SG10201701738VA - Apparatus And Method For Filling A Ball Grid Array - Google Patents

Apparatus And Method For Filling A Ball Grid Array

Info

Publication number
SG10201701738VA
SG10201701738VA SG10201701738VA SG10201701738VA SG10201701738VA SG 10201701738V A SG10201701738V A SG 10201701738VA SG 10201701738V A SG10201701738V A SG 10201701738VA SG 10201701738V A SG10201701738V A SG 10201701738VA SG 10201701738V A SG10201701738V A SG 10201701738VA
Authority
SG
Singapore
Prior art keywords
grid array
ball grid
base
filling
plate
Prior art date
Application number
SG10201701738VA
Inventor
Boon Chew Ng
Ee Teoh Lim
Original Assignee
Aurigin Tech Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aurigin Tech Pte Ltd filed Critical Aurigin Tech Pte Ltd
Priority to SG10201701738VA priority Critical patent/SG10201701738VA/en
Priority to TW107102362A priority patent/TWI795384B/en
Priority to CN201880004787.5A priority patent/CN110023020B/en
Priority to MYPI2019005007A priority patent/MY202220A/en
Priority to PCT/SG2018/050090 priority patent/WO2018160137A1/en
Priority to US16/474,354 priority patent/US11004820B2/en
Publication of SG10201701738VA publication Critical patent/SG10201701738VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Automatic Assembly (AREA)
  • Container Filling Or Packaging Operations (AREA)

Abstract

APPARATUS AND METHOD FOR FILLING A BALL GRID ARRAY An apparatus and method for filling a ball grid array template and a method for transferring a plurality of balls are disclosed. The apparatus includes a flat base, a plate and a stationary ball supply bin. The plate is mounted on the base and configured to be rotatable about a first axis perpendicular to the base. An upper surface of the plate includes a plurality of holes forming the ball grid array template. The stationary ball supply bin is mounted to the base. The base is configured to be inclined at an angle relative to a horizontal plane. The ball supply bin is configured in use to dispense a plurality of balls onto the corresponding plurality of holes forming the ball grid array template as the plate is rotated about the first axis. FIG. 1A
SG10201701738VA 2017-03-03 2017-03-03 Apparatus And Method For Filling A Ball Grid Array SG10201701738VA (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
SG10201701738VA SG10201701738VA (en) 2017-03-03 2017-03-03 Apparatus And Method For Filling A Ball Grid Array
TW107102362A TWI795384B (en) 2017-03-03 2018-01-23 Apparatus and method for filling ball grid array and method for transferring balls
CN201880004787.5A CN110023020B (en) 2017-03-03 2018-02-27 Apparatus and method for filling a ball grid array
MYPI2019005007A MY202220A (en) 2017-03-03 2018-02-27 Apparatus and method for filling a ball grid array
PCT/SG2018/050090 WO2018160137A1 (en) 2017-03-03 2018-02-27 Apparatus and method for filling a ball grid array
US16/474,354 US11004820B2 (en) 2017-03-03 2018-02-27 Apparatus and method for filling a ball grid array

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG10201701738VA SG10201701738VA (en) 2017-03-03 2017-03-03 Apparatus And Method For Filling A Ball Grid Array

Publications (1)

Publication Number Publication Date
SG10201701738VA true SG10201701738VA (en) 2018-10-30

Family

ID=63369538

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201701738VA SG10201701738VA (en) 2017-03-03 2017-03-03 Apparatus And Method For Filling A Ball Grid Array

Country Status (6)

Country Link
US (1) US11004820B2 (en)
CN (1) CN110023020B (en)
MY (1) MY202220A (en)
SG (1) SG10201701738VA (en)
TW (1) TWI795384B (en)
WO (1) WO2018160137A1 (en)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2785140B1 (en) * 1998-10-27 2007-04-20 Novatec Sa Soc DEVICE FOR PROVIDING BALLS OR PREFORMS FOR THE MANUFACTURE OF BALL CONNECTIONS
JP3552610B2 (en) * 1999-10-22 2004-08-11 松下電器産業株式会社 Apparatus and method for transferring conductive balls, and apparatus and method for supplying conductive balls
US6766938B2 (en) * 2002-01-08 2004-07-27 Asm Assembly Automation Ltd. Apparatus and method of placing solder balls onto a substrate
TWI272708B (en) * 2002-10-14 2007-02-01 Aurigin Technology Pte Ltd Apparatus and method for filling a ball grid array template
TWI273666B (en) * 2004-06-30 2007-02-11 Athlete Fa Corp Method and device for mounting conductive ball
SG194412A1 (en) * 2006-11-22 2013-11-29 Rokko Ventures Pte Ltd An improved ball mounting apparatus and method
JP4949281B2 (en) * 2007-01-24 2012-06-06 日本特殊陶業株式会社 Manufacturing method of wiring board with components
CN101276759B (en) * 2007-03-26 2012-10-10 矽品精密工业股份有限公司 Equipment for soldering and planting ball as well as acquisition apparatus
TWI334365B (en) * 2007-04-09 2010-12-11 Korea Semiconductor System Co Ltd Flux tool for solder ball attaching machine and flux pin used therein
WO2009102281A1 (en) * 2008-02-14 2009-08-20 Aurigin Technology Pte Ltd Apparatus and method for solder ball filing
CN102610535B (en) * 2011-01-21 2014-07-09 三星半导体(中国)研究开发有限公司 Ball attachment device, solder ball picking method and solder ball mounting method
CN104183519A (en) * 2013-05-28 2014-12-03 博磊科技股份有限公司 Integrated circuit substrate ball planting apparatus and method capable of increasing integrated circuit substrate ball planting yield

Also Published As

Publication number Publication date
US20200194400A1 (en) 2020-06-18
CN110023020B (en) 2021-08-31
WO2018160137A1 (en) 2018-09-07
US11004820B2 (en) 2021-05-11
CN110023020A (en) 2019-07-16
TWI795384B (en) 2023-03-11
TW201842836A (en) 2018-12-01
MY202220A (en) 2024-04-17

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