CN1310303C - 静电吸盘 - Google Patents

静电吸盘 Download PDF

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Publication number
CN1310303C
CN1310303C CNB2004100969223A CN200410096922A CN1310303C CN 1310303 C CN1310303 C CN 1310303C CN B2004100969223 A CNB2004100969223 A CN B2004100969223A CN 200410096922 A CN200410096922 A CN 200410096922A CN 1310303 C CN1310303 C CN 1310303C
Authority
CN
China
Prior art keywords
electrostatic chuck
jut
wafer
adsorbed
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004100969223A
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English (en)
Chinese (zh)
Other versions
CN1624892A (zh
Inventor
西本伸也
中山博之
木村英利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN1624892A publication Critical patent/CN1624892A/zh
Application granted granted Critical
Publication of CN1310303C publication Critical patent/CN1310303C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CNB2004100969223A 2003-12-05 2004-12-06 静电吸盘 Expired - Fee Related CN1310303C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003408224 2003-12-05
JP2003408224 2003-12-05

Publications (2)

Publication Number Publication Date
CN1624892A CN1624892A (zh) 2005-06-08
CN1310303C true CN1310303C (zh) 2007-04-11

Family

ID=34779858

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100969223A Expired - Fee Related CN1310303C (zh) 2003-12-05 2004-12-06 静电吸盘

Country Status (5)

Country Link
US (1) US7663860B2 (enExample)
JP (2) JP2010147502A (enExample)
KR (1) KR100666039B1 (enExample)
CN (1) CN1310303C (enExample)
TW (1) TW200524075A (enExample)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7663860B2 (en) 2003-12-05 2010-02-16 Tokyo Electron Limited Electrostatic chuck
US20060238954A1 (en) * 2005-04-21 2006-10-26 Applied Materials, Inc., A Delaware Corporation Electrostatic chuck for track thermal plates
JP4657824B2 (ja) * 2005-06-17 2011-03-23 東京エレクトロン株式会社 基板載置台、基板処理装置および基板載置台の製造方法
US7248457B2 (en) * 2005-11-15 2007-07-24 Toto Ltd. Electrostatic chuck
CN1994839B (zh) * 2006-01-05 2012-07-18 财团法人工业技术研究院 静电吸附装置
JP5069452B2 (ja) * 2006-04-27 2012-11-07 アプライド マテリアルズ インコーポレイテッド 二重温度帯を有する静電チャックをもつ基板支持体
US8226769B2 (en) 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
JP5032818B2 (ja) * 2006-09-29 2012-09-26 新光電気工業株式会社 静電チャック
WO2008075340A1 (en) * 2006-12-18 2008-06-26 Camtek Ltd. A chuck and a method for supporting an object
CN101221893B (zh) * 2007-01-12 2010-05-19 北京北方微电子基地设备工艺研究中心有限责任公司 一种促进半导体晶片上静电电荷消散的方法
JP4864757B2 (ja) * 2007-02-14 2012-02-01 東京エレクトロン株式会社 基板載置台及びその表面処理方法
US20080225261A1 (en) * 2007-03-13 2008-09-18 Noriyuki Hirayanagi Exposure apparatus and device manufacturing method
KR100855002B1 (ko) * 2007-05-23 2008-08-28 삼성전자주식회사 플라즈마 이온 주입시스템
KR100938874B1 (ko) * 2007-07-24 2010-01-27 주식회사 에스에프에이 유리기판 지지용 서셉터 및 그 제조 방법, 그리고 그유리기판 지지용 서셉터를 구비한 화학 기상 증착장치
US7944677B2 (en) * 2007-09-11 2011-05-17 Canon Anelva Corporation Electrostatic chuck
KR101007534B1 (ko) * 2008-11-05 2011-01-14 주식회사 테스 반도체 제조장치 및 이를 이용한 실리콘 산화막 건식 식각 방법
US20100116788A1 (en) * 2008-11-12 2010-05-13 Lam Research Corporation Substrate temperature control by using liquid controlled multizone substrate support
CN102859645B (zh) 2010-02-24 2016-05-04 威科仪器有限公司 带温度分布控制的加工方法和装置
JP5454803B2 (ja) * 2010-08-11 2014-03-26 Ｔｏｔｏ株式会社 静電チャック
JP5510411B2 (ja) * 2010-08-11 2014-06-04 Ｔｏｔｏ株式会社 静電チャック及び静電チャックの製造方法
JP5993568B2 (ja) * 2011-11-09 2016-09-14 東京エレクトロン株式会社 基板載置システム、基板処理装置、静電チャック及び基板冷却方法
JP6010433B2 (ja) * 2012-11-15 2016-10-19 東京エレクトロン株式会社 基板載置台および基板処理装置
US9395404B2 (en) * 2012-12-14 2016-07-19 Infineon Technologies Ag Method for testing semiconductor chips or semiconductor chip modules
KR102112368B1 (ko) * 2013-02-28 2020-05-18 도쿄엘렉트론가부시키가이샤 탑재대 및 플라즈마 처리 장치
JP6173936B2 (ja) * 2013-02-28 2017-08-02 東京エレクトロン株式会社 載置台及びプラズマ処理装置
US9273413B2 (en) 2013-03-14 2016-03-01 Veeco Instruments Inc. Wafer carrier with temperature distribution control
JP6119430B2 (ja) 2013-05-31 2017-04-26 住友大阪セメント株式会社 静電チャック装置
JP5538613B1 (ja) * 2013-11-13 2014-07-02 東京エレクトロン株式会社 接合装置及び接合システム
TWI663681B (zh) * 2014-02-07 2019-06-21 美商恩特葛瑞斯股份有限公司 靜電夾具以及製造其之方法
KR20150138959A (ko) * 2014-05-30 2015-12-11 (주)아이씨디 챔버 내 피처리 대상물 접촉구조, 정전 척 및 그 제조방법
KR20160015510A (ko) * 2014-07-30 2016-02-15 삼성전자주식회사 정전척 어셈블리, 이를 구비하는 반도체 제조장치, 및 이를 이용한 플라즈마 처리방법
JP6168162B2 (ja) * 2014-09-30 2017-07-26 住友大阪セメント株式会社 静電チャック装置
JP6149945B2 (ja) * 2014-09-30 2017-06-21 住友大阪セメント株式会社 静電チャック装置
US20160230269A1 (en) * 2015-02-06 2016-08-11 Applied Materials, Inc. Radially outward pad design for electrostatic chuck surface
KR20180011119A (ko) * 2015-05-22 2018-01-31 어플라이드 머티어리얼스, 인코포레이티드 방위방향으로 튜닝가능한 다중-구역 정전 척
CN108780773B (zh) * 2016-02-10 2022-10-21 恩特格里斯公司 具有改善粒子性能的晶片接触表面突部轮廓
JP6183567B1 (ja) * 2016-05-13 2017-08-23 Toto株式会社 静電チャック
JP6215426B1 (ja) * 2016-09-21 2017-10-18 オリジン電気株式会社 加熱装置及び板状部材の製造方法
US20180148835A1 (en) 2016-11-29 2018-05-31 Lam Research Corporation Substrate support with varying depths of areas between mesas and corresponding temperature dependent method of fabricating
US11114327B2 (en) * 2017-08-29 2021-09-07 Applied Materials, Inc. ESC substrate support with chucking force control
KR102411272B1 (ko) * 2018-03-26 2022-06-22 엔지케이 인슐레이터 엘티디 정전척 히터
US11133212B2 (en) * 2018-05-16 2021-09-28 Applied Materials, Inc. High temperature electrostatic chuck
JP7248608B2 (ja) 2020-02-04 2023-03-29 日本碍子株式会社 静電チャックヒータ
US11929278B2 (en) 2021-05-19 2024-03-12 Applied Materials, Inc. Low impedance current path for edge non-uniformity tuning
CN114678316A (zh) * 2021-12-10 2022-06-28 北京华卓精科科技股份有限公司 控制颗粒污染的晶圆吸附构件及装置
US12412769B2 (en) * 2023-05-16 2025-09-09 Applied Materials, Inc. Electrostatic chucks with hybrid pucks to improve thermal performance and leakage current stability

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5745332A (en) * 1996-05-08 1998-04-28 Applied Materials, Inc. Monopolar electrostatic chuck having an electrode in contact with a workpiece
CN1365518A (zh) * 1999-05-25 2002-08-21 东陶机器株式会社 静电吸盘和处理装置
US6636413B2 (en) * 2000-12-11 2003-10-21 Ngk Insulators, Inc. Electrostatic chucks and process for producing the same

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH056933A (ja) 1991-06-27 1993-01-14 Kyocera Corp セラミツク製静電チヤツク
JPH0718438A (ja) * 1993-06-17 1995-01-20 Anelva Corp 静電チャック装置
JPH07153825A (ja) * 1993-11-29 1995-06-16 Toto Ltd 静電チャック及びこの静電チャックを用いた被吸着体の処理方法
JPH09172055A (ja) 1995-12-19 1997-06-30 Fujitsu Ltd 静電チャック及びウエハの吸着方法
JPH09213777A (ja) * 1996-01-31 1997-08-15 Kyocera Corp 静電チャック
US5810933A (en) 1996-02-16 1998-09-22 Novellus Systems, Inc. Wafer cooling device
JP3348140B2 (ja) 1996-04-08 2002-11-20 住友大阪セメント株式会社 静電チャック
US5761023A (en) * 1996-04-25 1998-06-02 Applied Materials, Inc. Substrate support with pressure zones having reduced contact area and temperature feedback
JP3604888B2 (ja) * 1997-01-30 2004-12-22 日本碍子株式会社 窒化アルミニウム質セラミックス基材の接合体、窒化アルミニウム質セラミックス基材の接合体の製造方法及び接合剤
US6117246A (en) 1997-01-31 2000-09-12 Applied Materials, Inc. Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck
JPH10284360A (ja) 1997-04-02 1998-10-23 Hitachi Ltd 基板温度制御装置及び方法
US6077357A (en) * 1997-05-29 2000-06-20 Applied Materials, Inc. Orientless wafer processing on an electrostatic chuck
US5903428A (en) 1997-09-25 1999-05-11 Applied Materials, Inc. Hybrid Johnsen-Rahbek electrostatic chuck having highly resistive mesas separating the chuck from a wafer supported thereupon and method of fabricating same
JP2000277594A (ja) 1999-03-25 2000-10-06 Ibiden Co Ltd 静電チャックの製造方法
US6320736B1 (en) * 1999-05-17 2001-11-20 Applied Materials, Inc. Chuck having pressurized zones of heat transfer gas
JP2000340640A (ja) 1999-05-31 2000-12-08 Toto Ltd 非接触型静電吸着装置
KR20010018837A (ko) * 1999-08-23 2001-03-15 김영환 반도체 식각장비의 정전척
JP2001308075A (ja) 2000-04-26 2001-11-02 Toshiba Ceramics Co Ltd ウェーハ支持体
JP3859937B2 (ja) * 2000-06-02 2006-12-20 住友大阪セメント株式会社 静電チャック
JP4387563B2 (ja) * 2000-06-05 2009-12-16 住友大阪セメント株式会社 サセプタ及びサセプタの製造方法
JP4697833B2 (ja) 2000-06-14 2011-06-08 キヤノンアネルバ株式会社 静電吸着機構及び表面処理装置
JP2002009139A (ja) * 2000-06-20 2002-01-11 Nikon Corp 静電チャック
JP2002009064A (ja) * 2000-06-21 2002-01-11 Hitachi Ltd 試料の処理装置及び試料の処理方法
JPWO2002043441A1 (ja) * 2000-11-24 2004-04-02 イビデン株式会社 セラミックヒータ、および、セラミックヒータの製造方法
EP1341216A1 (en) * 2000-12-05 2003-09-03 Ibiden Co., Ltd. Ceramic substrate for semiconductor manufacturing and inspecting devices, and method of manufacturing the ceramic substrate
JP4312394B2 (ja) 2001-01-29 2009-08-12 日本碍子株式会社 静電チャックおよび基板処理装置
JP3626933B2 (ja) 2001-02-08 2005-03-09 東京エレクトロン株式会社 基板載置台の製造方法
JP2002270681A (ja) 2001-03-07 2002-09-20 Anelva Corp 基板処理用静電吸着機構
US6628503B2 (en) 2001-03-13 2003-09-30 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications
JP4094262B2 (ja) 2001-09-13 2008-06-04 住友大阪セメント株式会社 吸着固定装置及びその製造方法
JP4008230B2 (ja) 2001-11-14 2007-11-14 住友大阪セメント株式会社 静電チャックの製造方法
KR100511854B1 (ko) * 2002-06-18 2005-09-02 아네르바 가부시키가이샤 정전 흡착 장치
US20040055709A1 (en) * 2002-09-19 2004-03-25 Applied Materials, Inc. Electrostatic chuck having a low level of particle generation and method of fabricating same
US6946403B2 (en) * 2003-10-28 2005-09-20 Axcelis Technologies, Inc. Method of making a MEMS electrostatic chuck
US7663860B2 (en) 2003-12-05 2010-02-16 Tokyo Electron Limited Electrostatic chuck
JP4674792B2 (ja) 2003-12-05 2011-04-20 東京エレクトロン株式会社 静電チャック

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5745332A (en) * 1996-05-08 1998-04-28 Applied Materials, Inc. Monopolar electrostatic chuck having an electrode in contact with a workpiece
CN1365518A (zh) * 1999-05-25 2002-08-21 东陶机器株式会社 静电吸盘和处理装置
US6636413B2 (en) * 2000-12-11 2003-10-21 Ngk Insulators, Inc. Electrostatic chucks and process for producing the same

Also Published As

Publication number Publication date
KR100666039B1 (ko) 2007-01-10
US20050207088A1 (en) 2005-09-22
US7663860B2 (en) 2010-02-16
JP2010147502A (ja) 2010-07-01
JP4909424B2 (ja) 2012-04-04
JP2010135851A (ja) 2010-06-17
KR20050054831A (ko) 2005-06-10
TWI358785B (enExample) 2012-02-21
CN1624892A (zh) 2005-06-08
TW200524075A (en) 2005-07-16

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