GB0804138D0 - Improvements in or relating to lead-free solders - Google Patents

Improvements in or relating to lead-free solders

Info

Publication number
GB0804138D0
GB0804138D0 GBGB0804138.6A GB0804138A GB0804138D0 GB 0804138 D0 GB0804138 D0 GB 0804138D0 GB 0804138 A GB0804138 A GB 0804138A GB 0804138 D0 GB0804138 D0 GB 0804138D0
Authority
GB
United Kingdom
Prior art keywords
relating
lead
free solders
solders
free
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0804138.6A
Other versions
GB2455486A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Quantum Chemical Technologies (Singapore) Pte Ltd
Singapore Asahi Chemical and Solder Industries Pte Ltd
Original Assignee
Quantum Chemical Technologies (Singapore) Pte Ltd
Singapore Asahi Chemical and Solder Industries Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quantum Chemical Technologies (Singapore) Pte Ltd, Singapore Asahi Chemical and Solder Industries Pte Ltd filed Critical Quantum Chemical Technologies (Singapore) Pte Ltd
Priority to GB0804138A priority Critical patent/GB2455486A/en
Publication of GB0804138D0 publication Critical patent/GB0804138D0/en
Publication of GB2455486A publication Critical patent/GB2455486A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
GB0804138A 2008-03-05 2008-03-05 A sputtered film, solder spheres and solder paste formed from an Sn-Ag-Cu-In alloy Withdrawn GB2455486A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0804138A GB2455486A (en) 2008-03-05 2008-03-05 A sputtered film, solder spheres and solder paste formed from an Sn-Ag-Cu-In alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0804138A GB2455486A (en) 2008-03-05 2008-03-05 A sputtered film, solder spheres and solder paste formed from an Sn-Ag-Cu-In alloy

Publications (2)

Publication Number Publication Date
GB0804138D0 true GB0804138D0 (en) 2008-04-09
GB2455486A GB2455486A (en) 2009-06-17

Family

ID=39316032

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0804138A Withdrawn GB2455486A (en) 2008-03-05 2008-03-05 A sputtered film, solder spheres and solder paste formed from an Sn-Ag-Cu-In alloy

Country Status (1)

Country Link
GB (1) GB2455486A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10076808B2 (en) 2013-08-05 2018-09-18 Senju Metal Industry Co., Ltd. Lead-free solder alloy
CN109483081A (en) * 2018-12-03 2019-03-19 先导薄膜材料（广东）有限公司 Metal targets bind solder and preparation method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997009455A1 (en) * 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
US6176947B1 (en) * 1998-12-31 2001-01-23 H-Technologies Group, Incorporated Lead-free solders
SG139507A1 (en) * 2001-07-09 2008-02-29 Quantum Chem Tech Singapore Improvements in or relating to solders
JP2005026393A (en) * 2003-07-01 2005-01-27 Hitachi Ltd REFLOW SOLDERING METHOD EMPLOYING Pb-FREE SOLDER ALLOY, REFLOW SOLDERING METHOD, MIXED MOUNTING METHOD AND MIXED MOUNTED STRUCTURE
JP2005276577A (en) * 2004-03-24 2005-10-06 Nec Schott Components Corp Fusible alloy type thermal fuse
US7215030B2 (en) * 2005-06-27 2007-05-08 Advanced Micro Devices, Inc. Lead-free semiconductor package
US20070071634A1 (en) * 2005-09-26 2007-03-29 Indium Corporation Of America Low melting temperature compliant solders
JP2007196289A (en) * 2005-12-27 2007-08-09 Toshiba Corp Lead-free metallic material for electronic component

Also Published As

Publication number Publication date
GB2455486A (en) 2009-06-17

Similar Documents

Publication Publication Date Title
GB0806434D0 (en) Improvements in or relating to structural adhesives
GB0802457D0 (en) Improvements in or relating to stairlifts
EP2277657A4 (en) Lead-free solder
GB0712988D0 (en) Improvements in or relating to compositions
GB0712991D0 (en) Improvement in or relating to compositions
GB0823051D0 (en) Improvements in or relating to packaging
GB0812053D0 (en) Improvements in or relating to robotic arms
ZA201100960B (en) Improvements in or relating to compositions
GB2468622B (en) Improvements in or relating to trampolines
GB0709551D0 (en) Improvements in or relating to stairlifts
GB2463734B (en) Improvements in or relating to stairlifts
GB0810840D0 (en) Improvements in or relating to stairlifts
ZA201005273B (en) Emulsifiable concentrate composition
GB0804752D0 (en) Improvements in or relating to wall-ties
GB0905657D0 (en) Improvements in or relating to stairlifts
GB0718710D0 (en) Improvements in or relating to stairlifts
GB2461267B (en) Improvements in or relating to nuclear fusion
GB0715605D0 (en) Improvements in or relating to compositions
GB0804138D0 (en) Improvements in or relating to lead-free solders
GB2457767B (en) Improvements in or relating to stairlifts
ZA201005275B (en) Emulsifiable concentrate composition
GB0821983D0 (en) Improvements in or relating to structural members
GB2488051B (en) Improvements in or relating to stairlifts
GB0909994D0 (en) Improvements in or relating to stairlifts
GB0714811D0 (en) Improvements in or relating to compositions

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)