JP5054440B2 - 電子部品内蔵基板の製造方法及び電子部品内蔵基板 - Google Patents

電子部品内蔵基板の製造方法及び電子部品内蔵基板 Download PDF

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JP5054440B2
JP5054440B2 JP2007159223A JP2007159223A JP5054440B2 JP 5054440 B2 JP5054440 B2 JP 5054440B2 JP 2007159223 A JP2007159223 A JP 2007159223A JP 2007159223 A JP2007159223 A JP 2007159223A JP 5054440 B2 JP5054440 B2 JP 5054440B2
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Prior art keywords
substrate
electronic component
hole
resin
sealing resin
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JP2008311520A (ja
JP2008311520A5 (enExample
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信幸 倉嶋
直 荒井
肇 飯塚
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2007159223A priority Critical patent/JP5054440B2/ja
Priority to US12/137,867 priority patent/US7827681B2/en
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    • H05K1/00—Printed circuits
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    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
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    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2007159223A 2007-06-15 2007-06-15 電子部品内蔵基板の製造方法及び電子部品内蔵基板 Active JP5054440B2 (ja)

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US12/137,867 US7827681B2 (en) 2007-06-15 2008-06-12 Method of manufacturing electronic component integrated substrate

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JP5593715B2 (ja) * 2010-02-01 2014-09-24 大日本印刷株式会社 パッケージ化半導体装置、パッケージ化半導体装置の製造方法
JP6044473B2 (ja) * 2013-06-28 2016-12-14 株式会社デンソー 電子装置およびその電子装置の製造方法
KR20150025129A (ko) * 2013-08-28 2015-03-10 삼성전기주식회사 전자 소자 모듈 및 그 제조 방법
KR101983168B1 (ko) 2014-04-08 2019-05-28 삼성전기주식회사 전자 소자 모듈 및 그 제조 방법
US10356911B2 (en) * 2014-07-04 2019-07-16 Samsung Electro-Mechanics Co., Ltd. Electronic device module and method of manufacturing the same
US9859200B2 (en) * 2014-12-29 2018-01-02 STATS ChipPAC Pte. Ltd. Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof
JP6566879B2 (ja) * 2016-01-28 2019-08-28 新光電気工業株式会社 電子部品内蔵基板
JP7257978B2 (ja) * 2020-01-20 2023-04-14 三菱電機株式会社 半導体装置
CN111328215B (zh) * 2020-02-21 2021-06-18 竞华电子(深圳)有限公司 印制电路板制造方法及印制电路板

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JP2944449B2 (ja) * 1995-02-24 1999-09-06 日本電気株式会社 半導体パッケージとその製造方法
JP2790122B2 (ja) * 1996-05-31 1998-08-27 日本電気株式会社 積層回路基板
JP4319759B2 (ja) * 2000-03-21 2009-08-26 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP2003347722A (ja) 2002-05-23 2003-12-05 Ibiden Co Ltd 多層電子部品搭載用基板及びその製造方法
JP2004039867A (ja) * 2002-07-03 2004-02-05 Sony Corp 多層配線回路モジュール及びその製造方法
JP2006120935A (ja) * 2004-10-22 2006-05-11 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
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