JP5020123B2 - 配線基板の製造方法 - Google Patents

配線基板の製造方法 Download PDF

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Publication number
JP5020123B2
JP5020123B2 JP2008052353A JP2008052353A JP5020123B2 JP 5020123 B2 JP5020123 B2 JP 5020123B2 JP 2008052353 A JP2008052353 A JP 2008052353A JP 2008052353 A JP2008052353 A JP 2008052353A JP 5020123 B2 JP5020123 B2 JP 5020123B2
Authority
JP
Japan
Prior art keywords
conductor pattern
wiring board
layer
exposed
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008052353A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009212228A5 (enExample
JP2009212228A (ja
Inventor
克哉 深瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2008052353A priority Critical patent/JP5020123B2/ja
Priority to US12/395,885 priority patent/US8166648B2/en
Publication of JP2009212228A publication Critical patent/JP2009212228A/ja
Publication of JP2009212228A5 publication Critical patent/JP2009212228A5/ja
Application granted granted Critical
Publication of JP5020123B2 publication Critical patent/JP5020123B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0597—Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y10T29/4916—Simultaneous circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2008052353A 2008-03-03 2008-03-03 配線基板の製造方法 Expired - Fee Related JP5020123B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008052353A JP5020123B2 (ja) 2008-03-03 2008-03-03 配線基板の製造方法
US12/395,885 US8166648B2 (en) 2008-03-03 2009-03-02 Method of manufacturing a wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008052353A JP5020123B2 (ja) 2008-03-03 2008-03-03 配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2009212228A JP2009212228A (ja) 2009-09-17
JP2009212228A5 JP2009212228A5 (enExample) 2011-02-24
JP5020123B2 true JP5020123B2 (ja) 2012-09-05

Family

ID=41012302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008052353A Expired - Fee Related JP5020123B2 (ja) 2008-03-03 2008-03-03 配線基板の製造方法

Country Status (2)

Country Link
US (1) US8166648B2 (enExample)
JP (1) JP5020123B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4972601B2 (ja) * 2008-04-09 2012-07-11 新光電気工業株式会社 配線基板の製造方法
WO2012029910A1 (ja) * 2010-09-03 2012-03-08 日亜化学工業株式会社 発光装置、回路基板、発光装置用パッケージアレイ、及び発光装置用パッケージアレイの製造方法
CN103229605B (zh) 2011-07-25 2016-06-08 日本特殊陶业株式会社 布线基板
JP5502139B2 (ja) 2012-05-16 2014-05-28 日本特殊陶業株式会社 配線基板
JP5341227B1 (ja) 2012-05-16 2013-11-13 日本特殊陶業株式会社 配線基板
JP5762376B2 (ja) 2012-09-21 2015-08-12 日本特殊陶業株式会社 配線基板及びその製造方法
JP6081875B2 (ja) * 2013-04-28 2017-02-15 京セラ株式会社 配線基板の製造方法
DE102013215588A1 (de) * 2013-08-07 2015-02-12 Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg Leiterplattenanordnung, Steuervorrichtung für ein Kühlerlüftermodul und Verfahren
KR20230094663A (ko) * 2021-12-21 2023-06-28 삼성전기주식회사 인쇄회로기판 및 그 제조방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6379677U (enExample) * 1986-11-12 1988-05-26
JPH04273464A (ja) * 1991-02-28 1992-09-29 Furukawa Electric Co Ltd:The 半導体チップのマウント方法
JP2907168B2 (ja) * 1996-12-20 1999-06-21 日本電気株式会社 半導体装置および半導体装置と基板の接合構造
JP4087876B2 (ja) 1998-08-10 2008-05-21 富士通株式会社 ハンダバンプの形成方法
WO2000010369A1 (en) * 1998-08-10 2000-02-24 Fujitsu Limited Method of forming solder bump, method of mounting electronic device, and mounting structure of electronic device
JP2001053111A (ja) * 1999-08-10 2001-02-23 Matsushita Electric Works Ltd フリップチップ実装構造
JP3448025B2 (ja) * 2000-10-31 2003-09-16 松下電器産業株式会社 半導体装置の製造方法
US7687917B2 (en) * 2002-05-08 2010-03-30 Nec Electronics Corporation Single damascene structure semiconductor device having silicon-diffused metal wiring layer
JP2006351559A (ja) * 2003-06-23 2006-12-28 Shinko Electric Ind Co Ltd 配線基板および配線基板への半導体チップ実装構造
JP4006409B2 (ja) 2004-03-17 2007-11-14 新光電気工業株式会社 配線基板の製造方法

Also Published As

Publication number Publication date
US20090218122A1 (en) 2009-09-03
US8166648B2 (en) 2012-05-01
JP2009212228A (ja) 2009-09-17

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