JP4983565B2 - 基板洗浄装置、基板洗浄方法及び記憶媒体 - Google Patents

基板洗浄装置、基板洗浄方法及び記憶媒体 Download PDF

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Publication number
JP4983565B2
JP4983565B2 JP2007303453A JP2007303453A JP4983565B2 JP 4983565 B2 JP4983565 B2 JP 4983565B2 JP 2007303453 A JP2007303453 A JP 2007303453A JP 2007303453 A JP2007303453 A JP 2007303453A JP 4983565 B2 JP4983565 B2 JP 4983565B2
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Japan
Prior art keywords
substrate
cleaning
back surface
wafer
substrate holding
Prior art date
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JP2007303453A
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English (en)
Japanese (ja)
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JP2008177541A (ja
Inventor
靖史 滝口
太郎 山本
昭浩 藤本
修一 錦戸
大 熊谷
直人 吉高
高広 北野
容一 徳永
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Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2007303453A priority Critical patent/JP4983565B2/ja
Priority to US12/000,670 priority patent/US8578953B2/en
Priority to TW096148782A priority patent/TWI390589B/zh
Priority to TW101116505A priority patent/TWI390590B/zh
Priority to KR1020070134132A priority patent/KR101061912B1/ko
Publication of JP2008177541A publication Critical patent/JP2008177541A/ja
Application granted granted Critical
Publication of JP4983565B2 publication Critical patent/JP4983565B2/ja
Priority to US14/049,815 priority patent/US20140102474A1/en
Priority to US15/204,068 priority patent/US9716002B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B08B1/32—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/0209—Cleaning of wafer backside
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
JP2007303453A 2006-12-20 2007-11-22 基板洗浄装置、基板洗浄方法及び記憶媒体 Active JP4983565B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2007303453A JP4983565B2 (ja) 2006-12-20 2007-11-22 基板洗浄装置、基板洗浄方法及び記憶媒体
US12/000,670 US8578953B2 (en) 2006-12-20 2007-12-14 Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium
TW101116505A TWI390590B (zh) 2006-12-20 2007-12-19 基板洗淨裝置
TW096148782A TWI390589B (zh) 2006-12-20 2007-12-19 基板洗淨裝置、基板洗淨方法及記憶媒體
KR1020070134132A KR101061912B1 (ko) 2006-12-20 2007-12-20 기판 세정 장치, 기판 세정 방법 및 기억 매체
US14/049,815 US20140102474A1 (en) 2006-12-20 2013-10-09 Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium
US15/204,068 US9716002B2 (en) 2006-12-20 2016-07-07 Substrate cleaning method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006343309 2006-12-20
JP2006343309 2006-12-20
JP2007303453A JP4983565B2 (ja) 2006-12-20 2007-11-22 基板洗浄装置、基板洗浄方法及び記憶媒体

Related Child Applications (1)

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JP2012094888A Division JP5348277B2 (ja) 2006-12-20 2012-04-18 基板洗浄装置、基板洗浄方法及び記憶媒体

Publications (2)

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JP2008177541A JP2008177541A (ja) 2008-07-31
JP4983565B2 true JP4983565B2 (ja) 2012-07-25

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Family Applications (3)

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JP2007303453A Active JP4983565B2 (ja) 2006-12-20 2007-11-22 基板洗浄装置、基板洗浄方法及び記憶媒体
JP2012094888A Active JP5348277B2 (ja) 2006-12-20 2012-04-18 基板洗浄装置、基板洗浄方法及び記憶媒体
JP2013173501A Active JP5641110B2 (ja) 2006-12-20 2013-08-23 基板洗浄装置、基板洗浄方法及び記憶媒体

Family Applications After (2)

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JP2012094888A Active JP5348277B2 (ja) 2006-12-20 2012-04-18 基板洗浄装置、基板洗浄方法及び記憶媒体
JP2013173501A Active JP5641110B2 (ja) 2006-12-20 2013-08-23 基板洗浄装置、基板洗浄方法及び記憶媒体

Country Status (4)

Country Link
JP (3) JP4983565B2 (ko)
KR (1) KR101061912B1 (ko)
CN (1) CN100580871C (ko)
TW (2) TWI390589B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220053013A (ko) 2019-09-17 2022-04-28 가부시키가이샤 스크린 홀딩스 기판 세정 장치

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JP5058085B2 (ja) * 2008-07-02 2012-10-24 東京エレクトロン株式会社 基板洗浄装置
JP5084656B2 (ja) * 2008-07-29 2012-11-28 東京エレクトロン株式会社 現像処理方法及び現像処理装置
CN101447415A (zh) * 2008-12-19 2009-06-03 上海集成电路研发中心有限公司 半导体硅片清洗装置及其清洗方法
JP5349944B2 (ja) * 2008-12-24 2013-11-20 株式会社荏原製作所 基板処理装置の液飛散防止カップ、基板処理装置、及びその運転方法
JP5254120B2 (ja) * 2009-04-22 2013-08-07 東京エレクトロン株式会社 液処理装置および液処理方法
JP2010287686A (ja) * 2009-06-10 2010-12-24 Tokyo Electron Ltd 塗布、現像装置及び基板の裏面洗浄方法。
CN102211095B (zh) * 2010-04-02 2013-11-06 中芯国际集成电路制造(上海)有限公司 一种晶片清洗方法
JP5397399B2 (ja) * 2010-07-09 2014-01-22 東京エレクトロン株式会社 塗布、現像装置
CN102357477B (zh) * 2011-09-23 2013-10-02 北京七星华创电子股份有限公司 防污染装置
JP5637974B2 (ja) * 2011-11-28 2014-12-10 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法
CN103506339B (zh) * 2012-06-28 2017-04-19 盛美半导体设备（上海）有限公司 晶圆背面清洗装置及清洗方法
CN102779772A (zh) * 2012-07-16 2012-11-14 北京七星华创电子股份有限公司 晶片背面清洗装置
JP5887227B2 (ja) * 2012-08-07 2016-03-16 株式会社荏原製作所 ドレッサーディスク洗浄用ブラシ、洗浄装置及び洗浄方法
JP6001961B2 (ja) * 2012-08-29 2016-10-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理方法
JP5973901B2 (ja) * 2012-12-13 2016-08-23 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP5904169B2 (ja) * 2013-07-23 2016-04-13 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法及び記憶媒体
JP6415662B2 (ja) * 2013-11-13 2018-10-31 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP6210935B2 (ja) 2013-11-13 2017-10-11 東京エレクトロン株式会社 研磨洗浄機構、基板処理装置及び基板処理方法
JP6442582B2 (ja) * 2014-03-05 2018-12-19 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体
JP6600470B2 (ja) 2014-04-01 2019-10-30 株式会社荏原製作所 洗浄装置及び洗浄方法
JP2016051727A (ja) * 2014-08-28 2016-04-11 東京エレクトロン株式会社 基板処理方法、基板処理装置及び記録媒体
JP6386424B2 (ja) 2015-08-06 2018-09-05 東芝メモリ株式会社 半導体製造装置および半導体装置の製造方法
JP6552931B2 (ja) * 2015-09-18 2019-07-31 東京エレクトロン株式会社 基板処理装置及び基板処理方法
WO2017163633A1 (ja) * 2016-03-22 2017-09-28 東京エレクトロン株式会社 基板洗浄装置
JP6740066B2 (ja) * 2016-09-13 2020-08-12 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置、基板処理装置および基板洗浄方法
JP6783624B2 (ja) * 2016-10-27 2020-11-11 株式会社ディスコ 洗浄装置
TWI821887B (zh) * 2016-11-29 2023-11-11 日商東京威力科創股份有限公司 基板處理裝置、基板處理方法及記錄媒體
JP6750040B2 (ja) * 2016-12-28 2020-09-02 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
US10410936B2 (en) 2017-05-19 2019-09-10 Illinois Tool Works Inc. Methods and apparatuses for effluent monitoring for brush conditioning
CN109426085A (zh) * 2017-08-25 2019-03-05 台湾积体电路制造股份有限公司 用于清洁光刻设备的集光镜的装置及方法
JP7148349B2 (ja) * 2017-11-14 2022-10-05 株式会社荏原製作所 基板処理装置および基板処理方法
KR102628175B1 (ko) * 2017-11-14 2024-01-23 가부시키가이샤 에바라 세이사꾸쇼 기판 처리 장치 및 기판 처리 방법
US11139182B2 (en) * 2017-12-13 2021-10-05 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
CN109031717A (zh) * 2018-08-10 2018-12-18 昆山弘锦威电子有限公司 Tft-lcd模块的加工工艺
JP7222721B2 (ja) * 2019-01-17 2023-02-15 株式会社ディスコ 洗浄機構
CN110148573B (zh) * 2019-04-17 2020-12-04 湖州达立智能设备制造有限公司 一种半导体设备工艺腔的晶圆升降装置
CN110459493B (zh) * 2019-08-21 2022-03-22 北京北方华创微电子装备有限公司 抽真空腔室及抽真空方法
CN111085954A (zh) * 2019-12-24 2020-05-01 深圳市华星光电半导体显示技术有限公司 基板吸附装置
TWI718078B (zh) * 2020-07-13 2021-02-01 環球晶圓股份有限公司 晶片承載裝置
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KR20220053013A (ko) 2019-09-17 2022-04-28 가부시키가이샤 스크린 홀딩스 기판 세정 장치

Also Published As

Publication number Publication date
JP2014017499A (ja) 2014-01-30
TWI390590B (zh) 2013-03-21
JP2008177541A (ja) 2008-07-31
KR20080058223A (ko) 2008-06-25
KR101061912B1 (ko) 2011-09-02
TW201250771A (en) 2012-12-16
TWI390589B (zh) 2013-03-21
CN101207007A (zh) 2008-06-25
JP5641110B2 (ja) 2014-12-17
TW200841378A (en) 2008-10-16
CN100580871C (zh) 2010-01-13
JP5348277B2 (ja) 2013-11-20
JP2012191215A (ja) 2012-10-04

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