JP5078687B2 - 多層配線基板の製造方法 - Google Patents
多層配線基板の製造方法 Download PDFInfo
- Publication number
- JP5078687B2 JP5078687B2 JP2008070492A JP2008070492A JP5078687B2 JP 5078687 B2 JP5078687 B2 JP 5078687B2 JP 2008070492 A JP2008070492 A JP 2008070492A JP 2008070492 A JP2008070492 A JP 2008070492A JP 5078687 B2 JP5078687 B2 JP 5078687B2
- Authority
- JP
- Japan
- Prior art keywords
- alignment mark
- wiring board
- multilayer wiring
- conductor circuit
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 239000010410 layer Substances 0.000 claims description 165
- 229920005989 resin Polymers 0.000 claims description 124
- 239000011347 resin Substances 0.000 claims description 124
- 239000004020 conductor Substances 0.000 claims description 82
- 239000000758 substrate Substances 0.000 claims description 53
- 238000009413 insulation Methods 0.000 claims description 37
- 239000011229 interlayer Substances 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 35
- 238000001514 detection method Methods 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 238000000605 extraction Methods 0.000 claims description 16
- 238000005553 drilling Methods 0.000 claims description 9
- 238000004080 punching Methods 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 27
- 229910052802 copper Inorganic materials 0.000 description 24
- 239000010949 copper Substances 0.000 description 24
- 238000007747 plating Methods 0.000 description 22
- 239000000047 product Substances 0.000 description 22
- 229910000679 solder Inorganic materials 0.000 description 13
- 239000003822 epoxy resin Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920001955 polyphenylene ether Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008070492A JP5078687B2 (ja) | 2007-03-22 | 2008-03-18 | 多層配線基板の製造方法 |
| TW097109418A TWI396474B (zh) | 2007-03-22 | 2008-03-18 | 多層配線基板的製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007075662 | 2007-03-22 | ||
| JP2007075662 | 2007-03-22 | ||
| JP2008070492A JP5078687B2 (ja) | 2007-03-22 | 2008-03-18 | 多層配線基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008270768A JP2008270768A (ja) | 2008-11-06 |
| JP5078687B2 true JP5078687B2 (ja) | 2012-11-21 |
Family
ID=40006269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008070492A Expired - Fee Related JP5078687B2 (ja) | 2007-03-22 | 2008-03-18 | 多層配線基板の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5078687B2 (zh) |
| CN (1) | CN101272663B (zh) |
| TW (1) | TWI396474B (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI484886B (zh) * | 2013-08-29 | 2015-05-11 | Unimicron Technology Corp | 多層電路板的製作方法 |
| TWI484885B (zh) * | 2013-08-28 | 2015-05-11 | Unimicron Technology Corp | 多層電路板的製作方法 |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI404495B (zh) * | 2010-06-29 | 2013-08-01 | Univ Nat Pingtung Sci & Tech | 在基板上形成電路圖案之方法 |
| JP5855905B2 (ja) | 2010-12-16 | 2016-02-09 | 日本特殊陶業株式会社 | 多層配線基板及びその製造方法 |
| JP2013051397A (ja) * | 2011-08-03 | 2013-03-14 | Ngk Spark Plug Co Ltd | 配線基板の製造方法 |
| CN102509696B (zh) * | 2011-10-28 | 2016-04-06 | 上海华虹宏力半导体制造有限公司 | 对准标记的形成方法 |
| CN102413633B (zh) * | 2011-11-03 | 2014-04-30 | 华为技术有限公司 | 一种检测多层电路板偏位的装置及方法 |
| JP2013135080A (ja) * | 2011-12-26 | 2013-07-08 | Ngk Spark Plug Co Ltd | 多層配線基板の製造方法 |
| JPWO2013145043A1 (ja) * | 2012-03-27 | 2015-08-03 | パナソニックＩｐマネジメント株式会社 | ビルドアップ基板およびその製造方法ならびに半導体集積回路パッケージ |
| US9137905B2 (en) * | 2012-06-25 | 2015-09-15 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Alignment between layers of multilayer electronic support structures |
| US8952542B2 (en) * | 2012-11-14 | 2015-02-10 | Advanced Semiconductor Engineering, Inc. | Method for dicing a semiconductor wafer having through silicon vias and resultant structures |
| TWI487076B (zh) * | 2013-04-24 | 2015-06-01 | 矽品精密工業股份有限公司 | 中介板及其製法 |
| CN103874321B (zh) * | 2014-02-27 | 2017-11-07 | 京东方科技集团股份有限公司 | 电路板及其制造方法 |
| JP6363854B2 (ja) * | 2014-03-11 | 2018-07-25 | キヤノン株式会社 | 形成方法、および物品の製造方法 |
| KR101454477B1 (ko) | 2014-04-07 | 2014-10-24 | (주) 앤이오플랙스 | 고 다층 인쇄회로기판 및 그 제조방법 |
| JP6075436B2 (ja) * | 2015-11-17 | 2017-02-08 | 大日本印刷株式会社 | サスペンション用基板、サスペンション、素子付サスペンション、ハードディスクドライブおよび支持枠付サスペンション用基板 |
| CN105430869B (zh) * | 2015-11-20 | 2018-06-22 | 广州兴森快捷电路科技有限公司 | Ic测试板高孔位精度加工方法及制作方法 |
| JP6619701B2 (ja) * | 2016-06-20 | 2019-12-11 | 日本電信電話株式会社 | 受光素子およびその製造方法 |
| JP7127995B2 (ja) * | 2018-03-09 | 2022-08-30 | 日東電工株式会社 | 配線基板の製造方法 |
| CN109940284B (zh) * | 2019-01-25 | 2021-04-27 | 武汉铱科赛科技有限公司 | 一种线路板金手指激光切割方法和系统 |
| WO2021030516A1 (en) * | 2019-08-15 | 2021-02-18 | Materion Corporation | Beryllium oxide pedestals |
| CN112648946B (zh) * | 2020-12-02 | 2022-04-12 | 益阳市明正宏电子有限公司 | 一种孔偏检测装置 |
| CN113784545B (zh) * | 2021-09-06 | 2023-05-12 | 大连崇达电路有限公司 | 一种印制板防止树脂塞孔孔破的方法 |
| CN117998753B (zh) * | 2024-04-03 | 2024-06-21 | 淄博芯材集成电路有限责任公司 | 激光钻孔对位方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0766552A (ja) * | 1993-08-23 | 1995-03-10 | Hitachi Ltd | 配線基板の製造方法 |
| DE69835962T2 (de) * | 1997-12-11 | 2007-01-04 | Ibiden Co., Ltd., Ogaki | Verfahren zur herstellung einer mehrschichtigen gedruckten leiterplatte |
| JP3160252B2 (ja) * | 1997-12-11 | 2001-04-25 | イビデン株式会社 | 多層プリント配線板の製造方法 |
| JP4197070B2 (ja) * | 1999-04-01 | 2008-12-17 | イビデン株式会社 | 多層ビルドアップ配線板 |
| US20020109775A1 (en) * | 2001-02-09 | 2002-08-15 | Excellon Automation Co. | Back-lighted fiducial recognition system and method of use |
| JP2003209364A (ja) * | 2002-01-15 | 2003-07-25 | Cmk Corp | 多層プリント配線板の製造方法 |
| JP2003324263A (ja) * | 2002-04-30 | 2003-11-14 | Ngk Spark Plug Co Ltd | プリント配線基板の製造方法 |
| DE10326086B4 (de) * | 2003-06-10 | 2006-04-13 | Infineon Technologies Ag | Verfahren und Justiermarken zur Positionierung eines Messkopfes auf einer Leiterplatte |
-
2008
- 2008-03-18 JP JP2008070492A patent/JP5078687B2/ja not_active Expired - Fee Related
- 2008-03-18 TW TW097109418A patent/TWI396474B/zh not_active IP Right Cessation
- 2008-03-24 CN CN2008100872531A patent/CN101272663B/zh not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI484885B (zh) * | 2013-08-28 | 2015-05-11 | Unimicron Technology Corp | 多層電路板的製作方法 |
| TWI484886B (zh) * | 2013-08-29 | 2015-05-11 | Unimicron Technology Corp | 多層電路板的製作方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101272663B (zh) | 2011-07-20 |
| TWI396474B (zh) | 2013-05-11 |
| CN101272663A (zh) | 2008-09-24 |
| TW200904267A (en) | 2009-01-16 |
| JP2008270768A (ja) | 2008-11-06 |
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