examples 2 to 6 in which conductive particles are randomly dispersed are dispersed by stirring the conductive particles and the insulating resin with a rotation / revolution mixer (Sinky Co., Ltd.). And was produced by forming a coating of the dispersion.
- the waviness of the terminal formation surface of this ceramic substrate was measured using a surface roughness meter (Surfcoder SE-400, manufactured by Kosaka Laboratory Ltd.). In this case, the stylus of the surface roughness meter was scanned in the direction of arrangement of the terminals 15 on the ceramic substrate 11 as indicated by arrows in FIG. This profile is shown in FIG.
- the ceramic substrate used in each example and comparative example had the same degree of undulation.
- connection structure For each connection structure, (a) trapping efficiency of conductive particles (Ave, Min), (b) conduction resistance, (c) conduction reliability, (d) insulation evaluation 1 (of conductive particles spanning the entire space between terminals (Continuous), (e) Insulation evaluation 2 (continuous of 50 ⁇ m or more of conductive particles in the space between terminals), (f) Particle position in the film thickness direction, (g) Adhesiveness, (h) Adhesive strength, (i) The protrusion evaluation and (j) overall evaluation were evaluated as follows. These results are shown in Tables 1A and 1B.
- A Conductive particle capture efficiency (Ave, Min) By removing the flexible printed circuit board from the connection structure and observing the flexible printed circuit board and the ceramic substrate, each of the 1000 terminals of the undulating convex portion and the recessed terminal of the ceramic substrate is captured by each terminal.
- the trapping efficiency was calculated from the number of the conductive particles by the following formula, and the average value (Ave) and the minimum value (Min) were obtained.
- Capture efficiency (observed capture number / theoretical capture number) x 100
- Theoretical capture number (particle density x terminal area)
- the preferred trapping efficiency of the conductive particles varies depending on the type or application of the electronic component to be anisotropically conductive. However, if the amount is small, the conduction reliability is lowered. Above, more preferably 30% or more.
- a camera module is an expensive electronic component, and is inferior in heat and pressure resistance. Therefore, it is preferable to avoid reattachment due to poor connection when the camera module is connected to a wiring board. From such a point, the minimum value (Min) is preferably more than 80%.
- the conduction resistance of the connection structure was measured by using a digital multimeter (34401A, manufactured by Agilent Technologies) and supplying a current of 1 mA by the four-terminal method.
- OK was determined, and when the resistance value exceeded 2 ⁇ , NG was determined.
- Insulation evaluation 1 continuous conductive particles spanning the entire space between terminals
- the particle series spanning the entire inter-wiring space was counted. If there is even one such series, the insulation evaluation is NG.
- Insulation evaluation 2 (a series of conductive particles of 50 ⁇ m or more in the space between terminals) A series of conductive particles of 50 ⁇ m or more was counted in 450 spaces between terminals of 100 ⁇ m of the connection structure.
- the particle position in the film thickness direction of the anisotropic conductive film is measured from the distance from the film surface toward the flexible printed circuit board (FPC side distance) and from the film surface toward the ceramic substrate. The distance (ceramic substrate side distance) was measured. This measurement was performed by observing a cross section of the anisotropic conductive film under a microscope. In each example and comparative example, the variation width of the position of the conductive particles in the film thickness direction was less than 10% of the conductive particle diameter.
- Adhesive strength The adhesive strength between the flexible printed circuit board and the ceramic substrate of the connection structure was measured by 90-degree peeling with a tensile tester. This adhesive strength is evaluated as OK when it is 6N or more and NG when it is less than 6N.
- the connection structure using film has an average and minimum capture efficiency exceeding 90%, and even though the ceramic substrate has undulations, the capture efficiency is uniform and the overall evaluation is excellent. I understand.
- Comparative Example 1 in which the conductive particle diameter is less than 10 ⁇ m, the trapping efficiency is low due to the undulation of the ceramic substrate, and the conduction characteristics are inferior.
- Comparative Example 5 when the conductive particles are randomly arranged and the film thickness is less than 1.0 times the diameter of the conductive particles, the tack is lowered due to the influence of the particle aggregate, and the sticking property is deteriorated. Further, it can be seen from Comparative Example 6 that when the film thickness exceeds 2.5 times the conductive particle diameter, the resin easily protrudes from the connection structure.
- Example 11 and Comparative Examples 7 to 10 (1) Production of anisotropic conductive film Conductive particle trapping and short-circuiting caused by variation in the particle density of conductive particles and variation in the position of conductive particles in the film thickness direction when the effective connection area of the terminal is changed
- 250 conductive particles (Sekisui Chemical Co., Ltd., Micropearl) having a particle diameter of 20 ⁇ m in a tetragonal lattice in plan view (that is, average particle density) 250 particles
- An anisotropic conductive film (film thickness 25 ⁇ m) (Example 11) arranged at / mm 2 was prepared.
- anisotropic conductive films (film thickness 25 ⁇ m) (Comparative Examples 7 to 10) in which conductive particles having a particle diameter of 20 ⁇ m were randomly arranged at an average particle density shown in Table 2 were prepared.
- the insulating adhesive layer was composed of 30 parts by mass of bifunctional acrylate (A-200, Shin-Nakamura Chemical Co., Ltd.), 40 parts by mass of phenoxy resin (YP50, Toto Kasei Co., Ltd.), urethane acrylate (U-2PPA).
- Effective connection area 1 45000 ⁇ m 2
- Effective connection area 2 50000 ⁇ m 2
- Effective connection area 3 60000 ⁇ m 2
- Effective connection area 4 80000 ⁇ m 2
- Effective connection area 5 100000 ⁇ m 2
- connection structures for evaluation having different effective connection areas For five types of connection structures for evaluation having different effective connection areas, the number of conductive particles captured at opposing terminals was counted, and the average value of the number of conductive particles captured at all 150 terminals was determined for each connection structure. The average value was evaluated according to the following criteria. The results are shown in Table 3. A: 5 or more (practically preferred) B: 3-4 (no problem in practical use) C: Less than 2 (practically problematic)
- Example 11 in which the conductive particles are regularly arranged, as compared with Comparative Examples 7 to 10 arranged at random, the variation in the conductive particles in the plan view is also the variation in the particle position in the film thickness direction. Even though the particle density is lower than those of Comparative Examples 8 to 10, it can be seen that the conductive particles are captured by the terminals having a small effective connection area.
- Terminal distance a 35 ⁇ m
- Terminal distance b 50 ⁇ m
- Terminal distance c 60 ⁇ m
- Terminal distance d 70 ⁇ m
- Terminal distance e 80 ⁇ m
- Anisotropic conductive film 1x, 1y Surface of anisotropic conductive film 2, 2a, 2b Conductive particle 2A Conductive particle arrangement region 3 Insulating adhesive layer 4 Adhesive layer 5 UV curing Layer (insulating adhesive layer) 6 Tack layer 7 Alignment mark 8 Removal margin 10 Camera module 11 Ceramic substrate 12 Lens 13 Optical filter 14 Chip 15 Terminal 16 Alignment mark D Conductive particle diameter L1 Arrangement pitch L2 Thickness of anisotropic conductive film L3 Thickness of anisotropic conductive film Distance between one surface and conductive particles L4 Distance between other surface of anisotropic conductive film and conductive particles Ls Distance between terminals Sv Effective connection area
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Abstract
Description
本発明において、導電粒子2の粒子径(即ち、導電粒子径D)は、接続する基板の表面が平坦である場合だけでなく、セラミック製モジュール基板のように表面にうねりがある場合でも安定した導通がとれるようにする点から、10μm以上、好ましくは15μm以上、より好ましくは20μm以上とする。また、入手容易性の点から、導電粒子2は好ましくは50μm以下、より好ましくは30μm以下とする。
本発明において、導電粒子2は絶縁接着剤層3に平面視で規則配列しており、本実施例の異方導電性フィルム1Aでは平面視で正方格子に配列している。なお、本発明において導電粒子2の規則配列は、導電粒子の平面配置に粗密のばらつきができないように規則的に配列していればよい。例えば、フィルムの長手方向に面積1mm×1mmの領域を10箇所抽出し、各領域における導電粒子の粒子密度を測定した場合の粒子密度の最大値と最小値との差が、各領域の粒子密度の平均に対して20%未満となるようにする。そのために導電粒子を斜方格子、長方格子、6方格子等に格子配列させてもよい。このように規則的に配列させることにより、端子が形成されている接続面にうねりがあっても導電粒子が端子に捕捉されやすくなり、導通不良やショートの発生を顕著に低減させることができる。また、アライメントマークにより電子部品を位置合わせして接続する場合に、基板面のうねりによりアライメントマークがズレても導電粒子が端子で捕捉され、確実に導通をとることができる。
導電粒子2の粒子密度は、導通信頼性の点から20~2000個/mm2が好ましく、40~1500個/mm2がより好ましく、150~850個/mm2が更により好ましい。
導電粒子2自体の構成は、公知の異方導電性フィルムに用いられているものの中から適宜選択して使用することができる。例えば、ニッケル、コバルト、銀、銅、金、パラジウムなどの金属粒子、コア樹脂粒子を金属被覆した金属被覆樹脂粒子などが挙げられる。2種以上を併用することもできる。ここで、金属被覆樹脂粒子の金属被覆は、無電解メッキ法、スパッタリング法等の公知の金属膜形成方法を利用して形成することができる。コア樹脂粒子は、樹脂のみから形成してもよく、導通信頼性の向上のために導電微粒子を分散させたものとしてもよい。
絶縁接着剤層3としては、公知の異方導電性フィルムで使用される絶縁性樹脂層を適宜採用することができる。例えば、アクリレート化合物と光ラジカル重合開始剤とを含む光ラジカル重合型樹脂層、アクリレート化合物と熱ラジカル重合開始剤とを含む熱ラジカル重合型樹脂層、エポキシ化合物と熱カチオン重合開始剤とを含む熱カチオン重合型樹脂層、エポキシ化合物と熱アニオン重合開始剤とを含む熱アニオン重合型樹脂層等を使用することができる。また、これらの樹脂層は、必要に応じて、それぞれ重合したものとすることができる。また、絶縁接着剤層3を、単一の樹脂層から形成しても、複数の樹脂層から形成してもよい。
導電粒子2が平面視で規則配列し、かつフィルム厚方向のばらつき幅が導電粒子径Dの10%未満となるように異方導電性フィルム1Aを製造する方法としては、導電粒子2の配置に対応した凸部を有する金型を平坦な金属プレートに機械加工やレーザー加工、フォトリソグラフィなどの方法で作製し、その金型に硬化性樹脂を充填し、硬化させることにより凹凸が反転した樹脂型を作製し、この樹脂型を導電粒子用マイクロキャビティとし、その凹部に導電粒子を入れ、その上に絶縁接着剤層形成用組成物を充填し、硬化させ、型から取り出せばよい。型から取り出した樹脂層上には、必要に応じて、絶縁接着剤層を形成する樹脂層をさらに積層してもよい。このように型への導電粒子の充填工程と、型への絶縁接着剤層の充填、剥離工程を別個に行うことにより、導電粒子を型の底部に留まらせることができるので、導電粒子のフィルム厚方向のばらつき幅を抑制することができる。
本発明の異方導電性フィルムは、種々の態様をとることができる。
例えば、絶縁接着剤層3を複数の樹脂層から形成するにあたり、図4に示した異方導電性フィルム1Dのように、絶縁接着剤層3を接着層4とUV硬化層5から形成し、各導電粒子2をUV硬化層5の表面に当接するように配置する。そして、UV硬化層5上にタック層6を設ける。
異方導電性フィルム1Aは、フレキシブル基板、ガラス基板などの第1電子部品の接続端子と、カメラモジュール、ICモジュール、ICチップなどの第2電子部品の接続端子との異方導電性接続に使用することができる。この場合、セラミック製モジュール基板のように表面に高さ20~50μm程度のうねりがあっても、うねりの凸部にある端子も凹部にある端子も、それぞれ対向する端子と良好に導通接続することができる。また、異方導電性接続するのに好適な端子としては、幅20~1000μm、ピッチ40~1500μmをあげることができる。
実施例1~10、比較例1~6
(1)異方導電性フィルムの製造
表1A及び表1Bに示すように、所定の粒子径の導電粒子(積水化学工業(株)、ミクロパール)を、絶縁接着剤層に格子状又はランダムに配置した異方導電性フィルムを作製した。この場合、絶縁接着剤層を形成するために、フェノキシ樹脂(新日鉄住金化学(株)、YP-50)60質量部、マイクロカプセル型潜在性硬化剤(旭化成イーマテリアルズ(株)、ノバキュアHX3941HP)40質量部、シリカフィラー(日本アエロジル(株)、AEROSIL R200)20質量部からアニオン系エポキシ樹脂組成物を調製し、それをフィルム厚50μmのPETフィルム上に塗布し、80℃のオーブンにて5分間乾燥させ、PETフィルム上に絶縁性樹脂からなる粘着層を形成した。
フレキシブルプリント基板(銅配線:ライン/スペース(L/S)=100μm/100μm、端子高さ:12μm、ポリイミド厚み:25μm)とアルミナ製セラミック基板(金/タングステン配線:ライン/スペース(L/S)=100μm/100μm、配線高さ:10μm、基板厚み:0.4mm)を(1)で製造した異方導電性フィルム(フィルム幅1.2mm)を用いて、加圧ツール幅1mmで、加熱加圧(180℃、1MPa、20秒)し、接続構造体を得た。
接続構造体からフレキシブルプリント基板を除去し、フレキシブルプリント基板とセラミック基板を観察することにより、セラミック基板のうねりの凸部にある端子と凹部にある端子のそれぞれ1000個について、各端子に捕捉されている導電粒子の数から次式により捕捉効率を算出し、その平均値(Ave)と最小値(Min)を求めた。
捕捉効率=(観察された捕捉数/理論捕捉数)×100
理論捕捉数=(粒子密度×端子面積)
接続構造体の導通抵抗を、デジタルマルチメータ(34401A、アジレント・テクノロジー(株)製)を使用し、4端子法にて、電流1mAを流して測定した。測定された抵抗値が2Ω以下をOKとし、2Ωを超えるものをNGとした。
接続構造体を温度85℃、湿度85%RHの恒温槽に500時間おいた後の導通抵抗を、(b)と同様に測定し、その導通抵抗が2Ω以下であり、導通抵抗に上昇がなかったものをOKとし、それ以外をNGとした。
接続構造体の100μmの端子間スペース450箇所について、配線間スペース全体にまたがっている粒子の連なりをカウントした。そのような連なりが1つでもあると絶縁性評価としてはNGとなる。
接続構造体の100μmの端子間スペース450箇所について、導電粒子の50μm以上の連なりをカウントした。
異方導電性フィルムのフィルム厚方向の粒子位置を、フレキシブルプリント基板側に向けたフィルム表面からの距離(FPC側距離)とセラミック基板側に向けたフィルム表面からの距離(セラミック基板側距離)として測定した。この測定は異方導電性フィルムの断面を顕微鏡観察することにより行った。
なお、各実施例及び比較例において、フィルム厚方向の導電粒子の位置のばらつき幅は導電粒子径の10%未満であった。
PETフィルム上に形成されている異方導電性フィルムを、セラミック基板に仮貼り(60℃、1MPa、1秒)後、PETフィルムを剥離したときの異方導電性フィルムのめくれの有無を目視で観察し、めくれの無い場合をOK、めくれのある場合をNGとした。
接続構造体のフレキシブルプリント基板とセラミック基板の接着強度を引っ張り試験機による90度剥離により測定した。この接着強度は、6N以上の場合にOK、6N未満の場合にNGと評価される。
接続構造体のフレキシブルプリント基板とセラミック基板の接合部分からの樹脂のはみ出しが無いか、または1mm未満の場合をOKとし、樹脂のはみ出しが1mm以上をNGとした。
(a)、(b)、(c)、(d)、(g)、(h)、(i)、(j)の評価においてすべてOKの場合をOK、一つでもNGがある場合をNGとした。
また、比較例6からフィルム厚さが導電粒子径の2.5倍を超えると接続構造体から樹脂がはみ出し易いことがわかる。
(1)異方性導電フィルムの製造
導電粒子の粒子密度のばらつきや、フィルム厚方向の導電粒子の位置のばらつきが、端子の有効接続面積を変えた場合の導電粒子の捕捉性やショートの発生に及ぼす影響を調べるため、実施例1に準じて、粒子径20μmの導電粒子(積水化学工業(株)、ミクロパール)を4方格子で平面視の粒子密度(即ち、平均粒子密度)250個/mm2に配列させた異方導電性フィルム(フィルム厚25μm)(実施例11)を作製した。また、比較例2に準じて、粒子径20μmの導電粒子を表2に示す平均粒子密度でランダムに配置した異方導電性フィルム(フィルム厚25μm)(比較例7~10)を作製した。この場合、絶縁接着剤層は、2官能アクリレート(A-200、新中村化学工業(株))30質量部、フェノキシ樹脂(YP50、東都化成(株))40質量部、ウレタンアクリレート(U-2PPA、新中村化学工業(株))20質量部、リン酸エステル型アクリレート(PM-2、日本化薬(株))5質量部、脂肪族系過酸化物(パーロイルL、日本油脂(株))3質量部、ベンジルパーオキサイド(ナイバーBW、日本油脂(株))2質量部から調製した。
(1)で作製した異方導電性フィルムの平面視における導電粒子の粗密のばらつきを、それぞれのフィルムについて、フィルムの長手方向に、面積1mm×1mmの領域を10箇所抽出し、各領域における導電粒子の平面視の粒子密度を測定し、その最大値と最小値との差Δdを求め、その差Δdの平均粒子密度に対する割合を求めた。結果を表2に示す。
(1)で作製した異方導電性フィルムについて、フィルム厚方向の導電粒子の位置のばらつき幅を評価するために、電子顕微鏡によりフィルム断面を観察し、そのフィルム断面における連続した200個の導電粒子について、フィルム面の一方と導電粒子との距離を測定し、200個の測定値の最大と最小の差を求めた(N=200)。結果を表2に示す。
フレキシブルプリント基板(銅配線、ライン/スペース(L/S)=100μm/100μm、端子数150本)と、セラミック基板(金/タングステン配線、ライン/スペース(L/S)=100μm/100μm、端子数150本)とを、(1)で作製した異方導電性フィルム(フィルム幅1.2mm)を用いてツール幅1mmで加熱加圧し(150℃、2MPa、6秒)、評価用接続構造体を得た。この場合、図10A、図10Bに示すように、フレキシブルプリント基板20の端子21とセラミック基板30の端子31とを所定幅ずらして対向させ、対向する端子毎の有効接続面積(図10Aにおいてドットで塗りつぶした部分の面積)Svを概略次の5通りに異ならせた。
有効接続面積1:45000μm2
有効接続面積2:50000μm2
有効接続面積3:60000μm2
有効接続面積4:80000μm2
有効接続面積5:100000μm2
A:5以上(実用上、好ましい)
B:3~4個(実用上、問題なし)
C:2個未満(実用上、問題あり)
(4)と同様にして対向する端子をずらし、端子間距離Ls(図10B)が、概略次のように異なる5通りの評価用接続構造体を得た。
端子間距離a:35μm
端子間距離b:50μm
端子間距離c:60μm
端子間距離d:70μm
端子間距離e:80μm
1x、1y 異方導電性フィルムの表面
2、2a、2b 導電粒子
2A 導電粒子の配置領域
3 絶縁接着剤層
4 接着層
5 UV硬化層(絶縁接着剤層)
6 タック層
7 アライメントマーク
8 抜きしろ
10 カメラモジュール
11 セラミック基板
12 レンズ
13 光学フィルタ
14 チップ
15 端子
16 アライメントマーク
D 導電粒子径
L1 配列ピッチ
L2 異方導電性フィルムの厚さ
L3 異方導電性フィルムの一方の表面と導電粒子との距離
L4 異方導電性フィルムの他方の表面と導電粒子との距離
Ls 端子間距離
Sv 有効接続面積
Claims (8)
- 絶縁接着剤層と、該絶縁接着剤層に平面視で規則配列した導電粒子を含む異方導電性フィルムであって、導電粒子径が10μm以上であり、該フィルムの厚さが導電粒子径の等倍以上3.5倍以下であり、該フィルムの厚さ方向の導電粒子の位置のばらつき幅が導電粒子径の10%未満である異方導電性フィルム。
- 異方導電性フィルムの厚さが導電粒子径の等倍以上2.5倍以下である請求項1記載の異方導電性フィルム。
- 異方導電性フィルムの一方の表面と各導電粒子との距離が導電粒子径の10%以上である請求項1又は2記載の異方導電性フィルム。
- 異方導電性フィルムの長手方向に面積1mm×1mmの領域を10個抽出し、各領域の平面視の粒子密度を測定した場合の最大値と最小値との差が、各領域の粒子密度の平均の20%未満である請求項1~3のいずれかに記載の異方性導電フィルム。
- 導電粒子の粒子密度が20~2000個/mm2である請求項1~4のいずれかに記載の異方導電性フィルム。
- アライメントマーク用粒子の配置により、異方導電性接続する電子部品に対するアライメントマークが形成されている請求項1~5のいずれかに記載の異方導電性フィルム。
- 請求項1~6のいずれかに記載の異方導電性フィルムで第1電子部品と第2電子部品が異方導電性接続されている接続構造体。
- 第1電子部品が配線基板であり、第2電子部品がカメラモジュールである請求項7記載の接続構造体。
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JP2018200880A (ja) | 2018-12-20 |
CN107112067A (zh) | 2017-08-29 |
US20230159797A1 (en) | 2023-05-25 |
CN110265174B (zh) | 2022-06-28 |
TW201700664A (zh) | 2017-01-01 |
KR20210088023A (ko) | 2021-07-13 |
SG11201705711QA (en) | 2017-08-30 |
US11591499B2 (en) | 2023-02-28 |
SG10201909698RA (en) | 2019-11-28 |
TW202313881A (zh) | 2023-04-01 |
US20180002575A1 (en) | 2018-01-04 |
PH12017501262A1 (en) | 2018-01-15 |
JP6394613B2 (ja) | 2018-09-26 |
TWI787601B (zh) | 2022-12-21 |
CN110265174A (zh) | 2019-09-20 |
KR102542797B1 (ko) | 2023-06-14 |
JP6504307B1 (ja) | 2019-04-24 |
JP2016131152A (ja) | 2016-07-21 |
KR102276325B1 (ko) | 2021-07-13 |
CN107112067B (zh) | 2019-04-16 |
TWI835413B (zh) | 2024-03-11 |
KR20170088985A (ko) | 2017-08-02 |
TW202033698A (zh) | 2020-09-16 |
KR101929951B1 (ko) | 2018-12-18 |
JP6489516B2 (ja) | 2019-03-27 |
JP2019087536A (ja) | 2019-06-06 |
TWI694128B (zh) | 2020-05-21 |
KR20180135110A (ko) | 2018-12-19 |
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