JP2009212228A5 - - Google Patents

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Publication number
JP2009212228A5
JP2009212228A5 JP2008052353A JP2008052353A JP2009212228A5 JP 2009212228 A5 JP2009212228 A5 JP 2009212228A5 JP 2008052353 A JP2008052353 A JP 2008052353A JP 2008052353 A JP2008052353 A JP 2008052353A JP 2009212228 A5 JP2009212228 A5 JP 2009212228A5
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JP
Japan
Prior art keywords
conductor pattern
wiring board
metal brazing
metal
brazing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008052353A
Other languages
English (en)
Japanese (ja)
Other versions
JP5020123B2 (ja
JP2009212228A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008052353A priority Critical patent/JP5020123B2/ja
Priority claimed from JP2008052353A external-priority patent/JP5020123B2/ja
Priority to US12/395,885 priority patent/US8166648B2/en
Publication of JP2009212228A publication Critical patent/JP2009212228A/ja
Publication of JP2009212228A5 publication Critical patent/JP2009212228A5/ja
Application granted granted Critical
Publication of JP5020123B2 publication Critical patent/JP5020123B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008052353A 2008-03-03 2008-03-03 配線基板の製造方法 Expired - Fee Related JP5020123B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008052353A JP5020123B2 (ja) 2008-03-03 2008-03-03 配線基板の製造方法
US12/395,885 US8166648B2 (en) 2008-03-03 2009-03-02 Method of manufacturing a wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008052353A JP5020123B2 (ja) 2008-03-03 2008-03-03 配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2009212228A JP2009212228A (ja) 2009-09-17
JP2009212228A5 true JP2009212228A5 (enExample) 2011-02-24
JP5020123B2 JP5020123B2 (ja) 2012-09-05

Family

ID=41012302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008052353A Expired - Fee Related JP5020123B2 (ja) 2008-03-03 2008-03-03 配線基板の製造方法

Country Status (2)

Country Link
US (1) US8166648B2 (enExample)
JP (1) JP5020123B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4972601B2 (ja) * 2008-04-09 2012-07-11 新光電気工業株式会社 配線基板の製造方法
WO2012029910A1 (ja) * 2010-09-03 2012-03-08 日亜化学工業株式会社 発光装置、回路基板、発光装置用パッケージアレイ、及び発光装置用パッケージアレイの製造方法
US9485853B2 (en) 2011-07-25 2016-11-01 Ngk Spark Plug Co., Ltd. Wiring substrate having a plurality of connection terminals and a filling member provided therebetween
JP5502139B2 (ja) 2012-05-16 2014-05-28 日本特殊陶業株式会社 配線基板
JP5341227B1 (ja) 2012-05-16 2013-11-13 日本特殊陶業株式会社 配線基板
JP5762376B2 (ja) 2012-09-21 2015-08-12 日本特殊陶業株式会社 配線基板及びその製造方法
JP6081875B2 (ja) * 2013-04-28 2017-02-15 京セラ株式会社 配線基板の製造方法
DE102013215588A1 (de) * 2013-08-07 2015-02-12 Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg Leiterplattenanordnung, Steuervorrichtung für ein Kühlerlüftermodul und Verfahren
KR20230094663A (ko) * 2021-12-21 2023-06-28 삼성전기주식회사 인쇄회로기판 및 그 제조방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6379677U (enExample) * 1986-11-12 1988-05-26
JPH04273464A (ja) * 1991-02-28 1992-09-29 Furukawa Electric Co Ltd:The 半導体チップのマウント方法
JP2907168B2 (ja) * 1996-12-20 1999-06-21 日本電気株式会社 半導体装置および半導体装置と基板の接合構造
JP4087876B2 (ja) 1998-08-10 2008-05-21 富士通株式会社 ハンダバンプの形成方法
US6461953B1 (en) * 1998-08-10 2002-10-08 Fujitsu Limited Solder bump forming method, electronic component mounting method, and electronic component mounting structure
JP2001053111A (ja) * 1999-08-10 2001-02-23 Matsushita Electric Works Ltd フリップチップ実装構造
JP3448025B2 (ja) * 2000-10-31 2003-09-16 松下電器産業株式会社 半導体装置の製造方法
US7687917B2 (en) * 2002-05-08 2010-03-30 Nec Electronics Corporation Single damascene structure semiconductor device having silicon-diffused metal wiring layer
JP2006351559A (ja) * 2003-06-23 2006-12-28 Shinko Electric Ind Co Ltd 配線基板および配線基板への半導体チップ実装構造
JP4006409B2 (ja) 2004-03-17 2007-11-14 新光電気工業株式会社 配線基板の製造方法

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