JP4916671B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP4916671B2 JP4916671B2 JP2005104984A JP2005104984A JP4916671B2 JP 4916671 B2 JP4916671 B2 JP 4916671B2 JP 2005104984 A JP2005104984 A JP 2005104984A JP 2005104984 A JP2005104984 A JP 2005104984A JP 4916671 B2 JP4916671 B2 JP 4916671B2
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- Japan
- Prior art keywords
- layer
- gan
- opening
- based semiconductor
- electron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/475—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
- H10D30/4755—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs having wide bandgap charge-carrier supplying layers, e.g. modulation doped HEMTs such as n-AlGaAs/GaAs HEMTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/015—Manufacture or treatment of FETs having heterojunction interface channels or heterojunction gate electrodes, e.g. HEMT
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/477—Vertical HEMTs or vertical HHMTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/478—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] the 2D charge carrier gas being at least partially not parallel to a main surface of the semiconductor body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
Landscapes
- Junction Field-Effect Transistors (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005104984A JP4916671B2 (ja) | 2005-03-31 | 2005-03-31 | 半導体装置 |
| US11/392,639 US7592647B2 (en) | 2005-03-31 | 2006-03-30 | Semiconductor device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005104984A JP4916671B2 (ja) | 2005-03-31 | 2005-03-31 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011266051A Division JP5458084B2 (ja) | 2011-12-05 | 2011-12-05 | 半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006286942A JP2006286942A (ja) | 2006-10-19 |
| JP2006286942A5 JP2006286942A5 (enExample) | 2008-05-15 |
| JP4916671B2 true JP4916671B2 (ja) | 2012-04-18 |
Family
ID=37069259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005104984A Expired - Fee Related JP4916671B2 (ja) | 2005-03-31 | 2005-03-31 | 半導体装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7592647B2 (enExample) |
| JP (1) | JP4916671B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11990542B2 (en) | 2018-12-27 | 2024-05-21 | Panasonic Holdings Corporation | Nitride semiconductor device |
Families Citing this family (62)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5051980B2 (ja) * | 2005-03-31 | 2012-10-17 | 住友電工デバイス・イノベーション株式会社 | 半導体装置 |
| JP2007059595A (ja) * | 2005-08-24 | 2007-03-08 | Toshiba Corp | 窒化物半導体素子 |
| US7821032B2 (en) * | 2007-01-26 | 2010-10-26 | International Rectifier Corporation | III-nitride power semiconductor device |
| JP4584293B2 (ja) * | 2007-08-31 | 2010-11-17 | 富士通株式会社 | 窒化物半導体装置、ドハティ増幅器、ドレイン電圧制御増幅器 |
| FR2924270B1 (fr) * | 2007-11-27 | 2010-08-27 | Picogiga Internat | Procede de fabrication d'un dispositif electronique |
| US9048302B2 (en) * | 2008-01-11 | 2015-06-02 | The Furukawa Electric Co., Ltd | Field effect transistor having semiconductor operating layer formed with an inclined side wall |
| WO2009110254A1 (ja) * | 2008-03-04 | 2009-09-11 | 日本電気株式会社 | 電界効果トランジスタ及びその製造方法 |
| JP2010098141A (ja) * | 2008-10-16 | 2010-04-30 | Sumitomo Electric Device Innovations Inc | 半導体装置の製造方法 |
| JP5533661B2 (ja) | 2008-10-29 | 2014-06-25 | 富士通株式会社 | 化合物半導体装置及びその製造方法 |
| JP5496635B2 (ja) * | 2008-12-19 | 2014-05-21 | 住友電工デバイス・イノベーション株式会社 | 半導体装置の製造方法 |
| WO2010118090A1 (en) * | 2009-04-08 | 2010-10-14 | Efficient Power Conversion Corporation | Enhancement mode gallium nitride transistor with improved gate characteristics |
| US20100314695A1 (en) * | 2009-06-10 | 2010-12-16 | International Rectifier Corporation | Self-aligned vertical group III-V transistor and method for fabricated same |
| JP2011035066A (ja) * | 2009-07-30 | 2011-02-17 | Sumitomo Electric Ind Ltd | 窒化物半導体素子、及び窒化物半導体素子を作製する方法 |
| JP4700125B2 (ja) * | 2009-07-30 | 2011-06-15 | 住友電気工業株式会社 | 半導体装置およびその製造方法 |
| JP5529595B2 (ja) * | 2009-07-30 | 2014-06-25 | 住友電気工業株式会社 | 半導体装置及びその製造方法 |
| JP5531538B2 (ja) * | 2009-09-30 | 2014-06-25 | 住友電気工業株式会社 | ヘテロ接合トランジスタ、及びヘテロ接合トランジスタを作製する方法 |
| JP4737471B2 (ja) * | 2009-10-08 | 2011-08-03 | 住友電気工業株式会社 | 半導体装置およびその製造方法 |
| JP5299208B2 (ja) * | 2009-10-09 | 2013-09-25 | 住友電気工業株式会社 | 半導体装置およびその製造方法 |
| JP4769905B2 (ja) * | 2009-12-10 | 2011-09-07 | Dowaエレクトロニクス株式会社 | p型AlGaN層の製造方法およびIII族窒化物半導体発光素子 |
| JP4985760B2 (ja) * | 2009-12-28 | 2012-07-25 | 住友電気工業株式会社 | 半導体装置およびその製造方法 |
| JP5614057B2 (ja) * | 2010-03-02 | 2014-10-29 | 住友電気工業株式会社 | 窒化物電子デバイスを作製する方法 |
| EP2549528B1 (en) | 2010-03-19 | 2018-12-19 | Fujitsu Limited | Compound semiconductor device and method for fabricating the same |
| JP5560866B2 (ja) * | 2010-04-09 | 2014-07-30 | 住友電気工業株式会社 | 窒化物電子デバイス、窒化物電子デバイスを作製する方法 |
| EP2595181B8 (en) | 2010-07-14 | 2018-07-04 | Fujitsu Limited | Compound semiconductor device and manufacturing method thereof |
| JP5742072B2 (ja) * | 2010-10-06 | 2015-07-01 | 住友電気工業株式会社 | 半導体装置およびその製造方法 |
| JP5569321B2 (ja) * | 2010-10-07 | 2014-08-13 | 住友電気工業株式会社 | 半導体装置およびその製造方法 |
| JP2012084739A (ja) | 2010-10-13 | 2012-04-26 | Sumitomo Electric Ind Ltd | 半導体装置およびその製造方法 |
| JP2012094688A (ja) * | 2010-10-27 | 2012-05-17 | Sumitomo Electric Ind Ltd | 半導体装置およびその製造方法 |
| DE112011103675T5 (de) | 2010-11-04 | 2013-10-02 | Sumitomo Electric Industries, Ltd. | Halbleitervorrichtung und Herstellungsverfahren hierfür |
| JP5110153B2 (ja) * | 2010-11-08 | 2012-12-26 | 住友電気工業株式会社 | 半導体装置およびその製造方法 |
| JP2012104568A (ja) * | 2010-11-08 | 2012-05-31 | Sumitomo Electric Ind Ltd | 半導体装置およびその製造方法 |
| JP5003813B2 (ja) | 2010-11-15 | 2012-08-15 | 住友電気工業株式会社 | 半導体装置およびその製造方法 |
| JP2012156253A (ja) | 2011-01-25 | 2012-08-16 | Sumitomo Electric Ind Ltd | 窒化物半導体素子の製造方法 |
| JP2011135094A (ja) * | 2011-02-25 | 2011-07-07 | Sumitomo Electric Ind Ltd | 半導体装置およびその製造方法 |
| DE112011105130T5 (de) * | 2011-04-05 | 2014-01-02 | Sumitomo Electric Industries Ltd. | Verfahren zum Herstellen von elektronischen Nitrid-Bauelementen |
| WO2012164750A1 (ja) * | 2011-06-03 | 2012-12-06 | 住友電気工業株式会社 | 窒化物電子デバイス、窒化物電子デバイスを作製する方法 |
| DE112011105316T5 (de) * | 2011-06-08 | 2014-03-27 | Sumitomo Electric Industries, Ltd. | Halbleitervorrichtung und Verfahren zur Herstellung derselben |
| JP6132242B2 (ja) * | 2011-07-12 | 2017-05-24 | パナソニックIpマネジメント株式会社 | 窒化物半導体装置およびその製造方法 |
| US9136116B2 (en) * | 2011-08-04 | 2015-09-15 | Avogy, Inc. | Method and system for formation of P-N junctions in gallium nitride based electronics |
| US8969912B2 (en) | 2011-08-04 | 2015-03-03 | Avogy, Inc. | Method and system for a GaN vertical JFET utilizing a regrown channel |
| KR20130076314A (ko) * | 2011-12-28 | 2013-07-08 | 삼성전자주식회사 | 파워소자 및 이의 제조방법 |
| KR101984698B1 (ko) * | 2012-01-11 | 2019-05-31 | 삼성전자주식회사 | 기판 구조체, 이로부터 제조된 반도체소자 및 그 제조방법 |
| CN102709320B (zh) * | 2012-02-15 | 2014-09-24 | 中山大学 | 纵向导通的GaN基MISFET 器件及其制作方法 |
| US8937317B2 (en) | 2012-12-28 | 2015-01-20 | Avogy, Inc. | Method and system for co-packaging gallium nitride electronics |
| US9324645B2 (en) | 2013-05-23 | 2016-04-26 | Avogy, Inc. | Method and system for co-packaging vertical gallium nitride power devices |
| US9331197B2 (en) | 2013-08-08 | 2016-05-03 | Cree, Inc. | Vertical power transistor device |
| US10868169B2 (en) | 2013-09-20 | 2020-12-15 | Cree, Inc. | Monolithically integrated vertical power transistor and bypass diode |
| JP6271197B2 (ja) | 2013-09-20 | 2018-01-31 | 株式会社東芝 | 半導体装置およびその製造方法 |
| US8947154B1 (en) | 2013-10-03 | 2015-02-03 | Avogy, Inc. | Method and system for operating gallium nitride electronics |
| US9324809B2 (en) | 2013-11-18 | 2016-04-26 | Avogy, Inc. | Method and system for interleaved boost converter with co-packaged gallium nitride power devices |
| JP6511645B2 (ja) | 2014-02-13 | 2019-05-15 | パナソニックIpマネジメント株式会社 | 窒化物半導体デバイス |
| US10177061B2 (en) * | 2015-02-12 | 2019-01-08 | Infineon Technologies Austria Ag | Semiconductor device |
| US9865725B2 (en) * | 2015-04-14 | 2018-01-09 | Hrl Laboratories, Llc | III-nitride transistor with trench gate |
| JP6755892B2 (ja) * | 2016-02-08 | 2020-09-16 | パナソニック株式会社 | 半導体装置 |
| GB2547661A (en) * | 2016-02-24 | 2017-08-30 | Jiang Quanzhong | Layered vertical field effect transistor and methods of fabrication |
| CN106653610A (zh) * | 2016-12-26 | 2017-05-10 | 东莞市联洲知识产权运营管理有限公司 | 一种改良的沟槽超势垒整流器件及其制造方法 |
| CN111344842B (zh) | 2017-11-16 | 2023-02-21 | 松下控股株式会社 | 氮化物半导体装置 |
| JP6625287B1 (ja) * | 2019-02-19 | 2019-12-25 | 三菱電機株式会社 | 半導体装置、および、半導体装置の製造方法 |
| WO2020216250A1 (zh) * | 2019-04-26 | 2020-10-29 | 苏州晶湛半导体有限公司 | 一种增强型器件及其制备方法 |
| DE102019212645A1 (de) * | 2019-08-23 | 2021-02-25 | Robert Bosch Gmbh | Vertikaler feldeffekttransistor und verfahren zum herstellen desselben |
| US12471340B2 (en) * | 2022-10-27 | 2025-11-11 | Panjit International Inc. | Manufacturing method of forming semiconductor device and semiconductor device |
| WO2024202190A1 (ja) * | 2023-03-31 | 2024-10-03 | パナソニックホールディングス株式会社 | 窒化物半導体装置およびその製造方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2577544B2 (ja) * | 1984-08-08 | 1997-02-05 | 新技術事業団 | 半導体装置の製造方法 |
| US5406094A (en) * | 1991-10-14 | 1995-04-11 | Fujitsu Limited | Quantum interference effect semiconductor device and method of producing the same |
| JP2000312008A (ja) * | 1999-04-27 | 2000-11-07 | Fuji Electric Co Ltd | 炭化珪素静電誘導トランジスタおよびその製造方法 |
| JP3708810B2 (ja) * | 2000-09-01 | 2005-10-19 | シャープ株式会社 | 窒化物系iii−v族化合物半導体装置 |
| JP3966763B2 (ja) * | 2001-06-01 | 2007-08-29 | 古河電気工業株式会社 | GaN系半導体装置 |
| US6897495B2 (en) * | 2001-10-31 | 2005-05-24 | The Furukawa Electric Co., Ltd | Field effect transistor and manufacturing method therefor |
| JP4190754B2 (ja) | 2001-11-27 | 2008-12-03 | 古河電気工業株式会社 | 電界効果トランジスタの製造方法 |
| US6841812B2 (en) * | 2001-11-09 | 2005-01-11 | United Silicon Carbide, Inc. | Double-gated vertical junction field effect power transistor |
| JP4117535B2 (ja) * | 2001-11-30 | 2008-07-16 | 信越半導体株式会社 | 化合物半導体素子 |
| US7030428B2 (en) * | 2001-12-03 | 2006-04-18 | Cree, Inc. | Strain balanced nitride heterojunction transistors |
| JP4645034B2 (ja) * | 2003-02-06 | 2011-03-09 | 株式会社豊田中央研究所 | Iii族窒化物半導体を有する半導体素子 |
| JP4530171B2 (ja) * | 2003-08-08 | 2010-08-25 | サンケン電気株式会社 | 半導体装置 |
| WO2005024955A1 (ja) * | 2003-09-05 | 2005-03-17 | Sanken Electric Co., Ltd. | 半導体装置 |
-
2005
- 2005-03-31 JP JP2005104984A patent/JP4916671B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-30 US US11/392,639 patent/US7592647B2/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11990542B2 (en) | 2018-12-27 | 2024-05-21 | Panasonic Holdings Corporation | Nitride semiconductor device |
| US12328894B2 (en) | 2018-12-27 | 2025-06-10 | Panasonic Holdings Corporation | Nitride semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006286942A (ja) | 2006-10-19 |
| US7592647B2 (en) | 2009-09-22 |
| US20060220060A1 (en) | 2006-10-05 |
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