TWI347366B - Lead-free solder alloy composition - Google Patents

Lead-free solder alloy composition

Info

Publication number
TWI347366B
TWI347366B TW096148233A TW96148233A TWI347366B TW I347366 B TWI347366 B TW I347366B TW 096148233 A TW096148233 A TW 096148233A TW 96148233 A TW96148233 A TW 96148233A TW I347366 B TWI347366 B TW I347366B
Authority
TW
Taiwan
Prior art keywords
lead
alloy composition
free solder
solder alloy
free
Prior art date
Application number
TW096148233A
Other languages
Chinese (zh)
Other versions
TW200927950A (en
Inventor
Tung Han Chuang
Hsiu Jen Lin
Original Assignee
Univ Nat Taiwan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nat Taiwan filed Critical Univ Nat Taiwan
Priority to TW096148233A priority Critical patent/TWI347366B/en
Publication of TW200927950A publication Critical patent/TW200927950A/en
Application granted granted Critical
Publication of TWI347366B publication Critical patent/TWI347366B/en

Links

TW096148233A 2007-12-17 2007-12-17 Lead-free solder alloy composition TWI347366B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096148233A TWI347366B (en) 2007-12-17 2007-12-17 Lead-free solder alloy composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096148233A TWI347366B (en) 2007-12-17 2007-12-17 Lead-free solder alloy composition

Publications (2)

Publication Number Publication Date
TW200927950A TW200927950A (en) 2009-07-01
TWI347366B true TWI347366B (en) 2011-08-21

Family

ID=44863780

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096148233A TWI347366B (en) 2007-12-17 2007-12-17 Lead-free solder alloy composition

Country Status (1)

Country Link
TW (1) TWI347366B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI446982B (en) * 2011-12-20 2014-08-01 Ind Tech Res Inst Solid liquid inter-diffusion bonding structure of thermoelectric module and fabricating method thereof
TWI460046B (en) * 2012-11-12 2014-11-11 Accurus Scient Co Ltd High strength silver-free lead-free solder
TWI469845B (en) * 2012-08-08 2015-01-21 Senju Metal Industry Co High temperature lead free solder alloy

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102311677B1 (en) 2014-08-13 2021-10-12 삼성전자주식회사 Semiconductor device and method of manufacturing the same
CN114669908B (en) * 2022-04-01 2023-08-18 中山翰华锡业有限公司 High-reliability preformed soldering lug and preparation method thereof
CN116967655A (en) * 2022-04-01 2023-10-31 中山翰华锡业有限公司 High-insulation preformed soldering lug and preparation method thereof
CN116140863B (en) * 2023-02-25 2023-10-10 东莞市千岛金属锡品有限公司 High-heat-resistance lead-free tin bar and preparation method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI446982B (en) * 2011-12-20 2014-08-01 Ind Tech Res Inst Solid liquid inter-diffusion bonding structure of thermoelectric module and fabricating method thereof
TWI469845B (en) * 2012-08-08 2015-01-21 Senju Metal Industry Co High temperature lead free solder alloy
TWI460046B (en) * 2012-11-12 2014-11-11 Accurus Scient Co Ltd High strength silver-free lead-free solder

Also Published As

Publication number Publication date
TW200927950A (en) 2009-07-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees