JP5056485B2 - 積層型電子部品およびその製造方法 - Google Patents
積層型電子部品およびその製造方法 Download PDFInfo
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- JP5056485B2 JP5056485B2 JP2008053654A JP2008053654A JP5056485B2 JP 5056485 B2 JP5056485 B2 JP 5056485B2 JP 2008053654 A JP2008053654 A JP 2008053654A JP 2008053654 A JP2008053654 A JP 2008053654A JP 5056485 B2 JP5056485 B2 JP 5056485B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000007747 plating Methods 0.000 claims description 112
- 239000002245 particle Substances 0.000 claims description 79
- 238000000034 method Methods 0.000 claims description 39
- 239000012212 insulator Substances 0.000 claims description 22
- 239000011521 glass Substances 0.000 claims description 19
- 238000005488 sandblasting Methods 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 238000005498 polishing Methods 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 5
- 230000009471 action Effects 0.000 claims description 4
- 239000002244 precipitate Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 22
- 239000010949 copper Substances 0.000 description 20
- 229910000679 solder Inorganic materials 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 7
- 238000004132 cross linking Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000013507 mapping Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 229940005657 pyrophosphoric acid Drugs 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910007472 ZnO—B2O3—SiO2 Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical group [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 1
- IRXRGVFLQOSHOH-UHFFFAOYSA-L dipotassium;oxalate Chemical compound [K+].[K+].[O-]C(=O)C([O-])=O IRXRGVFLQOSHOH-UHFFFAOYSA-L 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Description
導電化率[%]={(内部電極のNiが占める面積+導電性粒子の占める面積)/端面全体の面積}×100
の式から求めた。なお、仮にセラミック成分に導電性粒子と同じ成分が含まれていたとしても、導電性粒子はそれを構成する金属100%と濃度が高いため、明確に判別することができる。このようにして求められた導電化率が表1に示されている。
めっき被覆率[%]={めっき金属の被覆面積/端面全体の面積}×100
の式から求めた。このめっき被覆率は表1の「被覆率」の欄に示されている。
2 絶縁体層
3,4 内部電極
5 積層体
6,7 端面
8,9,8a,9a 外部電極
10 導電性粒子
11 めっき析出物
12 めっき膜
13 中間めっき膜
14 外側めっき膜
21,22 端縁厚膜電極
31,32 主面
Claims (6)
- 相対向する第1および第2の主面と前記第1および第2の主面間を連結する第1および第2の端面ならびに第1および第2の側面とを有する直方体状をなし、積層された複数の絶縁体層と、前記絶縁体層間の界面に沿って形成された複数の内部電極とを含み、複数の前記内部電極の各端部が互いに絶縁された状態で前記第1および第2の端面のいずれかの所定の面に露出している、積層体を用意する工程と、
前記積層体の前記所定の面に露出した複数の前記内部電極の各端部を互いに電気的に接続するように、前記積層体の前記所定の面上に外部電極を形成する工程と、次いで、
前記積層体の前記第1および第2の主面ならびに前記第1および第2の側面の各々における、前記第1および第2の端面に隣接する各端縁部に、金属粉末とガラスフリットとを含む導電性ペーストを塗布し、焼き付けることにより、前記外部電極と導通する端縁厚膜電極を形成する工程と、を含む積層型電子部品の製造方法であって、
前記外部電極を形成する工程は、
前記積層体を用意する工程において用意された前記積層体の前記所定の面の少なくとも前記内部電極が露出していない領域に、粒径が1μm以上の複数の導電性粒子を付着させる工程と、
前記導電性粒子が付着した前記所定の面に直接めっきを施す工程とを備える、積層型電子部品の製造方法。 - 前記導電性粒子を付着させる工程は、前記所定の面に対して、研磨作用を有する研磨用粒子の中に前記導電性粒子を混在させてサンドブラスト法を実施する工程を備える、請求項1に記載の積層型電子部品の製造方法。
- 前記導電性粒子を付着させる工程は、前記所定の面に対して、前記導電性粒子を含む樹脂製の毛先を有するブラシを用いたブラシ研磨法を実施する工程を備える、請求項1に記載の積層型電子部品の製造方法。
- 前記めっきを施す工程の前に、前記積層体の前記所定の面にガラス粒子を付着させる工程、および、前記めっきを施す工程の後に、前記ガラス粒子を構成するガラスを流動または拡散させるように熱処理する工程をさらに備える、請求項1ないし3のいずれかに記載の積層型電子部品の製造方法。
- さらに、前記端縁厚膜電極および前記外部電極の上に、めっきを施すことによって、めっき膜を形成する工程を備える、請求項1ないし4に記載の積層型電子部品の製造方法。
- 相対向する第1および第2の主面と前記第1および第2の主面間を連結する第1および第2の端面ならびに第1および第2の側面とを有する直方体状をなし、積層された複数の絶縁体層と、前記絶縁体層間の界面に沿って形成された複数の内部電極とを含み、複数の前記内部電極の各端部が互いに絶縁された状態で前記第1および第2の端面のいずれかに露出している、積層体と、
前記積層体の前記第1および第2の端面の各々から露出した複数の前記内部電極の各端部を互いに接続するように前記第1および第2の端面上に形成された、実質的にめっき析出物からなる外部電極と、
前記積層体の前記第1および第2の主面ならびに前記第1および第2の側面の各々における、前記第1および第2の端面に隣接する各端縁部に前記外部電極と導通するように形成された、金属粉末とガラスフリットとを含む端縁厚膜電極とを備える、積層型電子部品であって、
前記第1および第2の端面の少なくとも前記内部電極が露出していない領域と前記実質的にめっき析出物からなる外部電極との境界部分には、粒径1μm以上の複数の導電性粒子が分布している、
積層型電子部品。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008053654A JP5056485B2 (ja) | 2008-03-04 | 2008-03-04 | 積層型電子部品およびその製造方法 |
US12/142,924 US7764484B2 (en) | 2008-03-04 | 2008-06-20 | Multilayer electronic component and method for manufacturing the same |
CN2008101274291A CN101527201B (zh) | 2008-03-04 | 2008-06-30 | 层叠型电子部件及其制造方法 |
US12/770,914 US8240016B2 (en) | 2008-03-04 | 2010-04-30 | Method for manufacturing multilayer electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008053654A JP5056485B2 (ja) | 2008-03-04 | 2008-03-04 | 積層型電子部品およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009212298A JP2009212298A (ja) | 2009-09-17 |
JP5056485B2 true JP5056485B2 (ja) | 2012-10-24 |
Family
ID=41053908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008053654A Active JP5056485B2 (ja) | 2008-03-04 | 2008-03-04 | 積層型電子部品およびその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US7764484B2 (ja) |
JP (1) | JP5056485B2 (ja) |
CN (1) | CN101527201B (ja) |
Families Citing this family (27)
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JP5289794B2 (ja) * | 2007-03-28 | 2013-09-11 | 株式会社村田製作所 | 積層型電子部品およびその製造方法 |
JP5056485B2 (ja) * | 2008-03-04 | 2012-10-24 | 株式会社村田製作所 | 積層型電子部品およびその製造方法 |
JP2009283597A (ja) * | 2008-05-21 | 2009-12-03 | Murata Mfg Co Ltd | 積層電子部品およびその製造方法 |
JP2009283598A (ja) * | 2008-05-21 | 2009-12-03 | Murata Mfg Co Ltd | 積層電子部品およびその製造方法 |
JP2010093113A (ja) * | 2008-10-09 | 2010-04-22 | Murata Mfg Co Ltd | 積層型電子部品およびその製造方法 |
JP5707710B2 (ja) * | 2010-03-08 | 2015-04-30 | Tdk株式会社 | 積層型チップ部品 |
JP5589891B2 (ja) * | 2010-05-27 | 2014-09-17 | 株式会社村田製作所 | セラミック電子部品及びその製造方法 |
JP5429067B2 (ja) * | 2010-06-17 | 2014-02-26 | 株式会社村田製作所 | セラミック電子部品およびその製造方法 |
JP5605053B2 (ja) * | 2010-07-26 | 2014-10-15 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法 |
JP2012043841A (ja) * | 2010-08-13 | 2012-03-01 | Murata Mfg Co Ltd | 積層型セラミック電子部品およびその製造方法 |
JP5420060B2 (ja) * | 2010-09-29 | 2014-02-19 | 京セラ株式会社 | コンデンサ |
JP5472230B2 (ja) * | 2011-08-10 | 2014-04-16 | 株式会社村田製作所 | チップ部品構造体及び製造方法 |
US9308945B2 (en) | 2012-04-23 | 2016-04-12 | Global Ip Holdings, Llc | Cargo management system including a vehicle load floor made by a composite, compression molding process and having a wood grain finish |
US9010834B2 (en) | 2012-04-23 | 2015-04-21 | Global Ip Holdings, Llc | Cargo management system for a vehicle and including a pair of opposing cargo trim panels, each of which is made by a composite, compression molding process and has a wood grain finish |
US9126537B2 (en) | 2012-04-23 | 2015-09-08 | Global Ip Holdings, Llc | Cargo management system including an automotive vehicle seat having a cargo trim panel made by a composite, compression molding process and having a wood grain finish |
WO2014175013A1 (ja) * | 2013-04-25 | 2014-10-30 | 株式会社村田製作所 | 導電性ペーストおよび積層セラミック電子部品 |
KR101525676B1 (ko) * | 2013-09-24 | 2015-06-03 | 삼성전기주식회사 | 기판 내장용 적층 세라믹 전자부품, 그 제조방법 및 적층 세라믹 전자부품 내장형 인쇄회로기판 |
KR101514558B1 (ko) * | 2013-10-28 | 2015-04-22 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
TWI580568B (zh) * | 2014-09-03 | 2017-05-01 | Murata Manufacturing Co | Ceramic electronic parts and manufacturing method thereof |
JP6672756B2 (ja) * | 2015-12-04 | 2020-03-25 | 株式会社村田製作所 | 電子部品および電子部品の製造方法 |
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