JP5282678B2 - 積層型電子部品およびその製造方法 - Google Patents
積層型電子部品およびその製造方法 Download PDFInfo
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- JP5282678B2 JP5282678B2 JP2009151730A JP2009151730A JP5282678B2 JP 5282678 B2 JP5282678 B2 JP 5282678B2 JP 2009151730 A JP2009151730 A JP 2009151730A JP 2009151730 A JP2009151730 A JP 2009151730A JP 5282678 B2 JP5282678 B2 JP 5282678B2
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- plating film
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 238000007747 plating Methods 0.000 claims abstract description 127
- 239000012212 insulator Substances 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 21
- 238000009792 diffusion process Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 abstract description 16
- 239000010410 layer Substances 0.000 description 48
- 239000010949 copper Substances 0.000 description 23
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 6
- 239000003985 ceramic capacitor Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000007772 electroless plating Methods 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000013507 mapping Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000003197 catalytic effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 1
- IRXRGVFLQOSHOH-UHFFFAOYSA-L dipotassium;oxalate Chemical compound [K+].[K+].[O-]C(=O)C([O-])=O IRXRGVFLQOSHOH-UHFFFAOYSA-L 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
- C23C18/1692—Heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Electroplating Methods And Accessories (AREA)
Description
被覆率=(Niめっき膜の面積)/(積層体の端面の面積)
の式に基づき算出し、試料数10個についての平均値を求めた。これが表1の「平均被覆率」の欄に示されている。
2 絶縁体層
3,4 内部電極
5 積層体
6,7 端面
8,9,8a,9a 外部電極
10 めっき膜
11 相互拡散層
Claims (2)
- 積層された複数の絶縁体層および前記絶縁体層間の界面に沿って形成されたNiを主成分とする複数の内部電極を含み、前記内部電極の各端部が所定の面に露出している、積層体を用意する工程と、
前記積層体の前記所定の面に露出した複数の前記内部電極の各端部を互いに電気的に接続するように、前記積層体の前記所定の面上に外部電極を形成する工程と
を含む、積層型電子部品の製造方法であって、
前記外部電極を形成する工程は、
前記積層体を用意する工程において用意された前記積層体の前記所定の面に露出した複数の前記内部電極の各端部にCuを主成分とするめっき析出物を析出させ、かつ前記めっき析出物が相互に接続されるように前記めっき析出物をめっき成長させ、それによって、Cuを主成分とする連続しためっき膜を形成するようにめっきする、めっき工程と、
前記めっき膜が形成された前記積層体を熱処理する、熱処理工程と
を備え、
前記熱処理工程での熱処理条件は、前記めっき膜の連続性が保たれながら、前記内部電極と前記めっき膜との境界部分に、前記めっき膜に含まれる金属成分および前記内部電極に含まれる金属成分の双方が検出され得る相互拡散層が形成され、前記相互拡散層は、前記内部電極側および前記めっき膜側の双方にまで延びるように形成され、前記内部電極側においては、前記積層体の前記所定の面から0.5〜1.9μm離れた位置にまで達するように選ばれる、
積層型電子部品の製造方法。 - 積層された複数の絶縁体層および前記絶縁体層間の界面に沿って形成されたNiを主成分とする複数の内部電極を含み、前記内部電極の各端部が所定の面に露出している、積層体と、
前記積層体の前記所定の面上に形成される、外部電極と
を備え、
前記外部電極は、前記積層体の前記所定の面に露出した複数の前記内部電極の各端部を互いに電気的に接続するように、前記積層体の前記所定の面に直接形成される、Cuを主成分とする連続しためっき膜を含み、
前記内部電極と前記めっき膜との境界部分には、前記めっき膜に含まれる金属成分および前記内部電極に含まれる金属成分の双方が検出され得る相互拡散層が形成されていて、前記相互拡散層は、前記内部電極側および前記めっき膜側の双方にまで延びるように形成され、前記内部電極側においては、前記積層体の前記所定の面から0.5〜1.9μm離れた位置にまで達している、
積層型電子部品。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009151730A JP5282678B2 (ja) | 2009-06-26 | 2009-06-26 | 積層型電子部品およびその製造方法 |
US12/817,352 US8320101B2 (en) | 2009-06-26 | 2010-06-17 | Multilayer electronic component and method for manufacturing the same |
CN201010214569XA CN101937772B (zh) | 2009-06-26 | 2010-06-25 | 层叠型电子元件及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009151730A JP5282678B2 (ja) | 2009-06-26 | 2009-06-26 | 積層型電子部品およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011009478A JP2011009478A (ja) | 2011-01-13 |
JP5282678B2 true JP5282678B2 (ja) | 2013-09-04 |
Family
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JP2009151730A Active JP5282678B2 (ja) | 2009-06-26 | 2009-06-26 | 積層型電子部品およびその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8320101B2 (ja) |
JP (1) | JP5282678B2 (ja) |
CN (1) | CN101937772B (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5127703B2 (ja) * | 2006-11-15 | 2013-01-23 | 株式会社村田製作所 | 積層型電子部品およびその製造方法 |
JP5332475B2 (ja) * | 2008-10-03 | 2013-11-06 | 株式会社村田製作所 | 積層セラミック電子部品およびその製造方法 |
JP2012199353A (ja) * | 2011-03-22 | 2012-10-18 | Murata Mfg Co Ltd | 積層セラミック電子部品およびその製造方法 |
US9490055B2 (en) * | 2011-10-31 | 2016-11-08 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and manufacturing method thereof |
JP5682548B2 (ja) * | 2011-12-14 | 2015-03-11 | 株式会社村田製作所 | 積層型インダクタ素子およびその製造方法 |
JP5998785B2 (ja) * | 2012-09-19 | 2016-09-28 | Tdk株式会社 | 積層電子部品 |
CN106688067B (zh) * | 2014-09-03 | 2019-06-07 | 株式会社村田制作所 | 陶瓷电子部件及其制造方法 |
KR102107030B1 (ko) * | 2014-09-24 | 2020-05-07 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그 제조방법 |
JP6679964B2 (ja) * | 2015-03-12 | 2020-04-15 | 株式会社村田製作所 | 積層セラミックコンデンサ |
US9892854B2 (en) | 2015-03-12 | 2018-02-13 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor and method for manufacturing the same |
KR102586070B1 (ko) * | 2018-10-10 | 2023-10-05 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
EP3883014A4 (en) * | 2018-11-16 | 2024-04-17 | Murata Manufacturing Co., Ltd. | SOLID-STATE BATTERY |
KR102333093B1 (ko) * | 2019-07-08 | 2021-12-01 | 삼성전기주식회사 | 커패시터 부품 |
JP7544627B2 (ja) * | 2021-03-08 | 2024-09-03 | Tdk株式会社 | セラミック電子部品 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63169014A (ja) * | 1987-01-06 | 1988-07-13 | 松下電器産業株式会社 | チツプコンデンサ−の外部電極端子の形成方法 |
JPH0329307A (ja) * | 1989-06-26 | 1991-02-07 | Matsushita Electric Ind Co Ltd | 積層セラミックチップコンデンサーの製造方法 |
JP2002008938A (ja) * | 2000-06-23 | 2002-01-11 | Kyocera Corp | 積層型電子部品およびその製法 |
TWI260657B (en) * | 2002-04-15 | 2006-08-21 | Avx Corp | Plated terminations |
US7463474B2 (en) * | 2002-04-15 | 2008-12-09 | Avx Corporation | System and method of plating ball grid array and isolation features for electronic components |
US7152291B2 (en) * | 2002-04-15 | 2006-12-26 | Avx Corporation | Method for forming plated terminations |
US7177137B2 (en) * | 2002-04-15 | 2007-02-13 | Avx Corporation | Plated terminations |
US6982863B2 (en) * | 2002-04-15 | 2006-01-03 | Avx Corporation | Component formation via plating technology |
US6960366B2 (en) * | 2002-04-15 | 2005-11-01 | Avx Corporation | Plated terminations |
US7576968B2 (en) * | 2002-04-15 | 2009-08-18 | Avx Corporation | Plated terminations and method of forming using electrolytic plating |
US7345868B2 (en) * | 2002-10-07 | 2008-03-18 | Presidio Components, Inc. | Multilayer ceramic capacitor with terminal formed by electroless plating |
US7206187B2 (en) * | 2004-08-23 | 2007-04-17 | Kyocera Corporation | Ceramic electronic component and its manufacturing method |
WO2007049456A1 (ja) * | 2005-10-28 | 2007-05-03 | Murata Manufacturing Co., Ltd. | 積層型電子部品およびその製造方法 |
WO2007097180A1 (ja) * | 2006-02-27 | 2007-08-30 | Murata Manufacturing Co., Ltd. | 積層型電子部品およびその製造方法 |
JP5127703B2 (ja) * | 2006-11-15 | 2013-01-23 | 株式会社村田製作所 | 積層型電子部品およびその製造方法 |
JP5217609B2 (ja) * | 2008-05-12 | 2013-06-19 | 株式会社村田製作所 | 積層セラミック電子部品およびその製造方法 |
JP2009277715A (ja) * | 2008-05-12 | 2009-11-26 | Murata Mfg Co Ltd | 積層セラミック電子部品およびその製造方法 |
JP5115349B2 (ja) * | 2008-06-13 | 2013-01-09 | 株式会社村田製作所 | 積層セラミック電子部品およびその製造方法 |
JP5282634B2 (ja) * | 2008-06-25 | 2013-09-04 | 株式会社村田製作所 | 積層セラミック電子部品およびその製造方法 |
-
2009
- 2009-06-26 JP JP2009151730A patent/JP5282678B2/ja active Active
-
2010
- 2010-06-17 US US12/817,352 patent/US8320101B2/en active Active
- 2010-06-25 CN CN201010214569XA patent/CN101937772B/zh active Active
Also Published As
Publication number | Publication date |
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US20100328842A1 (en) | 2010-12-30 |
US8320101B2 (en) | 2012-11-27 |
JP2011009478A (ja) | 2011-01-13 |
CN101937772A (zh) | 2011-01-05 |
CN101937772B (zh) | 2012-07-25 |
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