JP5016155B2 - 能動集積回路上のボンディングのためのシステム及び方法 - Google Patents

能動集積回路上のボンディングのためのシステム及び方法 Download PDF

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JP5016155B2
JP5016155B2 JP19266699A JP19266699A JP5016155B2 JP 5016155 B2 JP5016155 B2 JP 5016155B2 JP 19266699 A JP19266699 A JP 19266699A JP 19266699 A JP19266699 A JP 19266699A JP 5016155 B2 JP5016155 B2 JP 5016155B2
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integrated circuit
dielectric layer
bond pad
layer
metal
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JP2000049190A (ja
JP2000049190A5 (enExample
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サラン ムクル
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テキサス インスツルメンツ インコーポレイテッド
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
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  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
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