JP2010093112A - 積層型電子部品およびその製造方法 - Google Patents
積層型電子部品およびその製造方法 Download PDFInfo
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- JP2010093112A JP2010093112A JP2008262731A JP2008262731A JP2010093112A JP 2010093112 A JP2010093112 A JP 2010093112A JP 2008262731 A JP2008262731 A JP 2008262731A JP 2008262731 A JP2008262731 A JP 2008262731A JP 2010093112 A JP2010093112 A JP 2010093112A
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- JP
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- Prior art keywords
- plating
- electronic component
- laminate
- multilayer electronic
- internal electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000007747 plating Methods 0.000 claims abstract description 102
- 229910052751 metal Inorganic materials 0.000 claims abstract description 49
- 239000002184 metal Substances 0.000 claims abstract description 49
- 239000010953 base metal Substances 0.000 claims abstract description 10
- 238000000151 deposition Methods 0.000 claims abstract description 10
- 229910052737 gold Inorganic materials 0.000 claims abstract description 9
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 8
- 229910052709 silver Inorganic materials 0.000 claims abstract description 8
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims abstract description 5
- 229910021645 metal ion Inorganic materials 0.000 claims abstract description 5
- 150000004696 coordination complex Chemical class 0.000 claims abstract description 4
- 239000012212 insulator Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 230000008021 deposition Effects 0.000 abstract description 6
- 238000007598 dipping method Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 90
- 239000010949 copper Substances 0.000 description 19
- 239000003990 capacitor Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000007772 electroless plating Methods 0.000 description 6
- 239000003638 chemical reducing agent Substances 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 230000003197 catalytic effect Effects 0.000 description 4
- 229910000510 noble metal Inorganic materials 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 238000005273 aeration Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- VZOPRCCTKLAGPN-ZFJVMAEJSA-L potassium;sodium;(2r,3r)-2,3-dihydroxybutanedioate;tetrahydrate Chemical compound O.O.O.O.[Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O VZOPRCCTKLAGPN-ZFJVMAEJSA-L 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229940074446 sodium potassium tartrate tetrahydrate Drugs 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
【解決手段】
前記積層体を、金属イオンまたは金属錯体を含む液体に浸漬することにより、前記内部電極の各端部をPd、Au、PtおよびAgから選ばれる少なくとも一種を主成分とする厚み0.1μm以上の金属膜で被覆する工程と、前記積層体の前記所定の面に露出した複数の前記内部電極の各端部にめっき析出物を析出させ、かつ前記めっき析出物が相互に接続されるように前記めっき析出物をめっき成長させ、それによって、連続しためっき層を形成するよう、前記内部電極の各端部を互いに電気的に接続するめっき層を形成する工程と、を備える。
【選択図】図5
Description
ホルムアルデヒド: 0.16mol/L
酒石酸ナトリウムカリウム4水和物: 0.1mol/L
ポリエチレングリコール: 1.0g/L
水酸化ナトリウム: 0.125mol/L
エアレーション: 0.5L/min
第1のめっき層の形成された積層チップコンデンサの試料100個において、端面6または7を光学顕微鏡にて観察した。これにより、Cuめっき層で被覆されていない箇所の面積比率が5%以上であった試料を不良とし、その個数を計数した。結果を表1に示す。
2 積層体
3 絶縁体層
4,5 内部電極
6,7 端面
8,9 第1のめっき層
10,11 第2のめっき層
12,13 第3のめっき層
21 金属膜
31 めっき析出物
Claims (4)
- 積層された複数の絶縁体層および前記絶縁体層間の界面に沿って形成された卑金属を主成分とする複数の内部電極を含み、前記内部電極の各端部が所定の面に露出している、積層体と、前記積層体の前記所定の面上に直接形成され、前記内部電極の各端部を互いに電気的に接続するめっき層と、を備える積層型電子部品において、
前記内部電極の各端部が、Pd、Au、PtおよびAgから選ばれる少なくとも一種を主成分とする厚み0.1μm以上の金属膜に被覆されていることを特徴とする、積層型電子部品。 - 前記内部電極を構成する主成分金属がNiまたはCuであることを特徴とする、請求項1に記載の積層型電子部品。
- 積層された複数の絶縁体層および前記絶縁体層間の界面に沿って形成された卑金属を主成分とする複数の内部電極を含み、前記内部電極の各端部が所定の面に露出している、積層体を用意する工程と、
前記積層体を、金属イオンまたは金属錯体を含む液体に浸漬することにより、前記内部電極の各端部をPd、Au、PtおよびAgから選ばれる少なくとも一種を主成分とする厚み0.1μm以上の金属膜で被覆する工程と、
前記積層体の前記所定の面に露出した複数の前記内部電極の各端部にめっき析出物を析出させ、かつ前記めっき析出物が相互に接続されるように前記めっき析出物をめっき成長させ、それによって、連続しためっき層を形成するよう、前記内部電極の各端部を互いに電気的に接続するめっき層を形成する工程と、
を備える、積層型電子部品の製造方法。 - 前記内部電極を構成する主成分金属がNiまたはCuであることを特徴とする、請求項3に記載の積層型電子部品。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008262731A JP5493328B2 (ja) | 2008-10-09 | 2008-10-09 | 積層型電子部品の製造方法 |
US12/543,549 US9111690B2 (en) | 2008-10-09 | 2009-08-19 | Multilayer electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008262731A JP5493328B2 (ja) | 2008-10-09 | 2008-10-09 | 積層型電子部品の製造方法 |
Related Child Applications (1)
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JP2013269833A Division JP5783242B2 (ja) | 2013-12-26 | 2013-12-26 | 積層型電子部品 |
Publications (2)
Publication Number | Publication Date |
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JP2010093112A true JP2010093112A (ja) | 2010-04-22 |
JP5493328B2 JP5493328B2 (ja) | 2014-05-14 |
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US (1) | US9111690B2 (ja) |
JP (1) | JP5493328B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10971456B2 (en) | 2017-06-01 | 2021-04-06 | Murata Manufacturing Co., Ltd. | Electronic component |
US11195660B2 (en) | 2018-10-10 | 2021-12-07 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component, and mounting structure for multilayer ceramic electronic component |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102543438B (zh) * | 2011-12-07 | 2014-04-16 | 厦门法拉电子股份有限公司 | 一种叠片式金属化薄膜电容器的电极结构 |
JP2016012689A (ja) * | 2014-06-30 | 2016-01-21 | 株式会社村田製作所 | セラミック電子部品 |
KR102463330B1 (ko) * | 2017-10-17 | 2022-11-04 | 삼성전기주식회사 | 코일 전자 부품 |
KR102538911B1 (ko) * | 2018-02-08 | 2023-06-01 | 삼성전기주식회사 | 인덕터 |
JP7102256B2 (ja) * | 2018-06-27 | 2022-07-19 | 株式会社村田製作所 | 積層セラミック電子部品 |
KR102527705B1 (ko) * | 2018-10-10 | 2023-05-02 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
JP2022090195A (ja) * | 2020-12-07 | 2022-06-17 | 太陽誘電株式会社 | セラミック電子部品、実装基板およびセラミック電子部品の製造方法 |
KR20230103495A (ko) * | 2021-12-31 | 2023-07-07 | 삼성전기주식회사 | 적층형 커패시터 |
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JP2000138129A (ja) * | 1998-10-30 | 2000-05-16 | Kyocera Corp | 積層セラミックコンデンサおよびその製造方法 |
JP2002008938A (ja) * | 2000-06-23 | 2002-01-11 | Kyocera Corp | 積層型電子部品およびその製法 |
WO2007105395A1 (ja) * | 2006-03-14 | 2007-09-20 | Murata Manufacturing Co., Ltd. | 積層型電子部品の製造方法 |
WO2008059666A1 (en) * | 2006-11-15 | 2008-05-22 | Murata Manufacturing Co., Ltd. | Laminated electronic component and method for manufacturing the same |
Family Cites Families (15)
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JP3330836B2 (ja) * | 1997-01-22 | 2002-09-30 | 太陽誘電株式会社 | 積層電子部品の製造方法 |
JP2000306763A (ja) | 1999-04-19 | 2000-11-02 | Matsushita Electric Ind Co Ltd | 積層セラミックコンデンサとその製造方法 |
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US7576968B2 (en) | 2002-04-15 | 2009-08-18 | Avx Corporation | Plated terminations and method of forming using electrolytic plating |
US6982863B2 (en) | 2002-04-15 | 2006-01-03 | Avx Corporation | Component formation via plating technology |
US7152291B2 (en) | 2002-04-15 | 2006-12-26 | Avx Corporation | Method for forming plated terminations |
US7345868B2 (en) | 2002-10-07 | 2008-03-18 | Presidio Components, Inc. | Multilayer ceramic capacitor with terminal formed by electroless plating |
JP2006332601A (ja) | 2005-04-27 | 2006-12-07 | Kyocera Corp | 積層電子部品 |
US7329976B2 (en) | 2005-04-27 | 2008-02-12 | Kyocera Corporation | Laminated electronic component |
KR100944099B1 (ko) | 2005-10-28 | 2010-02-24 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층형 전자부품 및 그 제조방법 |
WO2007097180A1 (ja) | 2006-02-27 | 2007-08-30 | Murata Manufacturing Co., Ltd. | 積層型電子部品およびその製造方法 |
WO2008062602A1 (fr) * | 2006-11-22 | 2008-05-29 | Murata Manufacturing Co., Ltd. | Composant électronique stratifié, et procédé pour sa fabrication |
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2008
- 2008-10-09 JP JP2008262731A patent/JP5493328B2/ja active Active
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2009
- 2009-08-19 US US12/543,549 patent/US9111690B2/en active Active
Patent Citations (5)
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JPS63169014A (ja) * | 1987-01-06 | 1988-07-13 | 松下電器産業株式会社 | チツプコンデンサ−の外部電極端子の形成方法 |
JP2000138129A (ja) * | 1998-10-30 | 2000-05-16 | Kyocera Corp | 積層セラミックコンデンサおよびその製造方法 |
JP2002008938A (ja) * | 2000-06-23 | 2002-01-11 | Kyocera Corp | 積層型電子部品およびその製法 |
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WO2008059666A1 (en) * | 2006-11-15 | 2008-05-22 | Murata Manufacturing Co., Ltd. | Laminated electronic component and method for manufacturing the same |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10971456B2 (en) | 2017-06-01 | 2021-04-06 | Murata Manufacturing Co., Ltd. | Electronic component |
US11195660B2 (en) | 2018-10-10 | 2021-12-07 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component, and mounting structure for multilayer ceramic electronic component |
Also Published As
Publication number | Publication date |
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JP5493328B2 (ja) | 2014-05-14 |
US9111690B2 (en) | 2015-08-18 |
US20100091426A1 (en) | 2010-04-15 |
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