JP4949281B2 - 部品付き配線基板の製造方法 - Google Patents
部品付き配線基板の製造方法 Download PDFInfo
- Publication number
- JP4949281B2 JP4949281B2 JP2008011110A JP2008011110A JP4949281B2 JP 4949281 B2 JP4949281 B2 JP 4949281B2 JP 2008011110 A JP2008011110 A JP 2008011110A JP 2008011110 A JP2008011110 A JP 2008011110A JP 4949281 B2 JP4949281 B2 JP 4949281B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- solder bumps
- wiring board
- solder bump
- flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 229910000679 solder Inorganic materials 0.000 claims description 320
- 230000004907 flux Effects 0.000 claims description 70
- 238000000034 method Methods 0.000 claims description 43
- 238000003825 pressing Methods 0.000 claims description 40
- 238000010438 heat treatment Methods 0.000 claims description 22
- 238000002844 melting Methods 0.000 claims description 20
- 230000008018 melting Effects 0.000 claims description 20
- 230000003746 surface roughness Effects 0.000 claims description 16
- 238000007788 roughening Methods 0.000 claims description 11
- 229910010293 ceramic material Inorganic materials 0.000 claims description 7
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 230000000052 comparative effect Effects 0.000 description 34
- 239000000758 substrate Substances 0.000 description 32
- 238000005259 measurement Methods 0.000 description 17
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- 239000011800 void material Substances 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 238000005498 polishing Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 238000007872 degassing Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 238000010309 melting process Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229910020836 Sn-Ag Inorganic materials 0.000 description 3
- 229910020988 Sn—Ag Inorganic materials 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 2
- 229910017401 Au—Ge Inorganic materials 0.000 description 2
- 229910015365 Au—Si Inorganic materials 0.000 description 2
- 229910015363 Au—Sn Inorganic materials 0.000 description 2
- 229910018104 Ni-P Inorganic materials 0.000 description 2
- 229910018536 Ni—P Inorganic materials 0.000 description 2
- 229910020935 Sn-Sb Inorganic materials 0.000 description 2
- 229910008757 Sn—Sb Inorganic materials 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920001955 polyphenylene ether Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910001200 Ferrotitanium Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1301—Shape
- H01L2224/13016—Shape in side view
- H01L2224/13018—Shape in side view comprising protrusions or indentations
- H01L2224/13019—Shape in side view comprising protrusions or indentations at the bonding interface of the bump connector, i.e. on the surface of the bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Description
[第2実施形態]
12…配線基板本体
13…押圧治具としての上治具
20…配線基板本体の表面
22,111,121…はんだバンプ
27,112,122…頂部
28…フラックス
30…押圧用粗面
45…部品としてのICチップ
46…部品の底面
47…接続端子
113…酸化膜
Claims (3)
- 配線基板本体の表面側に配置された複数のはんだバンプと、部品の底面側に配置された複数の接続端子とが接合された部品付き配線基板の製造方法であって、
鉛フリーはんだからなる複数のはんだバンプの頂部を平坦化及び粗化するはんだバンプ成形工程と、
平坦化及び粗化された前記複数のはんだバンプの前記頂部にフラックスを供給するフラックス供給工程と、
前記部品における前記複数の接続端子を、フラックス供給済みの前記複数のはんだバンプに対応させて配置し、この状態で前記複数のはんだバンプを加熱溶融する加熱溶融工程と
を含み、
前記はんだバンプ成形工程では、押圧用粗面を有する押圧治具を用いて複数のはんだバンプの頂部をその高さが揃うようにプレスすることにより、前記頂部を平坦化すると同時に粗化し、前記頂部のコプラナリティの測定値を1cm 2 あたり10μm以下にしかつ表面粗さRaを0.3μm以上5μm以下にする
ことを特徴とする部品付き配線基板の製造方法。 - 前記フラックスを供給する前の前記複数のはんだバンプは、前記頂部に凹凸を有するとともに表面全体が酸化膜で覆われており、
前記フラックス供給工程において、前記酸化膜は、前記複数のはんだバンプの前記頂部にフラックスを供給することで溶かされる
ことを特徴とする請求項1に記載の部品付き配線基板の製造方法。 - 前記押圧治具は、アルミナ、窒化珪素、炭化珪素、窒化ホウ素から選択されるセラミック材によって構成されることを特徴とする請求項1または2に記載の部品付き配線基板の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008011110A JP4949281B2 (ja) | 2007-01-24 | 2008-01-22 | 部品付き配線基板の製造方法 |
TW097102429A TWI348881B (en) | 2007-01-24 | 2008-01-23 | Method for manufacturing wiring board with parts, method for manufacturing wiring board with solder humps, and wiring board |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007014229 | 2007-01-24 | ||
JP2007014229 | 2007-01-24 | ||
JP2008011110A JP4949281B2 (ja) | 2007-01-24 | 2008-01-22 | 部品付き配線基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008205446A JP2008205446A (ja) | 2008-09-04 |
JP4949281B2 true JP4949281B2 (ja) | 2012-06-06 |
Family
ID=39782568
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008011110A Expired - Fee Related JP4949281B2 (ja) | 2007-01-24 | 2008-01-22 | 部品付き配線基板の製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4949281B2 (ja) |
CN (1) | CN101276760A (ja) |
TW (1) | TWI348881B (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102522347B (zh) * | 2011-12-23 | 2015-04-29 | 清华大学 | 一种制备焊料凸块的方法 |
CN105473266A (zh) | 2013-07-31 | 2016-04-06 | 安塔亚技术公司 | 包括带焊剂储集部的预焊表面的电气部件 |
JP6201816B2 (ja) | 2014-02-28 | 2017-09-27 | 日亜化学工業株式会社 | 発光装置の製造方法及び発光素子実装用配線基板 |
US9437565B2 (en) * | 2014-12-30 | 2016-09-06 | Advanced Seminconductor Engineering, Inc. | Semiconductor substrate and semiconductor package structure having the same |
CN105140203A (zh) * | 2015-08-05 | 2015-12-09 | 三星半导体(中国)研究开发有限公司 | 焊球及其制造方法和包括焊球的球栅阵列封装件 |
SG10201701738VA (en) * | 2017-03-03 | 2018-10-30 | Aurigin Tech Pte Ltd | Apparatus And Method For Filling A Ball Grid Array |
US10388627B1 (en) * | 2018-07-23 | 2019-08-20 | Mikro Mesa Technology Co., Ltd. | Micro-bonding structure and method of forming the same |
JP6644921B1 (ja) * | 2019-01-15 | 2020-02-12 | キヤノンマシナリー株式会社 | 半田平坦化装置、ダイボンダ、半田平坦化方法、及びボンディング方法 |
CN115362044A (zh) * | 2020-04-06 | 2022-11-18 | 昭和电工材料株式会社 | 焊料粒子、焊料粒子的制造方法及带焊料粒子的基体 |
TWI807348B (zh) * | 2021-06-21 | 2023-07-01 | 矽品精密工業股份有限公司 | 覆晶作業及其應用之接合設備 |
CN114361730A (zh) * | 2021-12-28 | 2022-04-15 | 湖南海博瑞德电智控制技术有限公司 | 电芯模组用汇流排、电芯模组及其制造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09330933A (ja) * | 1996-06-12 | 1997-12-22 | Matsushita Electric Ind Co Ltd | 突起電極部の形成方法 |
JPH10112479A (ja) * | 1996-10-07 | 1998-04-28 | Fuji Xerox Co Ltd | 基板の接続方法 |
JP4151136B2 (ja) * | 1998-06-15 | 2008-09-17 | 松下電器産業株式会社 | 基板および半導体装置とその製造方法 |
JP4604387B2 (ja) * | 2001-04-24 | 2011-01-05 | パナソニック電工株式会社 | Ic実装用基板 |
JP2006032446A (ja) * | 2004-07-13 | 2006-02-02 | Toshiba Corp | 半導体部品の実装方法および実装装置 |
-
2008
- 2008-01-22 JP JP2008011110A patent/JP4949281B2/ja not_active Expired - Fee Related
- 2008-01-23 TW TW097102429A patent/TWI348881B/zh not_active IP Right Cessation
- 2008-01-23 CN CNA2008100085324A patent/CN101276760A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
TWI348881B (en) | 2011-09-11 |
JP2008205446A (ja) | 2008-09-04 |
TW200843598A (en) | 2008-11-01 |
CN101276760A (zh) | 2008-10-01 |
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