JP5028800B2 - 高硬度導電性ダイヤモンド多結晶体およびその製造方法 - Google Patents

高硬度導電性ダイヤモンド多結晶体およびその製造方法 Download PDF

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JP5028800B2
JP5028800B2 JP2005516815A JP2005516815A JP5028800B2 JP 5028800 B2 JP5028800 B2 JP 5028800B2 JP 2005516815 A JP2005516815 A JP 2005516815A JP 2005516815 A JP2005516815 A JP 2005516815A JP 5028800 B2 JP5028800 B2 JP 5028800B2
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diamond
less
boron
hardness
graphite
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JPWO2005065809A1 (ja
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均 角谷
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Sumitomo Electric Industries Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/06Processes using ultra-high pressure, e.g. for the formation of diamonds; Apparatus therefor, e.g. moulds or dies
    • B01J3/062Processes using ultra-high pressure, e.g. for the formation of diamonds; Apparatus therefor, e.g. moulds or dies characterised by the composition of the materials to be processed
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
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    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00Carbon; Compounds thereof
    • C01B32/25Diamond
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    • C04B35/515Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
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    • C04B35/626Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
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    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B01J2203/00Processes utilising sub- or super atmospheric pressure
    • B01J2203/06High pressure synthesis
    • B01J2203/065Composition of the material produced
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  • Crystallography & Structural Chemistry (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)
  • Carbon And Carbon Compounds (AREA)
JP2005516815A 2003-12-11 2004-12-03 高硬度導電性ダイヤモンド多結晶体およびその製造方法 Expired - Lifetime JP5028800B2 (ja)

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JP2003412648 2003-12-11
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PCT/JP2004/018011 WO2005065809A1 (ja) 2003-12-11 2004-12-03 高硬度導電性ダイヤモンド多結晶体およびその製造方法
JP2005516815A JP5028800B2 (ja) 2003-12-11 2004-12-03 高硬度導電性ダイヤモンド多結晶体およびその製造方法

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US8727046B2 (en) 2011-04-15 2014-05-20 Us Synthetic Corporation Polycrystalline diamond compacts including at least one transition layer and methods for stress management in polycrsystalline diamond compacts
US9193038B2 (en) 2011-12-09 2015-11-24 Smith International Inc. Method for forming a cutting element and downhole tools incorporating the same
US9254554B1 (en) 2012-02-16 2016-02-09 Us Synthetic Corporation Polycrystalline diamond compact including substantially single-phase polycrystalline diamond body, methods of making same, and applications therefor
JP6015129B2 (ja) * 2012-05-24 2016-10-26 住友電気工業株式会社 多結晶ダイヤモンド砥粒およびその製造方法、スラリー、ならびに固定砥粒式ワイヤ
JP6019751B2 (ja) * 2012-05-24 2016-11-02 住友電気工業株式会社 多結晶ダイヤモンド砥粒およびその製造方法、スラリー、ならびに固定砥粒式ワイヤ
JP6098050B2 (ja) * 2012-07-02 2017-03-22 住友電気工業株式会社 複合多結晶ダイヤモンドおよびその製造方法
JP6007762B2 (ja) * 2012-12-06 2016-10-12 住友電気工業株式会社 ダイヤモンド多結晶体およびその製造方法、ならびに工具
JP6056431B2 (ja) * 2012-12-06 2017-01-11 住友電気工業株式会社 ダイヤモンド多結晶体および工具
JP6261000B2 (ja) * 2013-12-24 2018-01-17 トーメイダイヤ株式会社 制御された導電性/電気抵抗を有するダイヤモンド及びその製法
JP6390152B2 (ja) 2014-04-30 2018-09-19 住友電気工業株式会社 複合焼結体
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JP6798283B2 (ja) * 2016-11-30 2020-12-09 住友電気工業株式会社 多結晶ダイヤモンドおよびその製造方法、スクライブツール、スクライブホイール、ドレッサー、回転工具、伸線ダイス、切削工具、電極ならびに多結晶ダイヤモンドを用いた加工方法
JP6743666B2 (ja) * 2016-11-30 2020-08-19 住友電気工業株式会社 多結晶ダイヤモンドおよびその製造方法、スクライブツール、スクライブホイール、ドレッサー、回転工具、ウォータージェット用オリフィス、伸線ダイス、切削工具、電極ならびに多結晶ダイヤモンドを用いた加工方法
JP7010237B2 (ja) * 2016-11-30 2022-02-10 住友電気工業株式会社 多結晶ダイヤモンドおよびその製造方法、スクライブツール、スクライブホイール、ドレッサー、回転工具、伸線ダイス、切削工具、電極、ならびに多結晶ダイヤモンドを用いた加工方法
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