JP4983565B2 - 基板洗浄装置、基板洗浄方法及び記憶媒体 - Google Patents
基板洗浄装置、基板洗浄方法及び記憶媒体 Download PDFInfo
- Publication number
- JP4983565B2 JP4983565B2 JP2007303453A JP2007303453A JP4983565B2 JP 4983565 B2 JP4983565 B2 JP 4983565B2 JP 2007303453 A JP2007303453 A JP 2007303453A JP 2007303453 A JP2007303453 A JP 2007303453A JP 4983565 B2 JP4983565 B2 JP 4983565B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cleaning
- back surface
- wafer
- substrate holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004140 cleaning Methods 0.000 title claims description 285
- 239000000758 substrate Substances 0.000 title claims description 255
- 238000000034 method Methods 0.000 title claims description 34
- 238000003860 storage Methods 0.000 title claims description 7
- 239000007788 liquid Substances 0.000 claims description 92
- 230000002093 peripheral effect Effects 0.000 claims description 31
- 238000001035 drying Methods 0.000 claims description 27
- 239000002245 particle Substances 0.000 claims description 25
- 230000003028 elevating effect Effects 0.000 claims description 13
- 239000012530 fluid Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 238000007664 blowing Methods 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 3
- 238000001179 sorption measurement Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 197
- 238000012546 transfer Methods 0.000 description 44
- 230000007246 mechanism Effects 0.000 description 25
- 239000007789 gas Substances 0.000 description 21
- 230000008569 process Effects 0.000 description 17
- 239000011248 coating agent Substances 0.000 description 16
- 238000000576 coating method Methods 0.000 description 16
- 238000012545 processing Methods 0.000 description 15
- 238000005406 washing Methods 0.000 description 15
- 238000004804 winding Methods 0.000 description 9
- 239000003595 mist Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 229910021641 deionized water Inorganic materials 0.000 description 5
- 238000007654 immersion Methods 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000001174 ascending effect Effects 0.000 description 3
- 238000004590 computer program Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 230000002209 hydrophobic effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 101100221835 Arabidopsis thaliana CPL2 gene Proteins 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 101100221836 Arabidopsis thaliana CPL3 gene Proteins 0.000 description 1
- 101100221837 Arabidopsis thaliana CPL4 gene Proteins 0.000 description 1
- 101100065702 Arabidopsis thaliana ETC3 gene Proteins 0.000 description 1
- 101100536545 Arabidopsis thaliana TCL2 gene Proteins 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 101150075071 TRS1 gene Proteins 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
- H01L21/0209—Cleaning of wafer backside
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Liquid Crystal (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007303453A JP4983565B2 (ja) | 2006-12-20 | 2007-11-22 | 基板洗浄装置、基板洗浄方法及び記憶媒体 |
US12/000,670 US8578953B2 (en) | 2006-12-20 | 2007-12-14 | Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium |
TW101116505A TWI390590B (zh) | 2006-12-20 | 2007-12-19 | 基板洗淨裝置 |
TW096148782A TWI390589B (zh) | 2006-12-20 | 2007-12-19 | 基板洗淨裝置、基板洗淨方法及記憶媒體 |
KR1020070134132A KR101061912B1 (ko) | 2006-12-20 | 2007-12-20 | 기판 세정 장치, 기판 세정 방법 및 기억 매체 |
US14/049,815 US20140102474A1 (en) | 2006-12-20 | 2013-10-09 | Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium |
US15/204,068 US9716002B2 (en) | 2006-12-20 | 2016-07-07 | Substrate cleaning method |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006343309 | 2006-12-20 | ||
JP2006343309 | 2006-12-20 | ||
JP2007303453A JP4983565B2 (ja) | 2006-12-20 | 2007-11-22 | 基板洗浄装置、基板洗浄方法及び記憶媒体 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012094888A Division JP5348277B2 (ja) | 2006-12-20 | 2012-04-18 | 基板洗浄装置、基板洗浄方法及び記憶媒体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008177541A JP2008177541A (ja) | 2008-07-31 |
JP4983565B2 true JP4983565B2 (ja) | 2012-07-25 |
Family
ID=39567093
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007303453A Active JP4983565B2 (ja) | 2006-12-20 | 2007-11-22 | 基板洗浄装置、基板洗浄方法及び記憶媒体 |
JP2012094888A Active JP5348277B2 (ja) | 2006-12-20 | 2012-04-18 | 基板洗浄装置、基板洗浄方法及び記憶媒体 |
JP2013173501A Active JP5641110B2 (ja) | 2006-12-20 | 2013-08-23 | 基板洗浄装置、基板洗浄方法及び記憶媒体 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012094888A Active JP5348277B2 (ja) | 2006-12-20 | 2012-04-18 | 基板洗浄装置、基板洗浄方法及び記憶媒体 |
JP2013173501A Active JP5641110B2 (ja) | 2006-12-20 | 2013-08-23 | 基板洗浄装置、基板洗浄方法及び記憶媒体 |
Country Status (4)
Country | Link |
---|---|
JP (3) | JP4983565B2 (zh) |
KR (1) | KR101061912B1 (zh) |
CN (1) | CN100580871C (zh) |
TW (2) | TWI390589B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220053013A (ko) | 2019-09-17 | 2022-04-28 | 가부시키가이샤 스크린 홀딩스 | 기판 세정 장치 |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5058085B2 (ja) * | 2008-07-02 | 2012-10-24 | 東京エレクトロン株式会社 | 基板洗浄装置 |
JP5084656B2 (ja) * | 2008-07-29 | 2012-11-28 | 東京エレクトロン株式会社 | 現像処理方法及び現像処理装置 |
CN101447415A (zh) * | 2008-12-19 | 2009-06-03 | 上海集成电路研发中心有限公司 | 半导体硅片清洗装置及其清洗方法 |
JP5349944B2 (ja) * | 2008-12-24 | 2013-11-20 | 株式会社荏原製作所 | 基板処理装置の液飛散防止カップ、基板処理装置、及びその運転方法 |
JP5254120B2 (ja) * | 2009-04-22 | 2013-08-07 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
JP2010287686A (ja) * | 2009-06-10 | 2010-12-24 | Tokyo Electron Ltd | 塗布、現像装置及び基板の裏面洗浄方法。 |
CN102211095B (zh) * | 2010-04-02 | 2013-11-06 | 中芯国际集成电路制造(上海)有限公司 | 一种晶片清洗方法 |
JP5397399B2 (ja) * | 2010-07-09 | 2014-01-22 | 東京エレクトロン株式会社 | 塗布、現像装置 |
CN102357477B (zh) * | 2011-09-23 | 2013-10-02 | 北京七星华创电子股份有限公司 | 防污染装置 |
JP5637974B2 (ja) * | 2011-11-28 | 2014-12-10 | 東京エレクトロン株式会社 | 基板洗浄装置及び基板洗浄方法 |
CN103506339B (zh) * | 2012-06-28 | 2017-04-19 | 盛美半导体设备(上海)有限公司 | 晶圆背面清洗装置及清洗方法 |
CN102779772A (zh) * | 2012-07-16 | 2012-11-14 | 北京七星华创电子股份有限公司 | 晶片背面清洗装置 |
JP5887227B2 (ja) * | 2012-08-07 | 2016-03-16 | 株式会社荏原製作所 | ドレッサーディスク洗浄用ブラシ、洗浄装置及び洗浄方法 |
JP6001961B2 (ja) * | 2012-08-29 | 2016-10-05 | 株式会社Screenセミコンダクターソリューションズ | 基板処理装置および基板処理方法 |
JP5973901B2 (ja) * | 2012-12-13 | 2016-08-23 | 東京エレクトロン株式会社 | 基板液処理装置及び基板液処理方法 |
JP5904169B2 (ja) * | 2013-07-23 | 2016-04-13 | 東京エレクトロン株式会社 | 基板洗浄装置、基板洗浄方法及び記憶媒体 |
JP6415662B2 (ja) * | 2013-11-13 | 2018-10-31 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
JP6210935B2 (ja) * | 2013-11-13 | 2017-10-11 | 東京エレクトロン株式会社 | 研磨洗浄機構、基板処理装置及び基板処理方法 |
JP6442582B2 (ja) * | 2014-03-05 | 2018-12-19 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記録媒体 |
JP6600470B2 (ja) | 2014-04-01 | 2019-10-30 | 株式会社荏原製作所 | 洗浄装置及び洗浄方法 |
JP2016051727A (ja) * | 2014-08-28 | 2016-04-11 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置及び記録媒体 |
JP6386424B2 (ja) | 2015-08-06 | 2018-09-05 | 東芝メモリ株式会社 | 半導体製造装置および半導体装置の製造方法 |
JP6552931B2 (ja) * | 2015-09-18 | 2019-07-31 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
WO2017163633A1 (ja) * | 2016-03-22 | 2017-09-28 | 東京エレクトロン株式会社 | 基板洗浄装置 |
JP6740066B2 (ja) | 2016-09-13 | 2020-08-12 | 株式会社Screenホールディングス | 基板洗浄装置、基板処理装置および基板洗浄方法 |
JP6783624B2 (ja) * | 2016-10-27 | 2020-11-11 | 株式会社ディスコ | 洗浄装置 |
TWI821887B (zh) * | 2016-11-29 | 2023-11-11 | 日商東京威力科創股份有限公司 | 基板處理裝置、基板處理方法及記錄媒體 |
JP6750040B2 (ja) * | 2016-12-28 | 2020-09-02 | 芝浦メカトロニクス株式会社 | 基板処理装置及び基板処理方法 |
US10410936B2 (en) | 2017-05-19 | 2019-09-10 | Illinois Tool Works Inc. | Methods and apparatuses for effluent monitoring for brush conditioning |
CN109426085A (zh) * | 2017-08-25 | 2019-03-05 | 台湾积体电路制造股份有限公司 | 用于清洁光刻设备的集光镜的装置及方法 |
KR102628175B1 (ko) * | 2017-11-14 | 2024-01-23 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판 처리 장치 및 기판 처리 방법 |
JP7148349B2 (ja) * | 2017-11-14 | 2022-10-05 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
TWI834489B (zh) * | 2017-12-13 | 2024-03-01 | 日商東京威力科創股份有限公司 | 基板處理裝置 |
CN109031717A (zh) * | 2018-08-10 | 2018-12-18 | 昆山弘锦威电子有限公司 | Tft-lcd模块的加工工艺 |
JP7222721B2 (ja) * | 2019-01-17 | 2023-02-15 | 株式会社ディスコ | 洗浄機構 |
CN110148573B (zh) * | 2019-04-17 | 2020-12-04 | 湖州达立智能设备制造有限公司 | 一种半导体设备工艺腔的晶圆升降装置 |
CN110459493B (zh) * | 2019-08-21 | 2022-03-22 | 北京北方华创微电子装备有限公司 | 抽真空腔室及抽真空方法 |
CN111085954A (zh) * | 2019-12-24 | 2020-05-01 | 深圳市华星光电半导体显示技术有限公司 | 基板吸附装置 |
JP7504421B2 (ja) * | 2020-02-28 | 2024-06-24 | 株式会社Screenホールディングス | 基板処理装置 |
TWI718078B (zh) * | 2020-07-13 | 2021-02-01 | 環球晶圓股份有限公司 | 晶片承載裝置 |
JP7491805B2 (ja) | 2020-10-05 | 2024-05-28 | 株式会社Screenホールディングス | 基板洗浄装置および基板洗浄方法 |
CN112051679A (zh) * | 2020-10-15 | 2020-12-08 | 深圳市金晓时代科技有限公司 | 一种液晶显示屏的制程设备及其制程工艺 |
JP2022128166A (ja) | 2021-02-22 | 2022-09-01 | 東京エレクトロン株式会社 | 基板洗浄方法及び基板洗浄装置 |
US11688600B1 (en) * | 2021-12-03 | 2023-06-27 | Pulseforge, Inc. | Method and apparatus for removing particles from the surface of a semiconductor wafer |
CN117497401A (zh) * | 2024-01-02 | 2024-02-02 | 宁波润华全芯微电子设备有限公司 | 一种晶圆背面清洗方法和装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63155622A (ja) * | 1986-12-18 | 1988-06-28 | Nec Corp | 半導体基板洗浄装置 |
JPH04278518A (ja) * | 1991-03-07 | 1992-10-05 | Fujitsu Ltd | 半導体装置の製造方法と半導体製造装置 |
JPH0684857A (ja) * | 1992-08-31 | 1994-03-25 | Nikon Corp | 基板の洗浄方法 |
JPH09298181A (ja) * | 1996-05-07 | 1997-11-18 | Tokyo Ohka Kogyo Co Ltd | 基板の裏面洗浄装置 |
JP3673329B2 (ja) * | 1996-07-05 | 2005-07-20 | 大日本スクリーン製造株式会社 | 基板処理装置および洗浄方法 |
JP3330300B2 (ja) | 1997-02-28 | 2002-09-30 | 東京エレクトロン株式会社 | 基板洗浄装置 |
JPH11301849A (ja) * | 1998-04-22 | 1999-11-02 | Shin Etsu Handotai Co Ltd | ウェーハチャック装置及びウェーハ洗浄システム |
US6352623B1 (en) * | 1999-12-17 | 2002-03-05 | Nutool, Inc. | Vertically configured chamber used for multiple processes |
JP2001332606A (ja) * | 2000-05-19 | 2001-11-30 | Nec Kyushu Ltd | 半導体装置の製造装置および製造方法 |
JP2001343755A (ja) * | 2000-06-01 | 2001-12-14 | Nikon Corp | 静電チャック保護方法及びデバイス製造方法 |
JP2002353183A (ja) * | 2001-05-28 | 2002-12-06 | Nisso Engineering Co Ltd | ウエハ洗浄装置 |
JP2003068695A (ja) * | 2001-08-29 | 2003-03-07 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
JP3959612B2 (ja) * | 2002-01-22 | 2007-08-15 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
JP4357943B2 (ja) * | 2003-12-02 | 2009-11-04 | エス・イー・エス株式会社 | 基板処理法及び基板処理装置 |
US7803230B2 (en) * | 2004-04-06 | 2010-09-28 | Tokyo Electron Limited | Substrate cleaning apparatus, substrate cleaning method, and medium for recording program used for the method |
-
2007
- 2007-11-22 JP JP2007303453A patent/JP4983565B2/ja active Active
- 2007-12-19 TW TW096148782A patent/TWI390589B/zh active
- 2007-12-19 TW TW101116505A patent/TWI390590B/zh active
- 2007-12-20 KR KR1020070134132A patent/KR101061912B1/ko active IP Right Grant
- 2007-12-20 CN CN200710160027A patent/CN100580871C/zh active Active
-
2012
- 2012-04-18 JP JP2012094888A patent/JP5348277B2/ja active Active
-
2013
- 2013-08-23 JP JP2013173501A patent/JP5641110B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220053013A (ko) | 2019-09-17 | 2022-04-28 | 가부시키가이샤 스크린 홀딩스 | 기판 세정 장치 |
Also Published As
Publication number | Publication date |
---|---|
JP5641110B2 (ja) | 2014-12-17 |
KR20080058223A (ko) | 2008-06-25 |
TWI390590B (zh) | 2013-03-21 |
JP2014017499A (ja) | 2014-01-30 |
JP2012191215A (ja) | 2012-10-04 |
CN101207007A (zh) | 2008-06-25 |
TW200841378A (en) | 2008-10-16 |
JP2008177541A (ja) | 2008-07-31 |
KR101061912B1 (ko) | 2011-09-02 |
TW201250771A (en) | 2012-12-16 |
TWI390589B (zh) | 2013-03-21 |
CN100580871C (zh) | 2010-01-13 |
JP5348277B2 (ja) | 2013-11-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4983565B2 (ja) | 基板洗浄装置、基板洗浄方法及び記憶媒体 | |
JP5136103B2 (ja) | 洗浄装置及びその方法、塗布、現像装置及びその方法、並びに記憶媒体 | |
JP5058085B2 (ja) | 基板洗浄装置 | |
JP5904169B2 (ja) | 基板洗浄装置、基板洗浄方法及び記憶媒体 | |
US9716002B2 (en) | Substrate cleaning method | |
JP5583503B2 (ja) | 基板洗浄装置、およびこれを備える塗布現像装置 | |
KR101389632B1 (ko) | 도포, 현상 장치 및 도포, 현상 방법 | |
KR20010062439A (ko) | 도포막 형성장치 | |
JP3993496B2 (ja) | 基板の処理方法および塗布処理装置 | |
JP6969434B2 (ja) | 洗浄具、基板洗浄装置及び基板洗浄方法 | |
JP6051858B2 (ja) | 基板処理装置 | |
JP3752136B2 (ja) | 現像処理装置および現像処理方法 | |
JP2000153209A (ja) | 被処理体の液処理装置及び液処理方法 | |
JP7360973B2 (ja) | 現像処理装置及び現像処理方法 | |
JP2002280292A (ja) | 基板処理方法および現像処理方法 | |
JP2000325894A (ja) | 基板洗浄装置 | |
JP2001179190A (ja) | 基板洗浄方法及び基板洗浄装置 | |
JP2001237170A (ja) | 現像処理方法および現像処理装置 | |
JP3356989B2 (ja) | 処理装置 | |
JPH10106945A (ja) | 処理装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20091118 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110711 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110816 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111014 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120327 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120409 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4983565 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150511 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |