JPWO2021206096A1 - - Google Patents

Info

Publication number
JPWO2021206096A1
JPWO2021206096A1 JP2022514090A JP2022514090A JPWO2021206096A1 JP WO2021206096 A1 JPWO2021206096 A1 JP WO2021206096A1 JP 2022514090 A JP2022514090 A JP 2022514090A JP 2022514090 A JP2022514090 A JP 2022514090A JP WO2021206096 A1 JPWO2021206096 A1 JP WO2021206096A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022514090A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021206096A1 publication Critical patent/JPWO2021206096A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
JP2022514090A 2020-04-06 2021-04-06 Pending JPWO2021206096A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020068390 2020-04-06
PCT/JP2021/014656 WO2021206096A1 (en) 2020-04-06 2021-04-06 Solder particles, production method for solder particles, and substrate with solder particles

Publications (1)

Publication Number Publication Date
JPWO2021206096A1 true JPWO2021206096A1 (en) 2021-10-14

Family

ID=78023564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022514090A Pending JPWO2021206096A1 (en) 2020-04-06 2021-04-06

Country Status (4)

Country Link
JP (1) JPWO2021206096A1 (en)
CN (1) CN115362044A (en)
TW (1) TW202146679A (en)
WO (1) WO2021206096A1 (en)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5411602A (en) * 1994-02-17 1995-05-02 Microfab Technologies, Inc. Solder compositions and methods of making same
US5960307A (en) * 1996-11-27 1999-09-28 Texas Instruments Incorporated Method of forming ball grid array contacts
US6000603A (en) * 1997-05-23 1999-12-14 3M Innovative Properties Company Patterned array of metal balls and methods of making
US6426564B1 (en) * 1999-02-24 2002-07-30 Micron Technology, Inc. Recessed tape and method for forming a BGA assembly
US6784086B2 (en) * 2001-02-08 2004-08-31 International Business Machines Corporation Lead-free solder structure and method for high fatigue life
JP4949281B2 (en) * 2007-01-24 2012-06-06 日本特殊陶業株式会社 Manufacturing method of wiring board with components
JP5478193B2 (en) * 2009-09-01 2014-04-23 Ｄｏｗａホールディングス株式会社 Solder powder manufacturing method
EP2629323A1 (en) * 2010-10-12 2013-08-21 Kabushiki Kaisha Yaskawa Denki Electronic device and electronic component
EP2641676B1 (en) * 2010-11-18 2019-02-27 Dowa Holdings Co., Ltd. Process for producing solder powder
US9330998B2 (en) * 2014-04-18 2016-05-03 Laird Technologies, Inc. Thermal interface material assemblies and related methods
CN112313031A (en) * 2018-06-26 2021-02-02 昭和电工材料株式会社 Solder particle and method for producing solder particle
WO2020004510A1 (en) * 2018-06-26 2020-01-02 日立化成株式会社 Anisotropic conductive film, method for producing same, and method for producing connection structure

Also Published As

Publication number Publication date
TW202146679A (en) 2021-12-16
CN115362044A (en) 2022-11-18
WO2021206096A1 (en) 2021-10-14

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240208