WO2012029910A1 - 発光装置、回路基板、発光装置用パッケージアレイ、及び発光装置用パッケージアレイの製造方法 - Google Patents
発光装置、回路基板、発光装置用パッケージアレイ、及び発光装置用パッケージアレイの製造方法 Download PDFInfo
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- WO2012029910A1 WO2012029910A1 PCT/JP2011/069915 JP2011069915W WO2012029910A1 WO 2012029910 A1 WO2012029910 A1 WO 2012029910A1 JP 2011069915 W JP2011069915 W JP 2011069915W WO 2012029910 A1 WO2012029910 A1 WO 2012029910A1
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- Prior art keywords
- light emitting
- frame
- emitting device
- exposed
- thick
- Prior art date
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Definitions
- the technology disclosed herein relates to a light emitting device including a light emitting element and a circuit board including the light emitting device and a mounting substrate.
- a light-emitting device including a light-emitting element and a package on which the light-emitting element is mounted is known (for example, see Patent Document 1).
- the package includes a molded body made of, for example, a resin, and metal lead portions embedded in the molded body.
- the lead portion includes a placement portion on which the light emitting element is placed and a terminal portion connected to the placement portion and connected to the mounting substrate via a solder fillet.
- the technology disclosed herein has been made in view of the above situation, and a light-emitting device, a circuit board, a light-emitting device package array, and a method for manufacturing a light-emitting device package array capable of efficiently dissipating heat from a light-emitting element
- the purpose is to provide.
- a light emitting device disclosed herein includes a light emitting element and a package.
- the package is constituted by a molded body and leads embedded in the molded body.
- the lead includes a placement portion on which the light emitting element is placed, a terminal portion connected to the placement portion, and an exposed portion.
- the package has a light emitting surface, a back surface facing the light emitting surface, and a bottom surface connected to the light emitting surface and the back surface.
- the light emitting element is placed on the light emitting surface side of the placing portion.
- the exposed portion is connected to the back side of the mounting portion and is exposed from the molded body at the bottom surface and the back surface.
- the terminal portion is exposed from the molded body at the bottom surface.
- FIG. 2 is a perspective view of FIG. 1.
- FIG. 3 is a perspective view of FIG. 2.
- 1 is a perspective view of a circuit board 300 according to a first embodiment.
- FIG. 12 is a cross-sectional view taken along line AA in FIG. It is a figure for demonstrating the manufacturing method of the light-emitting device 100 which concerns on 1st Embodiment. It is the see-through
- a light-emitting device that can efficiently dissipate heat from a light-emitting element, and a circuit board that includes the light-emitting device and a mounting substrate will be described. Specifically, the light-emitting device has an exposed portion that functions as a heat sink that promotes heat dissipation from the light-emitting element.
- the configuration of the light-emitting device, the mounting substrate, and the circuit board, and the method for manufacturing the light-emitting device will be sequentially described.
- FIG. 1 is a perspective view of the light emitting device 100 according to the first embodiment as viewed from the front.
- FIG. 2 is a perspective view of the light emitting device 100 according to the first embodiment as viewed from the rear.
- the light emitting device 100 includes a light emitting element 10 and a package 20.
- the light-emitting device 100 according to the present embodiment is a so-called side-view type light-emitting device, and light emitted from the light-emitting element 10 is extracted in a direction parallel to a mounting surface 200A (see FIG. 7) of a mounting substrate 200 described later. It is.
- the outer shape of the light emitting device 100 is a substantially rectangular parallelepiped shape extending along a first direction parallel to the mounting surface 200A.
- the outer shape of the light emitting device 100 is not limited to this, and may be a cubic shape, a cylindrical shape, an elliptic cylindrical shape, or the like.
- the size of the light emitting device 100 is about 3 mm in the first direction, about 1 mm in the direction orthogonal to the first direction and parallel to the mounting surface 200A (hereinafter referred to as “second direction”). It is about 1 mm in a direction orthogonal to the first direction and the second direction (that is, a direction orthogonal to the mounting surface 200A, hereinafter referred to as “third direction”).
- the size of the light emitting device 100 is not limited to this.
- the light emitting device 100 is a side view type, and the height in the third direction is larger than the depth in the second direction. Accordingly, the side-view type light emitting device 100 is taller than the top-view type light emitting device in which the height in the third direction is smaller than the depth in the second direction, and thus has a characteristic that the side view type light-emitting device 100 is likely to fall down.
- the light emitting element 10 is placed on the package 20.
- the light emitting element 10 is electrically connected to the package 20 via the first wire 11 and the second wire 12.
- the light emitting element 10 is formed in a plate shape and is arranged perpendicular to the second direction. Light emitted from the light emitting element 10 is extracted in a direction parallel to the second direction from a front opening 20E described later.
- the light emitting element 10 is, for example, a semiconductor light emitting element called a so-called light emitting diode.
- a semiconductor light emitting element called a so-called light emitting diode.
- an element having a semiconductor such as GaAlN, ZnS, SnSe, SiC, GaP, GaAlAs, AlN, InN, AlInGaP, InGaN, GaN, or AlInGaN on the substrate is preferably used. It is not limited.
- the face-up structure or the face-down structure can be adopted for the light emitting element 10.
- the size of the light-emitting element 10 is not particularly limited, but is 350 ⁇ m square, 500 ⁇ m square, 1 mm square, or the like.
- the outer shape of the package 20 has a substantially rectangular parallelepiped shape extending along the first direction.
- the package 20 includes a bottom surface 20A, a top surface 20B, a front surface 20C, a first side surface 20D 1 (corresponding to a “rear surface” of the side-view type light emitting device 100), a second side surface 20D 2, and a third side surface. and a 20D 3.
- the bottom surface 20A is in contact with the mounting surface 200A (see FIG. 7).
- the top surface 20B faces the bottom surface 20A.
- the front surface 20C is a light emitting surface that is continuous with the bottom surface 20A and the top surface 20B.
- the front surface 20C has a front surface opening 20E.
- the front opening 20 ⁇ / b> E guides light emitted from the light emitting element 10 to the outside of the package 20.
- the light emitting element 10 is mounted on the mounting surface 41A (see FIG. 3) exposed inside the front opening 20E.
- the first side surface 20D 1 is continuous with the bottom surface 20A and the upper surface 20B, are provided to face the front 20C.
- the first side surface 20D 1, the second direction (i.e., the direction in which the light emitted from the light emitting element 10 is taken out) is perpendicular to.
- the boundary between the first side surface 20D 1 and the bottom surface 20A is parallel to the first direction.
- the second side surface 20D 2 is connected to a first side surface 20D 1 and the front 20C.
- the third side surface 20D 3 is arranged opposite to the second side surface 20D 2.
- Second side surface 20D 2 and the third side surface 20D 3 is perpendicular to the first direction.
- the package 20 includes a molded body 30, a first lead 40, a second lead 50, and a sealing resin 60.
- the molded body 30 forms the outer shape of the package 20.
- the molded body 30 is made of an insulating material that has heat resistance and appropriate strength, and that hardly emits light emitted from the light emitting element 10 or external light.
- a triazine derivative epoxy resin which is a thermosetting resin is suitable.
- Such a thermosetting resin may contain an acid anhydride, an antioxidant, a release material, a light reflecting member, an inorganic filler, a curing catalyst, a light stabilizer, and a lubricant.
- titanium dioxide filled in 0.1 to 90 wt%, preferably 10 to 60 wt% can be used.
- the material of the molded body 30 is not limited to this.
- thermosetting resins at least selected from epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, and urethane resins.
- One kind of resin can be used.
- an epoxy resin, a modified epoxy resin, a silicone resin, and a modified silicone resin are suitable as the material of the molded body 30.
- a thermoplastic resin such as a liquid crystal polymer, a polyphthalamide resin, or polybutylene terephthalate (PBT) may be used.
- the first lead 40 and the second lead 50 are preferably made of a material having a relatively large thermal conductivity (for example, about 200 W / (m ⁇ K) or more). Thereby, the heat generated from the light emitting element 10 can be efficiently transmitted.
- a material for example, a single layer or a plurality of metals such as Ni, Au, Cu, Ag, Mo, W, aluminum, gold, iron, or an alloy such as iron-nickel alloy, phosphor bronze, iron-containing copper, etc. Layers can be used.
- the surfaces of the first lead 40 and the second lead 50 may be plated.
- first lead 40 and the second lead 50 are embedded in the molded body 30, and only a part of the first lead 40 and the second lead 50 is exposed from the molded body 30. That is, only a part of the first lead 40 and the second lead 50 is observed from the outside of the package 20.
- the configuration of the first lead 40 and the second lead 50 will be described later.
- sealing resin 60 is filled in the front opening 20 ⁇ / b> E and seals the light emitting element 10.
- a resin having translucency for example, polyolefin resin, polycarbonate resin, polystyrene resin, epoxy resin, acrylic resin, acrylate resin, methacrylic resin (PMMA, etc.), urethane resin, polyimide resin.
- At least one resin selected from polynorbornene resin, fluororesin, silicone resin, modified silicone resin, modified epoxy resin, and the like can be used.
- such a material may contain, for example, a phosphor or a pigment, a filler, a diffusing material, or the like described in WO2006 / 038502 and JP2006-229055.
- FIG. 3 is a perspective view of FIG.
- FIG. 4 is a perspective view of FIG.
- FIG. 5 is a plan view of the bottom surface 20 ⁇ / b> A of the light emitting device 100.
- Figure 6 is a first plan view of the side surface 20D 1 of the light emitting device 100. 3 and 4, the contour of the molded body 30 is shown.
- the dimension in the first direction is referred to as “width”
- the dimension in the second direction is referred to as “depth”
- the dimension in the third direction is referred to as “height”.
- the first lead 40 includes a placement part 41, a first terminal part 42, and an exposed part 43.
- the first terminal portion 42 and the exposed portion 43 are integrally connected to the placement portion 41. Therefore, the first terminal portion 42 and the exposed portion 43 are mechanically and electrically connected to the placement portion 41. However, the first terminal portion 42 and the exposed portion 43 are separated from each other and are not directly connected.
- Placement unit 41 is formed in a plate shape, it is disposed along the first side surface 20D 1.
- the first to third side surfaces 20D 1 to 20D 3 side of the mounting portion 41 are covered with the molded body 30.
- the mounting portion 41 has a mounting surface 41 ⁇ / b> A exposed from the molded body 30.
- the mounting surface 41A is exposed from the molded body 30 inside the front opening 20E.
- the light emitting element 10 is mounted on the mounting surface 41A, and the first wire 11 is connected to the mounting surface 41A.
- the placement surface 41A is sealed with a sealing resin 60 (see FIG. 1).
- the first terminal portion 42 is formed in a substantially cubic shape, and is connected to the lower end portion of the placement portion 41 on the second side surface 20D 2 side. A part of the first terminal portion 42 is exposed from the molded body 30 and functions as an external electrode of the light emitting device 100.
- the first terminal portion 42 includes a first end surface 42A, a second end surface 42B, a third end surface 42C, and a first terminal recess 42S.
- the first end face 42 ⁇ / b> A is exposed from the molded body 30 on the first side face 20 ⁇ / b> D 1 of the package 20.
- the first end face 42A forms a first part of the side surface 20D 1.
- the second end face 42B is exposed from the molded body 30 in the second side surface 20D 2 of the package 20.
- the second end face 42B forms a second part of the side surface 20D 2.
- the third end surface 42 ⁇ / b> C is exposed from the molded body 30 on the bottom surface 20 ⁇ / b> A of the package 20.
- the third end face 42C forms part of the bottom face 20A.
- the first terminal recess 42S is a notch formed at the boundary between the bottom surface 20A and the first side surface 20D 1 and the second side surface 20D 2.
- the first solder fillet 301 is formed on the first end surface 42A and the second end surface 42B, and the first solder fillet is formed in the first terminal recess 42S. Part of 301 is filled (see FIG. 8).
- the third end surface 42C is in contact with the mounting surface 200A.
- Exposed portion 43 is formed in an L shape and is connected to the first side surface 20D 1 (back surface) side and the bottom surface 20A side of the mounting portion 41. A part of the exposed portion 43 is exposed from the molded body 30 and functions as a heat sink.
- the exposed portion 43 includes a first exposed surface 43A, a second exposed surface 43B, and a concave portion 43S (an example of a “concave portion”).
- the first exposed surface 43 ⁇ / b> A is exposed from the molded body 30 on the first side surface 20 ⁇ / b> D 1 of the package 20.
- the first exposed surface 43A forms a first part of the side surface 20D 1.
- the area of the first exposed surface 43A is larger than the area of the first end surface 42A.
- the height h 43 of the first exposed surface 43A is larger than the height h 42 of the first end surface 42A
- the width w 43 of the first exposed surface 43A is the first height 43 . greater than the width w 42 of the end face 42A.
- the second exposed surface 43B is exposed from the molded body 30 on the bottom surface 20A of the package 20.
- the second exposed surface 43B forms part of the bottom surface 20A.
- the area of the second exposed surface 43B is larger than the area of the third end surface 42C.
- the depth d 43 of the second exposed surface 43B is the same as the depth d 42 of the third end surface 42C, but the width w 43 of the second exposed surface 43B is third. larger than the width w 42 of the end face 42C.
- Recesses 43S is a notch formed in a part of the boundary between the bottom surface 20A and the first side surface 20D 1. Thus, recesses 43S are opened continuous to the bottom surface 20A and the first side surface 20D 1. The recess 43S is formed so as to extend along the first direction.
- the recess 43S includes a first inner wall 43Sa, a second inner wall 43Sb, and a third inner wall 43Sc, as shown in FIG.
- the first inner wall 43Sa is orthogonal to the first direction.
- the second inner wall 43Sb faces the first inner wall 43Sa.
- the third inner wall 43Sc is orthogonal to the second direction and is continuous with the first inner wall 43Sa and the second inner wall 43Sb.
- the first exposed surface 43A is exposed to the outside of the light emitting device 100, and the second exposed surface 43B is in contact with the mounting surface 200A (see FIG. 8).
- a second solder fillet 303a is formed on the first inner wall 43Sa, and a second solder fillet is formed on the second inner wall 43Sb.
- 303b is formed.
- the third inner wall 43Sc is exposed to the outside of the light emitting device 100.
- the exposed portion 43 is electrically connected to the mounting substrate 200 via a pair of second solder fillets 303a and 303b, thereby serving as an external electrode of the light emitting device 100 together with the first terminal portion 42. Function.
- the second lead 50 includes a connection part 51 and a second terminal part 52.
- the connection part 51 and the 2nd terminal part 52 are integrally formed.
- connection unit 51 Connecting portion 51 is formed in a plate shape, it is disposed along the first side surface 20D 1.
- the first to third side surfaces 20D 1 to 20D 3 of the connecting portion 51 are covered with the molded body 30.
- the connection part 51 has a connection surface 51 ⁇ / b> A exposed from the molded body 30.
- connection surface 51A is exposed from the molded body 30 inside the front opening 20E.
- the second wire 12 is connected to the connection surface 51A.
- the connection surface 51A is sealed with a sealing resin 60 (see FIG. 1).
- the second terminal portion 52 is formed in a substantially cubic shape and is connected to the end portion of the connection portion 51. A part of the second terminal portion 52 is exposed from the molded body 30 and functions as an external electrode of the light emitting device 100.
- the second terminal portion 52 includes a first end surface 52A, a second end surface 52B, a third end surface 52C, and a second terminal recess 52S.
- the first end surface 52A is exposed from the molded body 30 on the first side surface 20D 1 of the package 20.
- the first end face 52A forms a first part of the side surface 20D 1.
- the second end surface 52B is exposed from the molded body 30 on the third side surface 20D 3 of the package 20.
- the second end face 52B forms part of the third side surface 20D 3.
- the third end surface 52C is exposed from the molded body 30 on the bottom surface 20A of the package 20.
- the third end surface 52C forms part of the bottom surface 20A.
- the second terminal recess 52S is a notch formed at the boundary between the bottom surface 20A and the first side surface 20D 1 and the third side surface 20D 3.
- the third solder fillet 302 is formed on the first end surface 52A and the second end surface 52B, and the third solder fillet is formed in the second terminal recess 52S. Part of 302 is filled (see FIG. 8). Further, when the light emitting device 100 is mounted, the third end surface 52C is in contact with the mounting surface 200A.
- the area of the first exposed surface 43A is larger than the area of the first end surface 52A. Specifically, as shown in FIG. 6, the height h 43 of the first exposed surface 43A is greater than the height h 52 of the first end surface 52A, and the width w 43 of the first exposed surface 43A is the first It is larger than the width w 52 of the end face 52A.
- the area of the second exposed surface 43B is larger than the area of the third end surface 52C.
- the depth d 43 of the second exposed surface 43B is the same as the depth d 52 of the third end surface 52C, but the width w 43 of the second exposed surface 43B is third. It is larger than the width w 52 of the end face 52C.
- FIG. 7 is a perspective view of the mounting substrate 200 according to the first embodiment.
- a region where the light emitting device 100 is mounted is illustrated as a mounting region 100R.
- the mounting substrate 200 includes a mounting surface 200 ⁇ / b> A, a first land 201, a second land 202, and an electric circuit 204.
- the light emitting device 100 is mounted on the mounting surface 200A.
- the first land 201 is a metal member for connecting the first terminal portion 42.
- the second land 202 is a metal member for connecting the second terminal portion 52.
- As the first and second lands 201 and 202 for example, copper foil or the like can be used.
- the surfaces of the first and second lands 201 and 202 form part of the mounting surface 200A.
- the electric circuit 204 is connected to each of the first land 201 and the second land 202.
- the first land 201 functions as an external terminal corresponding to the first terminal portion 42 and the exposed portion 43
- the second land 202 functions as an external terminal corresponding to the second terminal portion 52.
- FIG. 8 is a perspective view of the circuit board 300 according to the first embodiment.
- the circuit board 300 includes a light emitting device 100, a mounting board 200, a first solder fillet 301, a pair of second solder fillets 303a and 303b (an example of a “second solder fillet”), A third solder fillet 302.
- the first solder fillet 301 is connected across the mounting surface 200A, the first side surface 20D 1 , and the second side surface 20D 2 . Further, the first solder fillet 301 is filled in the first terminal recess 42S. Thereby, the 1st terminal part 42 and the 1st land 201 (namely, mounting board 200) are connected electrically and mechanically.
- the third solder fillet 302 is connected across the mounting surface 200A, the first side surface 20D 1 , and the third side surface 20D 3 .
- the third solder fillet 302 is filled in the second terminal recess 52S. Thereby, the 2nd terminal part 52 and the 2nd land 202 (namely, mounting board 200) are connected electrically, mechanically, and thermally.
- the pair of second solder fillets 303a and 303b are disposed inside the recess 43S. Specifically, the second solder fillet 303a is connected across the mounting surface 200A and the first inner wall 43Sa, and the second solder fillet 303b is connected across the mounting surface 200A and the second inner wall 43Sb.
- the second solder fillet 303a and the second solder fillet 303b face each other.
- the exposed portion 43 and the first land 201 that is, the mounting substrate 200
- the third inner wall 43Sc is exposed to the outside of the light emitting device 100.
- Heat dissipation path Next, a heat dissipation path from the light emitting element 10 according to the present embodiment will be described. Hereinafter, the four heat radiation paths are listed in descending order of heat radiation efficiency.
- FIG. 9A is a cross-sectional view of the metal thin plate 451
- FIG. 9B is a plan view of the metal thin plate 451.
- FIG. 10A is a cross-sectional view of the lead frame 45
- FIG. 10B is a plan view of the lead frame 45.
- FIG. 11 is an enlarged view of the lead frame 45.
- 12 is a cross-sectional view taken along the line AA in FIG.
- FIG. 13 is a plan view of the light emitting device package array PA according to the present embodiment.
- a metal thin plate 451 having a first main surface S1 and a second main surface S2 provided opposite to the first main surface S1 is prepared.
- the metal thin plate 451 has a thickness t 1 (for example, about 0.5 mm).
- a first mask M1 having a predetermined pattern is formed on the first main surface S1, and a first pattern having a pattern symmetrical to the first mask M1 is formed on the second main surface S2.
- Two masks M2 are formed, and the first main surface S1 and the second main surface S2 are etched simultaneously.
- an etching hole G is formed in the metal thin plate 451 as shown in FIG. Note that dry etching and wet etching can be used as the etching method. Further, as the etchant, an appropriate one corresponding to the material of the metal thin plate 451 may be selected.
- a third mask M3 having a predetermined pattern is formed on the first main surface S1, and the second main surface S2 is entirely covered on the second main surface S2.
- 4 mask M4 is formed and only 1st main surface S1 is etched.
- a lead frame 45 having an etching recess H formed in the first main surface S1 is completed.
- the depth of the etching recess H is, for example, about 0.3 mm. Therefore, the portion of the metal thin plate 451 where the etching recess H is formed has a thickness t 2 (for example, about 0.2 mm) smaller than the thickness t 1 .
- the lead frame 45 includes a first frame part F1, a second frame part F2, a third frame part F3, and a fourth frame part F4.
- the first frame part F1 and the second frame part F2 are adjacent to each other in a predetermined direction, and are connected by the first connection frame R1.
- the third frame portion F3 and the fourth frame portion F4 are adjacent to each other in a predetermined direction, and are connected by the second connection frame R2.
- the first frame part F1 and the third frame part F3 are adjacent to each other in the orthogonal direction (an example of the orthogonal direction) orthogonal to the predetermined direction, and are connected by the third connection frame R3 and the fourth connection frame R4.
- the second frame portion F2 and the fourth frame portion F4 are adjacent to each other in the orthogonal direction, and are connected by the fifth connection frame R5 and the sixth connection frame R6.
- the first to fourth frame portions F1 to F4 have the same configuration, and the first thick portion P1, the second thick portion P2, the first thin portion Q1, the second thin portion Q2, and the like. including.
- the first thick portion P1 has a first thickness t 1 (that is, the thickness of the metal thin plate 451).
- the exposed portion 43 is formed by cutting the first thick portion P1 with a dicing saw.
- the second thick part P2 is separated from the first thick part P1 in a predetermined direction.
- the second thick part P2 is cut by a dicing saw, whereby the first terminal part 42 and the second terminal part 52 are formed.
- the first thin portion Q1 has a second thickness t 2 (that is, the thickness of the portion of the metal thin plate 451 where the etching recess H is formed).
- the first thin part Q1 is connected to the first thick part P1 and the second thick part P2.
- the first thin portion Q1 corresponds to the outer peripheral portion of the mounting portion 41 of the light emitting device 100.
- the second thin portion Q2 has a second thickness t 2.
- the second thin portion Q2 is connected to the second thick portion P1, and is separated from the first thin portion Q1 via the etching hole G (see FIG. 9) in a predetermined direction.
- the second thin portion Q2 corresponds to the connection portion 51 of the light emitting device 100.
- a single-sided etching recess X that is a part of the etching recess H is formed inside the first thick portion P1 of each frame portion F in the plan view of the lead frame 45.
- the portion on one side etch recess X is formed of the first thickness portion P1 has a second thickness t 2.
- the single-sided etching recess X is cut by a dicing saw, thereby forming a recess 43S (see FIG. 4).
- a single-sided etching recess Y that is a part of the etching recess H is formed inside the second thick portion P2 of each frame portion F in plan view of the lead frame 45D.
- the portion on one side etch recess Y is formed of the second thick portion P2 has a second thickness t 2.
- the single-sided etching recess Y is cut by a dicing saw, thereby forming the first terminal recess 42S and the second terminal recess 52S (see FIG. 4).
- the first thin portion Q1 of the third frame portion F3 is connected to the first thick portion P1 of the first frame portion F1 via the third connection frame R3.
- the second thin part Q2 of the third frame part F3 is connected to the second thick part P2 of the first frame part F1 via the fourth connection frame R4.
- the first thin portion Q1 of the fourth frame portion F4 is connected to the first thick portion P1 of the second frame portion F2 via the fifth connection frame R5.
- the second thin part Q2 of the fourth frame part F4 is connected to the second thick part P2 of the second frame part F2 via the sixth connection frame R6.
- first to sixth connection frames R1 to R6 are cut by a dicing saw in a later process (see FIG. 13). That is, the first to sixth connection frames R1 to R6 constitute a cutting allowance for dicing. Further, as shown in FIG. 11, the portion connected to the third connecting frame R3 in the first thick portion P1 and the portion connected to the fourth connecting frame R4 in the second thick portion P2 are: They are arranged along a predetermined direction, and constitute a cutting margin together with the first to sixth connection frames R1 to R6.
- the lead frame 45 is placed in the mold. Specifically, the lead frame 45 is sandwiched between the upper mold and the lower mold. Next, a resin material constituting the molded body 30 is injected between the upper mold and the lower mold.
- the molding material is transfer molded by heating at a predetermined temperature.
- a light emitting device package array PA including the lead frame 45 and the mold plate 46 in which the lead frame 45 is embedded is completed. It should be noted that in the light emitting device package array PA, the first thick portion P1 and the single-sided etched recess X and the second thick portion P2 and the single-sided etched recess Y are exposed from the mold plate 46. It is.
- the light emitting device package array PA is cut along the cutting lines G1 and G2 having a predetermined width. As a result, the plurality of light emitting devices 100 are manufactured together.
- the first lead 40 has the exposed portion 43.
- the exposed portion 43 is connected to the placement portion 41 and is exposed from the molded body 30 on the bottom surface 20A and the first side surface 20D 1 (back surface).
- the heat generated from the light emitting element 10 can be directly released to the outside of the light emitting device 100 from the first lead 40 on which the light emitting element 10 is mounted. Specifically, a second heat radiation path from the first exposed surface 43A to the outside air and a third heat radiation path from the second exposed surface 43B to the mounting substrate 200 are formed. Furthermore, when the second solder fillet 303 (second solder fillet 303a and / or second solder fillet 303b) is connected to the exposed portion 43, the exposed portion 43 is connected to the mounting substrate 200 via the second solder fillet 303a. A first heat dissipation path can be formed.
- the heat generated from the light emitting element 10 can be efficiently released from the light emitting device 100.
- the exposed portion 43 has a recess opening continuous with the bottom surface 20A and the first side surface 20D 1 43S (an example of the "recess portion"). Therefore, each of the pair of second solder fillets 303a and 303b can be connected so as to straddle the inner wall 43S (the first inner wall 43Sa and the second inner wall 43Sb) from the mounting surface 200A. Therefore, when the pair of second solder fillets 303a and 303b is solidified and contracted, the force that each of the pair of second solder fillets 303a and 303b pulls the light emitting device 100 acts on the light emitting device 100 along the first direction.
- the recess 43S extends along the first direction. Therefore, the pair of second solder fillets 303a and 303b facing each other can be easily disposed in the recess 43S. Therefore, the force by which the second solder fillet 303a pulls the first inner wall 43Sa and the force by which the second solder fillet 303b pulls the second inner wall 43Sb can be offset each other. As a result, the balance of the light emitting device 100 can be further improved.
- the exposed portion 43 is greater than the first terminal portion 42. Therefore, since the heat dissipation effect in the first heat dissipation path can be greater than the heat dissipation effect in the fourth heat dissipation path, the light emitting element 10 can be dissipated more efficiently.
- the exposed portion 43 is disposed on the opposite side of the light emitting element 10 with the mounting portion 41 interposed therebetween. Therefore, the distance that the heat generated from the light emitting element 10 moves inside the mounting portion 41 can be shortened. Therefore, the heat conduction efficiency from the light emitting element 10 to the exposed portion 43 can be improved.
- the circuit board 300 according to the first embodiment includes a pair of second solder fillets 303 a and 303 b (an example of “second solder fillet”) connected to the exposed portion 43 and the mounting board 200. Therefore, since the first heat dissipation path is formed by the pair of second solder fillets 303a and 303b, heat can be efficiently transferred from the light emitting device 100 to the mounting substrate 200.
- the second solder fillet 303a is connected across the mounting surface 200A and the first inner wall 43Sa.
- the second solder fillet 303b is connected across the mounting surface 200A and the second inner wall 43Sb.
- the force that each of the pair of second solder fillets 303a and 303b pulls the light emitting device 100 acts on the light emitting device 100 along the first direction. Therefore, it is possible to suppress the balance of the light emitting device 100 from being deteriorated by the pulling force of the pair of second solder fillets 303a and 303b. Such an effect is particularly effective in the side-view type light emitting device 100 having a feature that easily falls.
- FIG. 14 is a transparent perspective view of the light emitting device 100 according to the second embodiment as viewed from the rear.
- the exposed part 43 includes a first partition part 431, a second partition part 432, a first solder accommodation part 433, a second solder accommodation part 434, and a third solder accommodation part 435.
- the first partition part 431, the second partition part 432, the first solder accommodating part 433, the second solder accommodating part 434, and the third solder accommodating part 435 constitute a recess 43S.
- Each of the first partition wall portion 431 and the second partition wall portion 432 separates the internal space of the recess 43S into two spaces in the first direction. Therefore, in the present embodiment, the internal space of the recess 43S is divided into three spaces.
- the first solder accommodating portion 433, the second solder accommodating portion 434, and the third solder accommodating portion 435 each include three spaces partitioned by the first partition wall portion 431 and the second partition wall portion 432, respectively.
- the second solder fillet 303a is disposed in the first solder accommodating portion 433, and the second solder fillet 303b is disposed in the third solder accommodating portion 435.
- the second solder fillet 303a does not flow into the second solder accommodating portion 434 by being blocked by the first partition wall portion 431.
- the second solder fillet 303b does not flow into the second solder accommodating portion 434 due to being blocked by the second partition wall portion 431.
- another solder fillet (not shown) is disposed in the second solder accommodating portion 434.
- the lead frame 45A includes a first partition base portion 431A, a second partition base portion 431A, a first solder storage base portion 433A, a second solder storage base portion 434A, and a third solder storage base portion 435A.
- Such a lead frame 45A can be formed by finely setting a region where single-sided etching is performed on a thin metal plate. Specifically, the region where the first solder containing base part 433, the second solder containing base part 434, and the third solder containing base part 435 are formed has the same depth as the first terminal concave part 42S and the second terminal concave part 52S. By performing single-side etching, the first partition base 431A and the second partition base 431A are formed.
- the lead frame 45A is embedded in the mold plate 46 (see FIG. 13) by transfer molding.
- the lead frame 45A and the mold plate 46 are cut together along a predetermined cutting line (see FIG. 13).
- the exposed part 43 includes a first partition part 431 and a second partition part 432 that separate the interior of the recess 43S into two spaces.
- the second solder fillet 303a is accommodated in the first solder accommodating part 433 by the first partition part 431, and the second solder fillet 303b is the second partition part. It is accommodated in the third solder accommodating portion 435 by 432. Therefore, it is possible to prevent the pair of second solder fillets 303a and 303b from spreading too much in the recess 43S, and thus the balance of the light emitting device 100 can be further improved. In addition, since another solder fillet can be disposed in the second solder accommodating portion 434, the heat dissipation efficiency of the light emitting device 100 can be further improved.
- FIG. 16 is a perspective view of a mounting board 200 according to the third embodiment. As shown in FIG. 16, the mounting substrate 200 has a third land 203. The third land 203 is separated from the first land 201 and the second land 202 and is electrically isolated from the electric circuit 204.
- FIG. 17 is a perspective view of a circuit board 300 according to the third embodiment. As shown in FIG. 17, when the light emitting device 100 is mounted on the mounting substrate 200, the exposed portion 43 is mechanically and thermally connected to the third land 203 by a pair of second solder fillets 303a and 303b. .
- the exposed portion 43 is also electrically connected to the third land 203 via the pair of second solder fillets 303a and 303b, but the third land 203 is electrically isolated from the electric circuit 204. Therefore, the exposed portion 43 does not function as an external terminal.
- FIG. 18 is a perspective view of the light emitting device 100 according to the fourth embodiment as viewed from the rear. As shown in FIG. 18, in the light emitting device 100, the second lead 50 has a first extending portion 101.
- the first extension portion 101 is disposed on the connection portion 51 and is connected to the second terminal portion 52.
- the first extending portion 101 is a first side surface 20D 1-side surface of the connecting portion 51 extends toward the first side surface 20D 1, it is exposed from the molded body 30 in the first side surface 20D 1.
- the first extending portion 101 includes a first extended face 101S which forms a first part of the side surface 20D 1.
- a lead frame 45B as shown in FIG. 19 is prepared.
- the lead frame 45B includes a first extending source part 101A.
- Such a lead frame 45B can be formed by setting a region where single-sided etching is performed to form the connection base portion 51A in a C shape.
- the lead frame 45B is embedded in the mold plate 46 (see FIG. 13) by transfer molding.
- the lead frame 45B and the mold plate 46 are cut together using a dicing saw along a cutting line having a predetermined width (see FIG. 13).
- the second lead 50 includes the first extending portion 101.
- the first extension portion 101 is disposed on the connection portion 51 and is connected to the second terminal portion 52.
- the first extending portion 101 is exposed from the molded body 30 in the first side surface 20D 1.
- the first extending portion 101 since exposed from the molded body 30 in the first side surface 20D 1, "the light emitting element 10 ⁇ -molded body 30 and the second wire 12 ⁇ the connecting portion 51 ⁇ first extending A heat radiation path of “part 101 ⁇ first extending surface 101S ⁇ outside air” can be formed. Therefore, the heat generated from the light emitting element 10 can be released from the light emitting device 100 more efficiently.
- first extension portion 101 is connected to the second terminal portion 52, “light emitting element 10 ⁇ molded body 30 and second wire 12 ⁇ connection portion 51 ⁇ first extension portion 101 ⁇ second terminal”.
- a heat dissipation path of part 52 ⁇ mounting substrate 200 ′′ can be formed. Therefore, the heat generated from the light emitting element 10 can be released from the light emitting device 100 more efficiently.
- the first extending surface 101S is exposed on the outer surface of the molded body 30. That is, in the manufacturing process of the molded body 30, the first extending portion 101 is brought into contact with the inner surface of the mold. Thereby, since the connection part 51 is supported by the 1st extension part 101, it can suppress that the connection part 51 vibrates minutely with the resin material inject
- FIG. 20 is a perspective view of the light emitting device 100 according to the fifth embodiment as viewed from the rear. As shown in FIG. 20, in the light emitting device 100, the first lead 40 has a second extending portion 102, and the second lead 50 has a first extending portion 101.
- the configuration of the first extension portion 101 is as described in the fourth embodiment.
- the configuration of the second extension portion 102 is the same as the configuration of the first extension portion 101.
- the second extension portion 102 is disposed on the placement portion 41 and is connected to the first terminal portion 42.
- the second extending portion 102, a first side surface 20D 1-side surface of the mounting portion 41 and extending toward the first side surface 20D 1, is exposed from the molded body 30 in the first side surface 20D 1.
- the second extending portion 102 has a second extended face 102S which forms a first part of the side surface 20D 1.
- a lead frame 45C as shown in FIG. 21 is prepared.
- the lead frame 45C includes a first extension source portion 101A and a second extension source portion 102A.
- Such a lead frame 45C can be formed by setting a region where single-sided etching is performed to form the placement source portion 41A and the connection source portion 51A as shown in FIG.
- the single-sided etched recess X and the single-sided etched recess Y are set larger than the lead frame 45 according to the first embodiment. Thereby, the processing limit on the dimension which can be etched on one side is increased.
- FIG. 22 is a partially enlarged view of the lead frame 45C.
- the lead frame 45C has first to fourth frame portions F1 to F4.
- the first frame part F1 and the second frame part F2 are adjacent to each other in a predetermined direction, but are not connected.
- the third frame portion F3 and the fourth frame portion F4 are adjacent to each other in the predetermined direction, but are not connected.
- the third frame portion F3 and the fourth frame portion F4 are centered on an axis T parallel to the thickness direction (a direction orthogonal to the predetermined direction and the orthogonal direction, that is, a direction orthogonal to the paper surface).
- the first frame part F1 and the second frame part F2 are arranged rotationally symmetrically.
- the first thick part P1 of the third frame part F3 is directly connected to the first thick part P1 of the first frame part F1.
- the second thick part P2 of the third frame part F3 is directly connected to the second thick part P2 of the second frame part F2.
- the second thick part P2 of the fourth frame part F4 is directly connected to the second thick part P2 of the first frame part F1.
- a part of the etching recess H is formed inside the first thick part P1 of each frame part F in the plan view of the lead frame 45D.
- a part of the etching recess H is formed inside the second thick part P2 of each frame part F in the plan view of the lead frame 45D.
- the second thick part P2 of the first frame part F1 and the second thick part P2 of the fourth frame part F4 are connected to form the single-sided etching recess Y.
- the single-sided etching recess Y is formed by connecting the second thick part P2 of the second frame part F2 and the second thick part P2 of the third frame part F3.
- a portion where the first thick part P1 of the third frame part F3 and the first thick part P1 of the first frame part F1 are connected constitutes a cutting allowance for dicing (see FIG. 23). .
- the part where the second thick part P2 of the third frame part F3 and the second thick part P2 of the second frame part F2 are connected constitutes a cutting allowance for dicing.
- a portion where the second thick part P2 of the fourth frame part F4 and the second thick part P2 of the first frame part F1 are connected constitutes a cutting allowance for dicing.
- the lead frame 45C is embedded in the mold plate 46 by the transfer molding method, thereby completing the light emitting device package array PA.
- the first thick portion P1 and the single-sided etched recess X and the second thick portion P2 and the single-sided etched recess Y are exposed from the mold plate 46. It is.
- the light emitting device package array PA is cut along the cutting lines H1 and H2 having a predetermined width.
- the first lead 40 includes the second extending portion 102.
- the second extension portion 102 is disposed on the placement portion 41 and is connected to the first terminal portion 42.
- the second extending portion 102 is exposed from the molded body 30 in the first side surface 20D 1.
- the second extending portion 102 since exposed from the molded body 30 in the first side surface 20D 1, "the light emitting element 10 ⁇ mounting portion 41 ⁇ the second extending section 102 ⁇ second extended face 102S ⁇ A heat dissipation path called “outside air” can be formed. Therefore, the heat generated from the light emitting element 10 can be released from the light emitting device 100 more efficiently.
- the second extending portion 102 is connected to the first terminal portion 42, it is referred to as “light emitting element 10 ⁇ mounting portion 41 ⁇ second extending portion 102 ⁇ first terminal portion 42 ⁇ mounting substrate 200”.
- a heat dissipation path can be formed. Therefore, the heat generated from the light emitting element 10 can be released from the light emitting device 100 more efficiently.
- the second extending surface 102 ⁇ / b> S is exposed on the outer surface of the molded body 30. That is, in the manufacturing process of the molded body 30, the second extending portion 102 is brought into contact with the inner surface of the mold. Thereby, since the mounting part 41 is supported by the 2nd extension part 102, it can suppress that the mounting part 41 vibrates minutely by the resin material inject
- the effect of the second lead 50 having the first extending portion 101 is as described in the fourth embodiment.
- the so-called side-view type light emitting device 100 has been described, but the present invention is not limited to this.
- the exposed portion 43 can also be applied to a so-called top view type light emitting device in which light perpendicular to the mounting surface 200A is emitted from the light emitting element 10.
- the exposed portion 43 has the concave portion 43S, but is not limited thereto.
- the exposed portion 43 may not have the concave portion 43S. Even in this case, heat can be effectively radiated from the first exposed surface 43A and the second exposed surface 43B.
- the pair of second solder fillets 303a and 303b is formed, but the present invention is not limited to this.
- only one of the pair of second solder fillets 303a and 303b may be formed, or another solder fillet may be formed in addition to the pair of second solder fillets 303a and 303b.
- the connection between the light emitting device 100 and the mounting substrate 200 can be strengthened.
- the pair of second solder fillets 303a and 303b are separated from each other in the recess 43S, but the present invention is not limited to this.
- the pair of second solder fillets 303a and 303b may be connected to each other. That is, one second solder fillet 303 extending along the first direction may be formed from the first inner wall 43Sa to the second inner wall 43Sb.
- the light emitting device 100 includes only one light emitting element 10, but the present invention is not limited to this.
- the light emitting device 100 may include a plurality of light emitting elements 10 connected to each other.
- the plurality of light emitting elements 10 may all be of the same type, or may be a combination of different types exhibiting red, green, and blue emission colors that are the three primary colors of light.
- the outer shape of the light emitting device 100 six faces (bottom 20A, the upper surface 20B, the front 20C, the first side surface 20D 1, the second side surface 20D 2, the third side surface 20D 3) substantially rectangular parallelepiped shape having a
- the light emitting device 100 may have a bottom surface and at least one side surface. Therefore, the outer shape of the light emitting device 100 may be a cylindrical shape or an elliptical column shape.
- the mounting portion 41 is formed in a plate shape
- the exposed portion 43 is formed in an L shape
- the first terminal portion 42 and the second terminal portion 52 are formed in a cube shape.
- the light emitting device 100 can be changed as appropriate according to the outer shape of the light emitting device 100 and the like.
- the lead frame 45 is formed by etching a metal thin plate, but the present invention is not limited to this.
- the lead frame 45 can also be formed by punching a plurality of thin metal thin plates into a predetermined shape and then pressing the plurality of thin metal thin plates together.
- the technology disclosed here can be used in the field of light emitting devices because it can efficiently dissipate heat from the light emitting element.
- DESCRIPTION OF SYMBOLS 100 Light-emitting device 10 ... Light-emitting element 11 ... 1st wire 12 ... 2nd wire 20 ... Package 20A ... Bottom 20D 1 ... 1st side surface 30 ... Molded object 40 ... 1st lead 41 ... Mounting part 42 ... 1st terminal part 43 ... Exposed portion 43S ... Concave portion 43A ... First exposed surface 43B ... Second exposed surface 45 ... Lead frame 451 ... Metal thin plate 46 ... Mold plate 50 ... Second lead 51 ... Connection portion 52 ... Second terminal portion 60 ... Sealing Resin 101 ... 1st extension part 102 ... 2nd extension part 200 ... mounting board 200A ... mounting surface 201 ...
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Abstract
Description
このような発光装置では、成形体の熱伝導率がリード部の熱伝導率よりも著しく低いため、発光素子からの放熱経路としては、載置部、端子部及び半田フィレットを順次介して実装基板に至る経路が支配的となる。
ここに開示される発光装置は、発光素子と、パッケージと、を備える。パッケージは、成形体と成形体に埋設されるリードとによって構成される。リードは、発光素子が載置される載置部と、載置部に連結される端子部と、露出部と、を含む。パッケージは、光出射面と、光出射面に対向する背面と、光出射面及び背面に連なる底面と、を有する。発光素子は、載置部の光出射面側に載置される。露出部は、載置部の背面側に連結され、底面及び背面で成形体から露出される。端子部は、底面で成形体から露出される。
ここに開示される技術によれば、発光素子から効率的に放熱可能な発光装置、回路基板、発光装置用パッケージアレイ、及び発光装置用パッケージアレイの製造方法を提供することができる。
(第1実施形態の概要)
第1実施形態では、発光素子から効率的に放熱可能な発光装置、及びその発光装置と実装基板とを備える回路基板について説明する。具体的に、発光装置は、発光素子からの放熱を促進するヒートシンクとして機能する露出部を有する。
以下、発光装置、実装基板及び回路基板の構成と、発光装置の製造方法とについて順次説明する。
第1実施形態に係る発光装置の構成について、図面を参照しながら説明する。図1は、第1実施形態に係る発光装置100を前方から見た斜視図である。図2は、第1実施形態に係る発光装置100を後方から見た斜視図である。
発光素子10は、パッケージ20に載置される。発光素子10は、第1ワイヤ11及び第2ワイヤ12を介して、パッケージ20と電気的に接続される。
本実施形態において、パッケージ20の外形は、第1方向に沿って延びる略直方体形状である。パッケージ20は、底面20Aと、上面20Bと、前面20Cと、第1側面20D1(サイドビュー型の発光装置100の「背面」に相当する。)と、第2側面20D2と、第3側面20D3とを有する。
パッケージ20は、成形体30と、第1リード40と、第2リード50と、封止樹脂60と、によって構成される。
成形体30は、パッケージ20の外形を成す。成形体30は、耐熱性及び適度な強度を有し、発光素子10の出射光や外光などが透過しにくい絶縁性の材料によって構成される。このような材料としては、熱硬化性樹脂であるトリアジン誘導体エポキシ樹脂が好適である。このような熱硬化性樹脂には、酸無水物、酸化防止剤、離型材、光反射部材、無機充填材、硬化触媒、光安定剤、滑剤が含有されていてもよい。光反射部材としては、0.1~90wt%、好ましくは10~60wt%充填される二酸化チタンを用いることができる。ただし、成形体30の材料は、これに限られるものではなく、例えば、熱硬化性樹脂のうち、エポキシ樹脂、変性エポキシ樹脂、シリコーン樹脂、変性シリコーン樹脂、アクリレート樹脂、ウレタン樹脂から選択される少なくとも1種の樹脂を用いることができる。特に、エポキシ樹脂、変性エポキシ樹脂、シリコーン樹脂、変性シリコーン樹脂は、成形体30の材料として好適である。また、液晶ポリマー、ポリフタルアミド樹脂、ポリブチレンテレフタレート(PBT)などの熱可塑性樹脂を用いてもよい。
第1リード40及び第2リード50は、比較的大きな熱伝導率(例えば、200W/(m・K)程度以上)を有する材料によって構成されることが好ましい。これにより、発光素子10から発生する熱を効率的に伝達できる。このような材料としては、例えば、Ni、Au、Cu、Ag、Mo、W、アルミニウム、金、鉄等の金属又は鉄-ニッケル合金、りん青銅、鉄入り銅等の合金等の単層又は複数層を用いることができる。また、第1リード40及び第2リード50それぞれの表面には、メッキが施されていてもよい。
封止樹脂60は、前面開口20Eの内部に充填されており、発光素子10を封止する。このような封止樹脂60としては、透光性を有する樹脂、例えば、ポリオレフィン系樹脂、ポリカーボネート樹脂、ポリスチレン樹脂、エポキシ樹脂、アクリル樹脂、アクリレート樹脂、メタクリル樹脂(PMMA等)、ウレタン樹脂、ポリイミド樹脂、ポリノルボルネン樹脂、フッ素樹脂、シリコーン樹脂、変性シリコーン樹脂、変性エポキシ樹脂等から選択される少なくとも1種の樹脂を用いることができる。また、このような材料には、例えば、WO2006/038502号、特開2006-229055号に記載の蛍光体又は顔料、フィラー又は拡散材等が含有されていてもよい。
次に、実施形態に係るリードの構成について、図面を参照しながら説明する。図3は、図1の透視図である。図4は、図2の透視図である。図5は、発光装置100の底面20Aの平面図である。図6は、発光装置100の第1側面20D1の平面図である。なお、図3及び図4では、成形体30の輪郭が示されている。
第1リード40は、載置部41と、第1端子部42と、露出部43とによって構成される。本実施形態において、第1端子部42及び露出部43は、載置部41に一体的に連結されている。従って、第1端子部42と露出部43とは、載置部41に機械的、かつ、電気的に接続されている。ただし、第1端子部42と露出部43とは、互いに離間しており、直接的には連結されていない。
載置部41は、板状に形成されており、第1側面20D1に沿って配置される。載置部41の第1~第3側面20D1~20D3側は、成形体30に覆われている。一方で、載置部41は、成形体30から露出する載置面41Aを有する。
第1端子部42は、略立方体状に形成されており、載置部41の第2側面20D2側の下端部に連結される。第1端子部42の一部は、成形体30から露出しており、発光装置100の外部電極として機能する。第1端子部42は、第1端面42Aと、第2端面42Bと、第3端面42Cと、第1端子凹部42Sとを有する。
露出部43は、L字状に形成されており、載置部41の第1側面20D1(背面)側及び底面20A側に連結される。露出部43の一部は、成形体30から露出しており、ヒートシンクとして機能する。
露出部43は、第1露出面43Aと、第2露出面43Bと、凹部43S(「凹部」の一例)とを有する。
第2リード50は、接続部51と、第2端子部52とによって構成される。本実施形態において、接続部51と第2端子部52とは、一体的に形成されている。
接続部51は、板状に形成されており、第1側面20D1に沿って配置される。接続部51の第1~第3側面20D1~20D3側は、成形体30に覆われている。一方で、接続部51は、成形体30から露出する接続面51Aを有する。
第2端子部52は、略立方体状に形成されており、接続部51の端部に連結される。第2端子部52の一部は、成形体30から露出しており、発光装置100の外部電極として機能する。第2端子部52は、第1端面52Aと、第2端面52Bと、第3端面52Cと、第2端子凹部52Sとを有する。
次に、実施形態に係る実装基板の構成について、図面を参照しながら説明する。図7は、第1実施形態に係る実装基板200の斜視図である。なお、図7では、発光装置100が実装される領域を実装領域100Rとして示している。
実装面200Aには、発光装置100が実装される。第1ランド201は、第1端子部42を接続するための金属部材である。第2ランド202は、第2端子部52を接続するための金属部材である。第1及び第2ランド201,202としては、例えば銅箔などを用いることができる。なお、第1及び第2ランド201,202それぞれの表面は、実装面200Aの一部を形成する。
次に、本実施形態に係る回路基板の構成について、図面を参照しながら説明する。図8は、第1実施形態に係る回路基板300の斜視図である。
次に、本実施形態に係る発光素子10からの放熱経路について説明する。以下、放熱効率が高い順に、4つの放熱経路を列挙する。
発光素子10→載置部41→露出部43→一対の第2半田フィレット303a、303b→実装基板200
〈第2放熱経路〉
発光素子10→載置部41→露出部43→第1露出面43A→外気
〈第3放熱経路〉
発光素子10→載置部41→露出部43→第2露出面43B→実装基板200
〈第4放熱経路〉
発光素子10→載置部41→第1端子部42→第1半田フィレット301→実装基板200
次に、本実施形態に係る複数の発光装置100を一括して製造する方法について、図面を参照しながら説明する。図9(a)は、金属薄板451の断面図であり、図9(b)は、金属薄板451の平面図である。図10(a)は、リードフレーム45の断面図であり、図10(b)は、リードフレーム45の平面図である。図11は、リードフレーム45の拡大図である。図12は、図11のA-A線における断面図である。図13は、本実施形態に係る発光装置用パッケージアレイPAの平面図である。
第1肉厚部P1は、第1厚みt1(すなわち、金属薄板451の厚み)を有する。後工程において、第1肉厚部P1がダイシングソーによって切断されることによって、露出部43が形成される。第2肉厚部P2は、第1厚みt1を有する。第2肉厚部P2は、所定方向において第1肉厚部P1から離間している。後工程において、第2肉厚部P2がダイシングソーによって切断されることによって、第1端子部42及び第2端子部52が形成される。
次に、上金型と下金型との間に成形体30を構成する樹脂材料を注入する。
(1)第1実施形態に係る発光装置100において、第1リード40は、露出部43を有する。露出部43は、載置部41に連結されており、底面20A及び第1側面20D1(背面)において成形体30から露出する。
従って、一対の第2半田フィレット303a、303bそれぞれを実装面200A上から内壁43S(第1内壁43Sa及び第2内壁43Sb)上に跨るように接続できる。そのため、一対の第2半田フィレット303a、303bが固化収縮する際、一対の第2半田フィレット303a、303bそれぞれが発光装置100を引っ張る力は、第1方向に沿って発光装置100に働く。そのため、一対の第2半田フィレット303a、303bの引っ張り力によって、発光装置100のバランスが悪くなることを抑制できる。このような効果は、倒れやすい特徴を有するサイドビュー型の発光装置100において特に有効である。
従って、互いに対向する一対の第2半田フィレット303a、303bを、凹部43S内に容易に配置できる。そのため、第2半田フィレット303aが第1内壁43Saを引っ張る力と、第2半田フィレット303bが第2内壁43Sbを引っ張る力とを互いに相殺させることができる。その結果、発光装置100のバランスをより向上させることができる。
従って、上述の第1放熱経路における放熱効果を第4放熱経路における放熱効果よりもより大きくできるので、発光素子10をより効率的に放熱できる。
従って、発光素子10から発生する熱が載置部41の内部で移動する距離を短くすることができる。そのため、発光素子10から露出部43への熱伝導効率を向上させることができる。
従って、一対の第2半田フィレット303a、303bによって第1放熱経路が形成されるので、発光装置100から実装基板200へ効率的に熱を伝達させることができる。
次に、第2実施形態について図面を参照しながら説明する。第1実施形態と第2実施形態との相違点は、凹部43Sの内部が複数の空間に区切られる点である。以下においては、この相違点について主に説明する。
図14は、第2実施形態に係る発光装置100を後方から見た透視斜視図である。図14に示すように、発光装置100において、露出部43は、第1隔壁部431、第2隔壁部432、第1半田収容部433、第2半田収容部434、及び第3半田収容部435を有する。本実施形態において、第1隔壁部431、第2隔壁部432、第1半田収容部433、第2半田収容部434、及び第3半田収容部435は、凹部43Sを構成している。
まず、図15に示すようなリードフレーム45Aを準備する。リードフレーム45Aは、第1隔壁元部431A、第2隔壁元部431A、第1半田収容元部433A、第2半田収容元部434A、及び第3半田収容元部435Aを備える。
次に、ダイシングソーを用いて、所定幅の切断線(図13参照)に沿ってリードフレーム45A及びモールド板46を一緒に切断する。
第2実施形態に係る発光装置100において、露出部43は、凹部43Sの内部を2つの空間に隔てる第1隔壁部431及び第2隔壁部432を有する。
次に、第3実施形態について図面を参照しながら説明する。第1実施形態と第3実施形態との相違点は、露出部43が外部端子として機能しない点である。以下においては、この相違点について主に説明する。
図16は、第3実施形態に係る実装基板200の斜視図である。図16に示すように、実装基板200は、第3ランド203を有する。第3ランド203は、第1ランド201及び第2ランド202から離間しており、電気回路204から電気的に隔離されている。
図17は、第3実施形態に係る回路基板300の斜視図である。図17に示すように、発光装置100が実装基板200に実装されると、露出部43は、一対の第2半田フィレット303a,303bによって、第3ランド203と機械的かつ熱的に接続される。
次に、第4実施形態について図面を参照しながら説明する。第1実施形態と第4実施形態との相違点は、第2リード50の一部が第1側面20D1(背面)に向かって延出している点である。以下においては、この相違点について主に説明する。
図18は、第4実施形態に係る発光装置100を後方から見た透視斜視図である。図18に示すように、発光装置100において、第2リード50は、第1延出部101を有する。
まず、図19に示すようなリードフレーム45Bを準備する。リードフレーム45Bは、第1延出元部101Aを備える。このようなリードフレーム45Bは、接続元部51Aを形成するために片面エッチングを施す領域をC形に設定することによって形成できる。
次に、ダイシングソーを用いて、所定幅の切断線(図13参照)に沿ってリードフレーム45B及びモールド板46を一緒に切断する。
第4実施形態に係る発光装置100において、第2リード50は、第1延出部101を有する。第1延出部101は、接続部51上に配置されており、第2端子部52に接続されている。第1延出部101は、第1側面20D1において成形体30から露出している。
次に、第5実施形態について図面を参照しながら説明する。第4実施形態と第5実施形態との相違点は、第1リード40の一部も第1側面20D1(背面)に向かって延出している点である。以下においては、この相違点について主に説明する。
図20は、第5実施形態に係る発光装置100を後方から見た透視斜視図である。図20に示すように、発光装置100において、第1リード40は、第2延出部102を有し、第2リード50は、第1延出部101を有する。
第2延出部102の構成は、第1延出部101の構成と同様である。第2延出部102は、載置部41上に配置されており、第1端子部42に接続されている。第2延出部102は、載置部41の第1側面20D1側の表面から第1側面20D1に向かって延出しており、第1側面20D1において成形体30から露出している。第2延出部102は、第1側面20D1の一部を形成する第2延出面102Sを有する。
まず、図21に示すようなリードフレーム45Cを準備する。リードフレーム45Cは、第1延出元部101Aと第2延出元部102Aとを備える。このようなリードフレーム45Cは、載置元部41A及び接続元部51Aを形成するために片面エッチングを施す領域を図21に示すように設定することによって形成できる。
次に、ダイシングソーを用いて、図23に示すように、所定幅の切断線H1及び切断線H2に沿って発光装置用パッケージアレイPAを切断する。
第5実施形態に係る発光装置100において、第1リード40は、第2延出部102を有する。第2延出部102は、載置部41上に配置されており、第1端子部42に接続されている。第2延出部102は、第1側面20D1において成形体30から露出している。
なお、第2リード50が第1延出部101を有することによる効果は、上記第4実施形態において説明したとおりである。
本発明は上記の実施形態によって記載したが、この開示の一部をなす論述及び図面はこの発明を限定するものであると理解すべきではない。この開示から当業者には様々な代替実施形態、実施例及び運用技術が明らかとなろう。
10…発光素子
11…第1ワイヤ
12…第2ワイヤ
20…パッケージ
20A…底面
20D1…第1側面
30…成形体
40…第1リード
41…載置部
42…第1端子部
43…露出部
43S…凹部
43A…第1露出面
43B…第2露出面
45…リードフレーム
451…金属薄板
46…モールド板
50…第2リード
51…接続部
52…第2端子部
60…封止樹脂
101…第1延出部
102…第2延出部
200…実装基板
200A…実装面
201…第1ランド
202…第2ランド
203…第3ランド
204…電気回路
300…回路基板
301…第1半田フィレット
303a、303b…第2半田フィレット
302…第3半田フィレット
S…主面
M…マスク
F…フレーム部
G…エッチング孔部
H…エッチング凹部
P…肉厚部
Q…肉薄部
R…連結フレーム
PA…発光装置用パッケージアレイ
X,Y…片面エッチング凹部
Claims (13)
- 発光素子と、
成形体と前記成形体に埋設されるリードとによって構成されるパッケージと、
を備え、
前記リードは、前記発光素子が載置される載置部と、前記載置部に連結される端子部と、露出部と、を含み、
前記パッケージは、光出射面と、前記光出射面に対向する背面と、前記光出射面及び前記背面に連なる底面と、を有し、
前記発光素子は、前記載置部の前記光出射面側に載置され、
前記露出部は、前記載置部の前記背面側に連結され、前記底面及び前記背面で前記成形体から露出され、
前記端子部は、前記底面で前記成形体から露出される発光装置。 - 前記露出部は、前記底面と前記背面とに連なって開口する凹部を有する、
請求項1に記載の発光装置。 - 前記凹部は、前記底面と前記背面との境界線に平行な第1方向に沿って延びる、
請求項2に記載の発光装置。 - 前記露出部は、前記凹部の内部を前記第1方向において2つの空間に隔てる隔壁部を有する、
請求項3に記載の発光装置。 - 前記リードは、前記載置部上に配置され、前記背面において前記成形体から露出する延出部を含み、
前記延出部は、前記端子部に接続されている、
請求項1乃至4のいずれかに記載の発光装置。 - 前記端子部は、前記背面から露出しており、
前記背面の平面視において、前記露出部は、前記端子部よりも大きい、
請求項1乃至5のいずれかに記載の発光装置。 - 前記露出部は、前記載置部を挟んで前記発光素子の反対側に配置される、
請求項1乃至6のいずれかに記載の発光装置。 - 発光装置と、
前記発光装置が実装される実装基板と、
前記実装基板上にそれぞれ配置される第1半田フィレット及び第2半田フィレットと、
を備え、
前記発光装置は、
発光素子と、
成形体と前記成形体に埋設されるリードとによって構成されるパッケージと、
を有し、
前記リードは、前記発光素子が載置される載置部と、前記載置部に連結される端子部と、露出部と、を含み、
前記パッケージは、光出射面と、前記光出射面に対向する背面と、前記光出射面及び前記背面に連なる底面と、を有し、
前記発光素子は、前記載置部の前記光出射面側に載置され、
前記露出部は、前記載置部の前記背面側に連結され、前記底面及び前記背面で前記成形体から露出され、
前記端子部は、前記底面で前記成形体から露出されており、
前記第1半田フィレットは、前記端子部と前記実装基板とに接続され、
前記第2半田フィレットは、前記露出部と前記実装基板とに接続されている、
回路基板。 - 前記露出部は、前記底面と前記背面とに連なって開口する凹部を有し、
前記凹部は、前記底面と前記背面との境界線に平行な第1方向と交差する内壁を含み、
前記第2半田フィレットは、前記実装基板と前記内壁とに跨って接続されており、
前記発光素子の出射光は、前記背面に対して垂直な第2方向に取り出される、
請求項8に記載の回路基板。 - 樹脂によって構成されるモールド板と、
第1フレーム部と、所定方向において前記第1フレーム部に隣接する第2フレーム部と、を有し、前記モールド板に埋設される薄板状のリードフレームと、
を備え、
前記第1フレーム部及び前記第2フレーム部のそれぞれは、
第1厚みを有し、前記モールド板から露出する第1肉厚部と、
前記第1厚みを有し、前記モールド板から露出しており、前記所定方向において前記第1肉厚部から離間する第2肉厚部と、
前記第1厚みよりも小さい第2厚みを有し、前記第1肉厚部と前記第2肉厚部とに連結される第1肉薄部と、
前記第2厚みを有し、前記第2肉厚部に連結されており、前記所定方向において前記第1肉薄部から離間する第2肉薄部と、
を含む、
発光装置用パッケージアレイ。 - 前記リードフレームは、前記第1フレーム部及び第2フレーム部と同様の構成を有する第3フレーム部及び第4フレーム部を有し、
前記第3フレーム部及び第4フレーム部は、厚み方向に平行な軸心を中心として、前記第1フレーム部及び前記第2フレーム部に対して回転対称に配置されており、
前記第3フレーム部の前記第1肉厚部は、前記第1フレーム部の前記第1肉厚部に連結され、
前記第3フレーム部の前記第2肉厚部は、前記第2フレーム部の前記第2肉厚部に連結され、
前記第4フレーム部の前記第2肉厚部は、前記第1フレーム部の前記第2肉厚部に連結されている、
請求項10に記載の発光装置用パッケージアレイ。 - 前記リードフレームは、前記第1フレーム部及び第2フレーム部と同様の構成を有する第3フレーム部及び第4フレーム部を有し、
前記第3フレーム部は、前記所定方向に直交する直交方向において前記第1フレーム部に隣接し、
前記第4フレーム部は、前記直交方向において前記第2フレーム部に隣接しており、
前記第3フレーム部の前記第1肉薄部は、前記第1フレーム部の前記第1肉厚部に連結され、
前記第3フレーム部の前記第2肉薄部は、前記第1フレーム部の前記第2肉厚部に連結され、
前記第4フレーム部の前記第1肉薄部は、前記第2フレーム部の前記第1肉厚部に連結され、
前記第4フレーム部の前記第2肉薄部は、前記第2フレーム部の前記第2肉厚部に連結されている、
請求項10に記載の発光装置用パッケージアレイ。 - 金属薄板の第1主面と前記第1主面の反対に設けられる第2主面とをエッチングして、前記金属薄板にエッチング孔部を形成する両面エッチング工程と、
前記金属薄板の前記第1主面の一部をエッチングして、前記第1主面に第2パターンのエッチング凹部を形成することによって、所定形状のリードフレームを形成する片面エッチング工程と、
前記リードフレームを金型内に配置し、前記金型内に樹脂を注入することによって、前記リードフレームが埋設されるモールド板を形成するモールド工程と、
を備え、
前記リードフレームは、発光素子を載置するための載置部に連結された露出部を構成する肉厚部と、前記エッチング孔部を介して前記載置部から離間する接続部を構成する肉薄部と、を有している、
発光装置用パッケージアレイの製造方法。
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JP2014216622A (ja) * | 2013-04-30 | 2014-11-17 | 日亜化学工業株式会社 | 発光装置の製造方法 |
WO2023048007A1 (ja) * | 2021-09-24 | 2023-03-30 | スタンレー電気株式会社 | 発光装置及び発光装置の製造方法 |
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CN108807652B (zh) * | 2017-04-28 | 2023-03-21 | 日亚化学工业株式会社 | 发光装置 |
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