TWI348881B - Method for manufacturing wiring board with parts, method for manufacturing wiring board with solder humps, and wiring board - Google Patents
Method for manufacturing wiring board with parts, method for manufacturing wiring board with solder humps, and wiring boardInfo
- Publication number
- TWI348881B TWI348881B TW097102429A TW97102429A TWI348881B TW I348881 B TWI348881 B TW I348881B TW 097102429 A TW097102429 A TW 097102429A TW 97102429 A TW97102429 A TW 97102429A TW I348881 B TWI348881 B TW I348881B
- Authority
- TW
- Taiwan
- Prior art keywords
- wiring board
- manufacturing
- parts
- manufacturing wiring
- humps
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1301—Shape
- H01L2224/13016—Shape in side view
- H01L2224/13018—Shape in side view comprising protrusions or indentations
- H01L2224/13019—Shape in side view comprising protrusions or indentations at the bonding interface of the bump connector, i.e. on the surface of the bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007014229 | 2007-01-24 | ||
| JP2008011110A JP4949281B2 (en) | 2007-01-24 | 2008-01-22 | Manufacturing method of wiring board with components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200843598A TW200843598A (en) | 2008-11-01 |
| TWI348881B true TWI348881B (en) | 2011-09-11 |
Family
ID=39782568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097102429A TWI348881B (en) | 2007-01-24 | 2008-01-23 | Method for manufacturing wiring board with parts, method for manufacturing wiring board with solder humps, and wiring board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4949281B2 (en) |
| CN (1) | CN101276760A (en) |
| TW (1) | TWI348881B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102522347B (en) * | 2011-12-23 | 2015-04-29 | 清华大学 | Method for manufacturing solder bump |
| EP3027347A2 (en) | 2013-07-31 | 2016-06-08 | Antaya Technologies Corporation | Electrical component having presoldered surface with flux reservoirs |
| JP6201816B2 (en) | 2014-02-28 | 2017-09-27 | 日亜化学工業株式会社 | Manufacturing method of light emitting device and wiring board for mounting light emitting element |
| US9437565B2 (en) * | 2014-12-30 | 2016-09-06 | Advanced Seminconductor Engineering, Inc. | Semiconductor substrate and semiconductor package structure having the same |
| CN105140203A (en) * | 2015-08-05 | 2015-12-09 | 三星半导体(中国)研究开发有限公司 | Solder ball and manufacturing method therefor, and ball grid array package comprising solder ball |
| SG10201701738VA (en) * | 2017-03-03 | 2018-10-30 | Aurigin Tech Pte Ltd | Apparatus And Method For Filling A Ball Grid Array |
| US10388627B1 (en) * | 2018-07-23 | 2019-08-20 | Mikro Mesa Technology Co., Ltd. | Micro-bonding structure and method of forming the same |
| JP6644921B1 (en) * | 2019-01-15 | 2020-02-12 | キヤノンマシナリー株式会社 | Solder flattening device, die bonder, solder flattening method, and bonding method |
| JPWO2021206096A1 (en) * | 2020-04-06 | 2021-10-14 | ||
| TWI807348B (en) * | 2021-06-21 | 2023-07-01 | 矽品精密工業股份有限公司 | Flip chip process and bonding equipment |
| CN114361730A (en) * | 2021-12-28 | 2022-04-15 | 湖南海博瑞德电智控制技术有限公司 | Busbar for battery cell module, battery cell module and manufacturing method of battery cell module |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09330933A (en) * | 1996-06-12 | 1997-12-22 | Matsushita Electric Ind Co Ltd | Formation of bump electrode part |
| JPH10112479A (en) * | 1996-10-07 | 1998-04-28 | Fuji Xerox Co Ltd | Method of connecting boards |
| JP4151136B2 (en) * | 1998-06-15 | 2008-09-17 | 松下電器産業株式会社 | Substrate, semiconductor device and manufacturing method thereof |
| JP4604387B2 (en) * | 2001-04-24 | 2011-01-05 | パナソニック電工株式会社 | IC mounting board |
| JP2006032446A (en) * | 2004-07-13 | 2006-02-02 | Toshiba Corp | Mounting method for semiconductor component, and mounting device |
-
2008
- 2008-01-22 JP JP2008011110A patent/JP4949281B2/en not_active Expired - Fee Related
- 2008-01-23 TW TW097102429A patent/TWI348881B/en active
- 2008-01-23 CN CNA2008100085324A patent/CN101276760A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP4949281B2 (en) | 2012-06-06 |
| JP2008205446A (en) | 2008-09-04 |
| CN101276760A (en) | 2008-10-01 |
| TW200843598A (en) | 2008-11-01 |
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