JP5084639B2 - スピン処理装置 - Google Patents

スピン処理装置 Download PDF

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Publication number
JP5084639B2
JP5084639B2 JP2008170306A JP2008170306A JP5084639B2 JP 5084639 B2 JP5084639 B2 JP 5084639B2 JP 2008170306 A JP2008170306 A JP 2008170306A JP 2008170306 A JP2008170306 A JP 2008170306A JP 5084639 B2 JP5084639 B2 JP 5084639B2
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JP
Japan
Prior art keywords
processing liquid
substrate
cup body
processing
peripheral wall
Prior art date
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Active
Application number
JP2008170306A
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English (en)
Japanese (ja)
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JP2010010554A (ja
Inventor
航之介 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2008170306A priority Critical patent/JP5084639B2/ja
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to KR1020107026570A priority patent/KR101168649B1/ko
Priority to PCT/JP2009/061501 priority patent/WO2010001781A1/ja
Priority to EP09773359.6A priority patent/EP2296170B1/en
Priority to CN2009801219475A priority patent/CN102057464B/zh
Priority to TW098121872A priority patent/TWI396233B/zh
Publication of JP2010010554A publication Critical patent/JP2010010554A/ja
Priority to US12/960,699 priority patent/US8377251B2/en
Application granted granted Critical
Publication of JP5084639B2 publication Critical patent/JP5084639B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2008170306A 2008-06-30 2008-06-30 スピン処理装置 Active JP5084639B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2008170306A JP5084639B2 (ja) 2008-06-30 2008-06-30 スピン処理装置
PCT/JP2009/061501 WO2010001781A1 (ja) 2008-06-30 2009-06-24 スピン処理装置及びスピン処理方法
EP09773359.6A EP2296170B1 (en) 2008-06-30 2009-06-24 Spin processing apparatus and spin processing method
CN2009801219475A CN102057464B (zh) 2008-06-30 2009-06-24 自旋处理装置及自旋处理方法
KR1020107026570A KR101168649B1 (ko) 2008-06-30 2009-06-24 스핀 처리 장치
TW098121872A TWI396233B (zh) 2008-06-30 2009-06-29 A rotation processing device and a rotation processing method
US12/960,699 US8377251B2 (en) 2008-06-30 2010-12-06 Spin processing apparatus and spin processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008170306A JP5084639B2 (ja) 2008-06-30 2008-06-30 スピン処理装置

Publications (2)

Publication Number Publication Date
JP2010010554A JP2010010554A (ja) 2010-01-14
JP5084639B2 true JP5084639B2 (ja) 2012-11-28

Family

ID=41465879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008170306A Active JP5084639B2 (ja) 2008-06-30 2008-06-30 スピン処理装置

Country Status (7)

Country Link
US (1) US8377251B2 (zh)
EP (1) EP2296170B1 (zh)
JP (1) JP5084639B2 (zh)
KR (1) KR101168649B1 (zh)
CN (1) CN102057464B (zh)
TW (1) TWI396233B (zh)
WO (1) WO2010001781A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101914298B1 (ko) * 2011-11-04 2018-12-31 삼성디스플레이 주식회사 디스플레이용 글라스 윈도우 가공 장치 및 방법
KR101485579B1 (ko) * 2013-10-02 2015-01-22 주식회사 케이씨텍 기판세정장치
US9997380B2 (en) 2014-01-16 2018-06-12 SCREEN Holdings Co., Ltd. Substrate processing apparatus
EP2955745A1 (en) * 2014-06-11 2015-12-16 Applied Materials Switzerland Sàrl Wafer cleaning system
JP6983602B2 (ja) * 2017-09-26 2021-12-17 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP2019160988A (ja) * 2018-03-13 2019-09-19 信越ポリマー株式会社 基板用処理液の回収装置
KR102081706B1 (ko) 2018-07-18 2020-02-27 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
KR102099105B1 (ko) 2018-07-18 2020-05-15 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
CN108906462B (zh) * 2018-07-23 2020-04-14 华进半导体封装先导技术研发中心有限公司 一种用于半导体湿法工艺设备的液体雾化装置
JP2023140684A (ja) * 2022-03-23 2023-10-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT389959B (de) * 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
JPH05190442A (ja) * 1992-01-10 1993-07-30 Hitachi Ltd 薬液処理装置
CN1097490C (zh) * 1996-11-15 2003-01-01 芝浦机械电子装置股份有限公司 旋转处理装置
JP3929192B2 (ja) * 1998-12-21 2007-06-13 大日本スクリーン製造株式会社 基板処理装置
TW504776B (en) 1999-09-09 2002-10-01 Mimasu Semiconductor Ind Co Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism
JP4257816B2 (ja) * 2000-03-16 2009-04-22 三益半導体工業株式会社 廃液回収機構付ウェーハ表面処理装置
JP2003297801A (ja) 2002-03-28 2003-10-17 Shibaura Mechatronics Corp スピン処理装置
JP2004031400A (ja) * 2002-06-21 2004-01-29 Sipec Corp 基板処理装置及びその処理方法
US7584760B2 (en) 2002-09-13 2009-09-08 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
JP4318913B2 (ja) * 2002-12-26 2009-08-26 東京エレクトロン株式会社 塗布処理装置
JP2004265912A (ja) * 2003-02-03 2004-09-24 Personal Creation Ltd 基板の処理装置
JP4441530B2 (ja) 2003-03-20 2010-03-31 ラム・リサーチ・アクチエンゲゼルシヤフト ディスク形状の物体を湿式処理するための装置及び方法
JP4293830B2 (ja) * 2003-05-12 2009-07-08 葵精機株式会社 基板処理装置およびその処理方法
US7467635B2 (en) 2003-05-12 2008-12-23 Sprout Co., Ltd. Apparatus and method for substrate processing
JP4413608B2 (ja) 2003-12-26 2010-02-10 旭化成エレクトロニクス株式会社 多電源電子回路の検証方法
JP2006086384A (ja) * 2004-09-16 2006-03-30 Ses Co Ltd 基板処理装置
JP4763567B2 (ja) * 2006-10-03 2011-08-31 大日本スクリーン製造株式会社 基板処理装置

Also Published As

Publication number Publication date
TWI396233B (zh) 2013-05-11
KR101168649B1 (ko) 2012-07-25
EP2296170A4 (en) 2012-07-18
EP2296170B1 (en) 2013-08-14
US8377251B2 (en) 2013-02-19
KR20110009181A (ko) 2011-01-27
US20110073565A1 (en) 2011-03-31
EP2296170A1 (en) 2011-03-16
CN102057464A (zh) 2011-05-11
CN102057464B (zh) 2013-03-27
TW201009922A (en) 2010-03-01
JP2010010554A (ja) 2010-01-14
WO2010001781A1 (ja) 2010-01-07

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