JP4909424B2 - 静電チャック - Google Patents

静電チャック Download PDF

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Publication number
JP4909424B2
JP4909424B2 JP2010056826A JP2010056826A JP4909424B2 JP 4909424 B2 JP4909424 B2 JP 4909424B2 JP 2010056826 A JP2010056826 A JP 2010056826A JP 2010056826 A JP2010056826 A JP 2010056826A JP 4909424 B2 JP4909424 B2 JP 4909424B2
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JP
Japan
Prior art keywords
protrusion
electrostatic chuck
wafer
temperature
protrusions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2010056826A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010135851A (ja
Inventor
伸也 西本
博之 中山
英利 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Sumitomo Osaka Cement Co Ltd
Original Assignee
Tokyo Electron Ltd
Sumitomo Osaka Cement Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Sumitomo Osaka Cement Co Ltd filed Critical Tokyo Electron Ltd
Priority to JP2010056826A priority Critical patent/JP4909424B2/ja
Publication of JP2010135851A publication Critical patent/JP2010135851A/ja
Application granted granted Critical
Publication of JP4909424B2 publication Critical patent/JP4909424B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H10P72/0434—
    • H10P72/50—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H10P72/72—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2010056826A 2003-12-05 2010-03-13 静電チャック Expired - Lifetime JP4909424B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010056826A JP4909424B2 (ja) 2003-12-05 2010-03-13 静電チャック

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003408224 2003-12-05
JP2003408224 2003-12-05
JP2010056826A JP4909424B2 (ja) 2003-12-05 2010-03-13 静電チャック

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004351448A Division JP4674792B2 (ja) 2003-12-05 2004-12-03 静電チャック

Publications (2)

Publication Number Publication Date
JP2010135851A JP2010135851A (ja) 2010-06-17
JP4909424B2 true JP4909424B2 (ja) 2012-04-04

Family

ID=34779858

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010056825A Pending JP2010147502A (ja) 2003-12-05 2010-03-13 静電チャック
JP2010056826A Expired - Lifetime JP4909424B2 (ja) 2003-12-05 2010-03-13 静電チャック

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2010056825A Pending JP2010147502A (ja) 2003-12-05 2010-03-13 静電チャック

Country Status (5)

Country Link
US (1) US7663860B2 (enExample)
JP (2) JP2010147502A (enExample)
KR (1) KR100666039B1 (enExample)
CN (1) CN1310303C (enExample)
TW (1) TW200524075A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9466518B2 (en) 2013-05-31 2016-10-11 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7663860B2 (en) 2003-12-05 2010-02-16 Tokyo Electron Limited Electrostatic chuck
US20060238954A1 (en) * 2005-04-21 2006-10-26 Applied Materials, Inc., A Delaware Corporation Electrostatic chuck for track thermal plates
JP4657824B2 (ja) * 2005-06-17 2011-03-23 東京エレクトロン株式会社 基板載置台、基板処理装置および基板載置台の製造方法
US7248457B2 (en) * 2005-11-15 2007-07-24 Toto Ltd. Electrostatic chuck
CN1994839B (zh) * 2006-01-05 2012-07-18 财团法人工业技术研究院 静电吸附装置
JP5069452B2 (ja) * 2006-04-27 2012-11-07 アプライド マテリアルズ インコーポレイテッド 二重温度帯を有する静電チャックをもつ基板支持体
US8226769B2 (en) 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
JP5032818B2 (ja) * 2006-09-29 2012-09-26 新光電気工業株式会社 静電チャック
US8690135B2 (en) * 2006-12-18 2014-04-08 Camtek Ltd. Chuck and a method for supporting an object
CN101221893B (zh) * 2007-01-12 2010-05-19 北京北方微电子基地设备工艺研究中心有限责任公司 一种促进半导体晶片上静电电荷消散的方法
JP4864757B2 (ja) * 2007-02-14 2012-02-01 東京エレクトロン株式会社 基板載置台及びその表面処理方法
US20080225261A1 (en) * 2007-03-13 2008-09-18 Noriyuki Hirayanagi Exposure apparatus and device manufacturing method
KR100855002B1 (ko) * 2007-05-23 2008-08-28 삼성전자주식회사 플라즈마 이온 주입시스템
KR100938874B1 (ko) * 2007-07-24 2010-01-27 주식회사 에스에프에이 유리기판 지지용 서셉터 및 그 제조 방법, 그리고 그유리기판 지지용 서셉터를 구비한 화학 기상 증착장치
CN101802998B (zh) * 2007-09-11 2014-07-30 佳能安内华股份有限公司 静电夹具
KR101007534B1 (ko) * 2008-11-05 2011-01-14 주식회사 테스 반도체 제조장치 및 이를 이용한 실리콘 산화막 건식 식각 방법
US20100116788A1 (en) * 2008-11-12 2010-05-13 Lam Research Corporation Substrate temperature control by using liquid controlled multizone substrate support
JP5882918B2 (ja) * 2010-02-24 2016-03-09 ビーコ・インストゥルメンツ・インコーポレイテッド 温度分配制御装置を用いる処理方法および処理装置
JP5454803B2 (ja) * 2010-08-11 2014-03-26 Ｔｏｔｏ株式会社 静電チャック
JP5510411B2 (ja) * 2010-08-11 2014-06-04 Ｔｏｔｏ株式会社 静電チャック及び静電チャックの製造方法
JP5993568B2 (ja) * 2011-11-09 2016-09-14 東京エレクトロン株式会社 基板載置システム、基板処理装置、静電チャック及び基板冷却方法
JP6010433B2 (ja) * 2012-11-15 2016-10-19 東京エレクトロン株式会社 基板載置台および基板処理装置
US9395404B2 (en) * 2012-12-14 2016-07-19 Infineon Technologies Ag Method for testing semiconductor chips or semiconductor chip modules
KR102112368B1 (ko) * 2013-02-28 2020-05-18 도쿄엘렉트론가부시키가이샤 탑재대 및 플라즈마 처리 장치
JP6173936B2 (ja) * 2013-02-28 2017-08-02 東京エレクトロン株式会社 載置台及びプラズマ処理装置
US9273413B2 (en) 2013-03-14 2016-03-01 Veeco Instruments Inc. Wafer carrier with temperature distribution control
JP5538613B1 (ja) * 2013-11-13 2014-07-02 東京エレクトロン株式会社 接合装置及び接合システム
WO2015120265A1 (en) * 2014-02-07 2015-08-13 Entegris, Inc. Electrostatic chuck and method of making same
KR20150138959A (ko) * 2014-05-30 2015-12-11 (주)아이씨디 챔버 내 피처리 대상물 접촉구조, 정전 척 및 그 제조방법
KR20160015510A (ko) * 2014-07-30 2016-02-15 삼성전자주식회사 정전척 어셈블리, 이를 구비하는 반도체 제조장치, 및 이를 이용한 플라즈마 처리방법
JP6168162B2 (ja) * 2014-09-30 2017-07-26 住友大阪セメント株式会社 静電チャック装置
US10262886B2 (en) 2014-09-30 2019-04-16 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device
US20160230269A1 (en) * 2015-02-06 2016-08-11 Applied Materials, Inc. Radially outward pad design for electrostatic chuck surface
CN107636817B (zh) 2015-05-22 2021-08-27 应用材料公司 方位可调整的多区域静电夹具
KR102203402B1 (ko) * 2016-02-10 2021-01-15 엔테그리스, 아이엔씨. 입자 성능이 개선된 웨이퍼 접촉 표면 돌출 프로파일
JP6183567B1 (ja) * 2016-05-13 2017-08-23 Toto株式会社 静電チャック
JP6215426B1 (ja) * 2016-09-21 2017-10-18 オリジン電気株式会社 加熱装置及び板状部材の製造方法
US20180148835A1 (en) 2016-11-29 2018-05-31 Lam Research Corporation Substrate support with varying depths of areas between mesas and corresponding temperature dependent method of fabricating
US11114327B2 (en) * 2017-08-29 2021-09-07 Applied Materials, Inc. ESC substrate support with chucking force control
WO2019187785A1 (ja) * 2018-03-26 2019-10-03 日本碍子株式会社 静電チャックヒータ
US11133212B2 (en) * 2018-05-16 2021-09-28 Applied Materials, Inc. High temperature electrostatic chuck
JP7248608B2 (ja) 2020-02-04 2023-03-29 日本碍子株式会社 静電チャックヒータ
US11929278B2 (en) 2021-05-19 2024-03-12 Applied Materials, Inc. Low impedance current path for edge non-uniformity tuning
CN114678316A (zh) * 2021-12-10 2022-06-28 北京华卓精科科技股份有限公司 控制颗粒污染的晶圆吸附构件及装置
US12412769B2 (en) * 2023-05-16 2025-09-09 Applied Materials, Inc. Electrostatic chucks with hybrid pucks to improve thermal performance and leakage current stability

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JPH056933A (ja) 1991-06-27 1993-01-14 Kyocera Corp セラミツク製静電チヤツク
JPH0718438A (ja) * 1993-06-17 1995-01-20 Anelva Corp 静電チャック装置
JPH07153825A (ja) * 1993-11-29 1995-06-16 Toto Ltd 静電チャック及びこの静電チャックを用いた被吸着体の処理方法
JPH09172055A (ja) * 1995-12-19 1997-06-30 Fujitsu Ltd 静電チャック及びウエハの吸着方法
JPH09213777A (ja) * 1996-01-31 1997-08-15 Kyocera Corp 静電チャック
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JP3348140B2 (ja) 1996-04-08 2002-11-20 住友大阪セメント株式会社 静電チャック
US5761023A (en) * 1996-04-25 1998-06-02 Applied Materials, Inc. Substrate support with pressure zones having reduced contact area and temperature feedback
US5745332A (en) * 1996-05-08 1998-04-28 Applied Materials, Inc. Monopolar electrostatic chuck having an electrode in contact with a workpiece
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JP2000340640A (ja) 1999-05-31 2000-12-08 Toto Ltd 非接触型静電吸着装置
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JP2001308075A (ja) 2000-04-26 2001-11-02 Toshiba Ceramics Co Ltd ウェーハ支持体
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JP4387563B2 (ja) * 2000-06-05 2009-12-16 住友大阪セメント株式会社 サセプタ及びサセプタの製造方法
JP4697833B2 (ja) 2000-06-14 2011-06-08 キヤノンアネルバ株式会社 静電吸着機構及び表面処理装置
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JP2002009064A (ja) * 2000-06-21 2002-01-11 Hitachi Ltd 試料の処理装置及び試料の処理方法
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JP4312394B2 (ja) 2001-01-29 2009-08-12 日本碍子株式会社 静電チャックおよび基板処理装置
JP3626933B2 (ja) 2001-02-08 2005-03-09 東京エレクトロン株式会社 基板載置台の製造方法
JP2002270681A (ja) 2001-03-07 2002-09-20 Anelva Corp 基板処理用静電吸着機構
US6628503B2 (en) 2001-03-13 2003-09-30 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications
JP4094262B2 (ja) 2001-09-13 2008-06-04 住友大阪セメント株式会社 吸着固定装置及びその製造方法
JP4008230B2 (ja) 2001-11-14 2007-11-14 住友大阪セメント株式会社 静電チャックの製造方法
KR100511854B1 (ko) * 2002-06-18 2005-09-02 아네르바 가부시키가이샤 정전 흡착 장치
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9466518B2 (en) 2013-05-31 2016-10-11 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device

Also Published As

Publication number Publication date
KR100666039B1 (ko) 2007-01-10
CN1310303C (zh) 2007-04-11
US7663860B2 (en) 2010-02-16
US20050207088A1 (en) 2005-09-22
TWI358785B (enExample) 2012-02-21
JP2010147502A (ja) 2010-07-01
CN1624892A (zh) 2005-06-08
KR20050054831A (ko) 2005-06-10
JP2010135851A (ja) 2010-06-17
TW200524075A (en) 2005-07-16

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