TWI347366B - Lead-free solder alloy composition - Google Patents
Lead-free solder alloy compositionInfo
- Publication number
- TWI347366B TWI347366B TW096148233A TW96148233A TWI347366B TW I347366 B TWI347366 B TW I347366B TW 096148233 A TW096148233 A TW 096148233A TW 96148233 A TW96148233 A TW 96148233A TW I347366 B TWI347366 B TW I347366B
- Authority
- TW
- Taiwan
- Prior art keywords
- lead
- alloy composition
- free solder
- solder alloy
- free
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096148233A TWI347366B (en) | 2007-12-17 | 2007-12-17 | Lead-free solder alloy composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096148233A TWI347366B (en) | 2007-12-17 | 2007-12-17 | Lead-free solder alloy composition |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200927950A TW200927950A (en) | 2009-07-01 |
TWI347366B true TWI347366B (en) | 2011-08-21 |
Family
ID=44863780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096148233A TWI347366B (en) | 2007-12-17 | 2007-12-17 | Lead-free solder alloy composition |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI347366B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI446982B (en) * | 2011-12-20 | 2014-08-01 | Ind Tech Res Inst | Solid liquid inter-diffusion bonding structure of thermoelectric module and fabricating method thereof |
TWI460046B (en) * | 2012-11-12 | 2014-11-11 | Accurus Scient Co Ltd | High strength silver-free lead-free solder |
TWI469845B (en) * | 2012-08-08 | 2015-01-21 | Senju Metal Industry Co | High temperature lead free solder alloy |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102311677B1 (en) | 2014-08-13 | 2021-10-12 | 삼성전자주식회사 | Semiconductor device and method of manufacturing the same |
CN114669908B (en) * | 2022-04-01 | 2023-08-18 | 中山翰华锡业有限公司 | High-reliability preformed soldering lug and preparation method thereof |
CN116967655A (en) * | 2022-04-01 | 2023-10-31 | 中山翰华锡业有限公司 | High-insulation preformed soldering lug and preparation method thereof |
CN116140863B (en) * | 2023-02-25 | 2023-10-10 | 东莞市千岛金属锡品有限公司 | High-heat-resistance lead-free tin bar and preparation method thereof |
-
2007
- 2007-12-17 TW TW096148233A patent/TWI347366B/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI446982B (en) * | 2011-12-20 | 2014-08-01 | Ind Tech Res Inst | Solid liquid inter-diffusion bonding structure of thermoelectric module and fabricating method thereof |
TWI469845B (en) * | 2012-08-08 | 2015-01-21 | Senju Metal Industry Co | High temperature lead free solder alloy |
TWI460046B (en) * | 2012-11-12 | 2014-11-11 | Accurus Scient Co Ltd | High strength silver-free lead-free solder |
Also Published As
Publication number | Publication date |
---|---|
TW200927950A (en) | 2009-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |