JP5187465B1 - 高温鉛フリーはんだ合金 - Google Patents
高温鉛フリーはんだ合金 Download PDFInfo
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- JP5187465B1 JP5187465B1 JP2012548670A JP2012548670A JP5187465B1 JP 5187465 B1 JP5187465 B1 JP 5187465B1 JP 2012548670 A JP2012548670 A JP 2012548670A JP 2012548670 A JP2012548670 A JP 2012548670A JP 5187465 B1 JP5187465 B1 JP 5187465B1
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 183
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 166
- 239000000956 alloy Substances 0.000 title claims abstract description 166
- 239000000203 mixture Substances 0.000 claims abstract description 26
- 229910052709 silver Inorganic materials 0.000 claims abstract description 25
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 18
- 239000007790 solid phase Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 8
- 230000008018 melting Effects 0.000 abstract description 115
- 238000002844 melting Methods 0.000 abstract description 115
- 229910017944 Ag—Cu Inorganic materials 0.000 abstract description 10
- 238000010583 slow cooling Methods 0.000 abstract description 5
- 239000012071 phase Substances 0.000 description 75
- 239000004065 semiconductor Substances 0.000 description 29
- 230000000052 comparative effect Effects 0.000 description 25
- 238000001816 cooling Methods 0.000 description 25
- 238000005476 soldering Methods 0.000 description 20
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 19
- 238000007711 solidification Methods 0.000 description 16
- 230000008023 solidification Effects 0.000 description 16
- 239000007791 liquid phase Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 230000004907 flux Effects 0.000 description 8
- 229910020935 Sn-Sb Inorganic materials 0.000 description 6
- 229910008757 Sn—Sb Inorganic materials 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 229910000765 intermetallic Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000005204 segregation Methods 0.000 description 5
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- 229910017687 Ag3Sb Inorganic materials 0.000 description 3
- 229910006913 SnSb Inorganic materials 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- 229910018306 Cu2Sb Inorganic materials 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000006911 nucleation Effects 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 229910015363 Au—Sn Inorganic materials 0.000 description 1
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 description 1
- 229910018082 Cu3Sn Inorganic materials 0.000 description 1
- 229910018471 Cu6Sn5 Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
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- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/2912—Antimony [Sb] as principal constituent
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- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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Abstract
質量%で、Sb:35〜40%、Ag:13〜18%、Cu:6〜8%、および残部Snから成る合金組成を有する。
【選択図】図1
Description
(1)質量%で、Sb:35〜40%、Ag:13〜18%、Cu:6〜8%、および残部Snから成る合金組成を有する高温鉛フリーはんだ合金。
4.90≦Sb/Cu≦6.20 (II)
2.05≦Ag/Cu≦2.55 (III)
(4) 280℃で固相率が100%である、上記(1)〜上記(3)のいずれかに記載の高温鉛フリーはんだ合金を用いたはんだ継手。
Sbの含有量は35〜40%である。Sbは、高融点相であるSnSbの生成を促す。したがって、Sbは、低融点相の生成を抑制し、溶融開始温度を上昇させる。また、Sbは、はんだ合金の表面張力を低下させる傾向にあるために濡れ性を向上させる。Sbの含有量が35%未満であると、低融点相の生成抑制効果を発揮することができず、また、濡れ性が悪化する。Sbの含有量が40%より多いと、溶融終了温度が著しく高くなりはんだ付け性が劣化する。Sbの含有量は、好ましくは36〜40%であり、より好ましくは37〜40%である。
4.90≦Sb/Cu≦6.20 (II)
2.05≦Ag/Cu≦2.55 (III)
Sb、Ag、およびCuは、各々Sb、Ag、およびCuの含有量(%)である。
Niの含有量は0.01〜0.1%であることが好ましい。Niは、電極からはんだ合金中へ拡散を防いで電極の食われを抑制する。Niの含有量は、より好ましくは0.01〜0.07%であり、特に好ましくは0.03〜0.07%である。
このように、本発明に係る高温鉛フリーはんだ合金は、溶融終了温度以上の温度から冷却し、凝固させても、290℃以上の溶融開始温度を示す金属間化合物からなる高融点相のみからなり、低融点相が生成されることはない。
液相率を以下のように求めた。まず、図4に記載のように、ベースライン8を引き、ベースライン8とDSC曲線9で囲まれる面積Vo(Vo=V1+V2)を求めた。そして、280℃で分割線10を引き、分割線10、280℃以下のDSC曲線9およびベースライン8で囲まれる面積V1を求めた。最後に、(V1/V0)×100により280℃での液相率を算出した。一方、図3に示すように、280℃以下の温度で吸熱ピークが観測されなかった場合には、面積V1が0であるため、280℃での液相率は0%ということになる。
Claims (6)
- 質量%で、Sb:35〜40%、Ag:13〜18%、Cu:6〜8%、および残部Snから成る合金組成を有する高温鉛フリーはんだ合金。
- 更に、質量%で、Ni:0.01〜0.1%を含有する、請求項1に記載の高温鉛フリーはんだ合金。
- 前記合金組成の含有比が式(I)〜(III)を満たす、請求項1または2に記載の高温鉛フリーはんだ合金。
2.20≦Sb/Ag≦2.75 (I)
4.90≦Sb/Cu≦6.20 (II)
2.05≦Ag/Cu≦2.55 (III) - 280℃での固相率が100%である、請求項1〜3のいずれかに記載の高温鉛フリーはんだ合金を用いたはんだ継手。
- 請求項1〜4のいずれかに記載の高温鉛フリーはんだ合金からなるプリフォーム材。
- 請求項1〜4のいずれかに記載の高温鉛フリーはんだ合金を含有するはんだペースト。
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Application Number | Priority Date | Filing Date | Title |
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PCT/JP2012/070185 WO2014024271A1 (ja) | 2012-08-08 | 2012-08-08 | 高温鉛フリーはんだ合金 |
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JP5187465B1 true JP5187465B1 (ja) | 2013-04-24 |
JPWO2014024271A1 JPWO2014024271A1 (ja) | 2016-07-21 |
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JP2012548670A Active JP5187465B1 (ja) | 2012-08-08 | 2012-08-08 | 高温鉛フリーはんだ合金 |
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US (1) | US8865062B2 (ja) |
EP (1) | EP2716401B1 (ja) |
JP (1) | JP5187465B1 (ja) |
KR (1) | KR20150035671A (ja) |
CN (1) | CN103732349B (ja) |
AU (1) | AU2012359292A1 (ja) |
MY (1) | MY165485A (ja) |
TW (1) | TWI469845B (ja) |
WO (1) | WO2014024271A1 (ja) |
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WO2014024715A1 (ja) * | 2012-08-10 | 2014-02-13 | 千住金属工業株式会社 | 高温鉛フリーはんだ合金 |
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CN105834610A (zh) * | 2015-02-04 | 2016-08-10 | 日本电波工业株式会社 | 焊料材料及电子零件 |
DE102015216047A1 (de) * | 2015-08-21 | 2017-02-23 | Continental Automotive Gmbh | Schaltungsträger, Leistungselektronikanordnung mit einem Schaltungsträger |
JP6780994B2 (ja) * | 2016-09-22 | 2020-11-04 | 日本電波工業株式会社 | はんだ材料及び電子部品 |
DE102016121801B4 (de) * | 2016-11-14 | 2022-03-17 | Infineon Technologies Ag | Baugruppe mit Verbindungen, die verschiedene Schmelztemperaturen aufweisen, Fahrzeug mit der Baugruppe und Verfahren zum Herstellen derselben und Verwendung der Baugruppe für eine Automobilanwendung |
CN114728359A (zh) * | 2019-11-26 | 2022-07-08 | 株式会社富士 | 元件安装方法及元件安装系统 |
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- 2012-08-08 JP JP2012548670A patent/JP5187465B1/ja active Active
- 2012-08-08 MY MYPI2013701196A patent/MY165485A/en unknown
- 2012-08-08 US US13/261,682 patent/US8865062B2/en active Active
- 2012-08-08 AU AU2012359292A patent/AU2012359292A1/en not_active Abandoned
- 2012-08-08 EP EP12864679.1A patent/EP2716401B1/en active Active
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Also Published As
Publication number | Publication date |
---|---|
US20140044479A1 (en) | 2014-02-13 |
EP2716401B1 (en) | 2016-10-12 |
EP2716401A4 (en) | 2015-02-25 |
TW201406491A (zh) | 2014-02-16 |
WO2014024271A1 (ja) | 2014-02-13 |
AU2012359292A1 (en) | 2014-02-27 |
KR20150035671A (ko) | 2015-04-07 |
EP2716401A1 (en) | 2014-04-09 |
TWI469845B (zh) | 2015-01-21 |
MY165485A (en) | 2018-03-23 |
US8865062B2 (en) | 2014-10-21 |
CN103732349A (zh) | 2014-04-16 |
JPWO2014024271A1 (ja) | 2016-07-21 |
CN103732349B (zh) | 2015-11-25 |
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