JP4901350B2 - 熱電変換装置及びその製造方法 - Google Patents

熱電変換装置及びその製造方法 Download PDF

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Publication number
JP4901350B2
JP4901350B2 JP2006198936A JP2006198936A JP4901350B2 JP 4901350 B2 JP4901350 B2 JP 4901350B2 JP 2006198936 A JP2006198936 A JP 2006198936A JP 2006198936 A JP2006198936 A JP 2006198936A JP 4901350 B2 JP4901350 B2 JP 4901350B2
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Japan
Prior art keywords
thermoelectric conversion
metal
substrate
conversion element
lid
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Expired - Fee Related
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JP2006198936A
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English (en)
Japanese (ja)
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JP2007110082A (ja
JP2007110082A5 (enExample
Inventor
敬寛 十河
和樹 舘山
博吉 花田
康人 斎藤
雅之 荒川
成仁 近藤
治 常岡
直和 岩撫
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Toshiba Corp
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Toshiba Corp
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Priority to JP2006198936A priority Critical patent/JP4901350B2/ja
Priority to US11/494,529 priority patent/US20070028955A1/en
Publication of JP2007110082A publication Critical patent/JP2007110082A/ja
Publication of JP2007110082A5 publication Critical patent/JP2007110082A5/ja
Priority to US12/652,063 priority patent/US20100101619A1/en
Application granted granted Critical
Publication of JP4901350B2 publication Critical patent/JP4901350B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/82—Interconnections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10219—Thermoelectric component

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2006198936A 2005-08-02 2006-07-21 熱電変換装置及びその製造方法 Expired - Fee Related JP4901350B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006198936A JP4901350B2 (ja) 2005-08-02 2006-07-21 熱電変換装置及びその製造方法
US11/494,529 US20070028955A1 (en) 2005-08-02 2006-07-28 Thermoelectric device and method of manufacturing the same
US12/652,063 US20100101619A1 (en) 2005-08-02 2010-01-05 Thermoelectric device and method of manufacturing the same

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2005224491 2005-08-02
JP2005224491 2005-08-02
JP2005234133 2005-08-12
JP2005234133 2005-08-12
JP2005239819 2005-08-22
JP2005239819 2005-08-22
JP2005268516 2005-09-15
JP2005268516 2005-09-15
JP2006198936A JP4901350B2 (ja) 2005-08-02 2006-07-21 熱電変換装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2007110082A JP2007110082A (ja) 2007-04-26
JP2007110082A5 JP2007110082A5 (enExample) 2009-09-03
JP4901350B2 true JP4901350B2 (ja) 2012-03-21

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JP2006198936A Expired - Fee Related JP4901350B2 (ja) 2005-08-02 2006-07-21 熱電変換装置及びその製造方法

Country Status (2)

Country Link
US (2) US20070028955A1 (enExample)
JP (1) JP4901350B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202014009040U1 (de) 2014-01-09 2015-02-12 Showa Denko K.K. Vorrichtung zur thermoelektrischen Umwandlung

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4946615B2 (ja) * 2007-05-10 2012-06-06 アイシン精機株式会社 光送信装置
JP5134395B2 (ja) * 2008-02-26 2013-01-30 アイシン精機株式会社 熱電モジュール、熱電モジュールを用いた熱電装置及び熱電モジュールの製造方法
US7911792B2 (en) * 2008-03-11 2011-03-22 Ford Global Technologies Llc Direct dipping cooled power module and packaging
JP2010109132A (ja) * 2008-10-30 2010-05-13 Yamaha Corp 熱電モジュールを備えたパッケージおよびその製造方法
US20100229911A1 (en) * 2008-12-19 2010-09-16 Hi-Z Technology Inc. High temperature, high efficiency thermoelectric module
TWI405361B (zh) * 2008-12-31 2013-08-11 財團法人工業技術研究院 熱電元件及其製程、晶片堆疊結構及晶片封裝結構
SG174559A1 (en) * 2009-04-02 2011-10-28 Basf Se Thermoelectric module with insulated substrate
US20110030754A1 (en) * 2009-08-06 2011-02-10 Laird Technologies, Inc. Thermoelectric modules and related methods
US9356218B1 (en) * 2009-11-13 2016-05-31 The Boeing Company Internally heated concentrated solar power (CSP) thermal absorber
JP5742174B2 (ja) 2009-12-09 2015-07-01 ソニー株式会社 熱電発電装置、熱電発電方法及び電気信号検出方法
JP5642419B2 (ja) * 2010-05-07 2014-12-17 一般財団法人電力中央研究所 気密ケース入り熱電変換モジュール
TWI443882B (zh) * 2010-11-15 2014-07-01 Ind Tech Res Inst 熱電轉換組件及其製造方法
JP5618791B2 (ja) * 2010-11-30 2014-11-05 古河機械金属株式会社 熱電変換モジュール
JP2012243879A (ja) * 2011-05-17 2012-12-10 Toyota Industries Corp 熱電変換モジュール
JP5956155B2 (ja) * 2012-01-05 2016-07-27 フタバ産業株式会社 熱電発電装置
DE102012206085B4 (de) * 2012-04-13 2013-11-21 Eberspächer Exhaust Technology GmbH & Co. KG Wärmetauscher
US20130291555A1 (en) 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
EP2848101B1 (en) * 2012-05-07 2019-04-10 Phononic Devices, Inc. Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance
JP5751261B2 (ja) 2013-01-17 2015-07-22 ヤマハ株式会社 熱電発電ユニット
CN105378955B (zh) * 2013-03-06 2018-09-11 马勒国际有限公司 载体元件和模块
JP6171513B2 (ja) * 2013-04-10 2017-08-02 日立化成株式会社 熱電変換モジュールおよびその製造方法
CN104508846B (zh) * 2013-06-11 2016-02-10 松下知识产权经营株式会社 热电转换模块
US10458683B2 (en) 2014-07-21 2019-10-29 Phononic, Inc. Systems and methods for mitigating heat rejection limitations of a thermoelectric module
US9593871B2 (en) 2014-07-21 2017-03-14 Phononic Devices, Inc. Systems and methods for operating a thermoelectric module to increase efficiency
DE102014216974A1 (de) * 2014-08-26 2016-03-03 Mahle International Gmbh Thermoelektrisches Modul
TWM504269U (zh) * 2014-11-19 2015-07-01 技嘉科技股份有限公司 板件固定結構
US20160247996A1 (en) * 2015-02-19 2016-08-25 Novus Energy Technologies, Inc. Large footprint, high power density thermoelectric modules for high temperature applications
JP6193283B2 (ja) * 2015-03-06 2017-09-06 Ｊｆｅスチール株式会社 熱電発電モジュールおよび熱電発電装置
KR20160129637A (ko) * 2015-04-30 2016-11-09 엘지이노텍 주식회사 열전모듈 및 이를 포함하는 열전환장치
TWI563909B (en) * 2016-01-29 2016-12-21 Delta Electronics Inc Thermo electric heat dissipation module
CN108886084A (zh) * 2016-03-31 2018-11-23 株式会社村田制作所 热电转换模块以及热电转换模块的制造方法
WO2017179735A1 (ja) * 2016-04-15 2017-10-19 ヤマハ株式会社 熱電変換モジュールパッケージ
JP6447577B2 (ja) * 2016-05-27 2019-01-09 株式会社デンソー 熱電変換装置およびその製造方法
KR101827120B1 (ko) * 2016-05-30 2018-02-07 현대자동차주식회사 열전모듈용 하우징
KR101846685B1 (ko) 2016-07-11 2018-05-18 현대자동차주식회사 열전모듈 패키징방법
JP2018049886A (ja) * 2016-09-20 2018-03-29 昭和電工株式会社 熱電変換装置
KR102652928B1 (ko) * 2017-02-06 2024-03-29 엘지이노텍 주식회사 열전 소자
US11659767B2 (en) 2017-02-15 2023-05-23 Ngk Spark Plug Co., Ltd. Package with built-in thermoelectric element
TWI630735B (zh) * 2017-11-16 2018-07-21 財團法人工業技術研究院 熱電裝置
WO2019112200A1 (ko) * 2017-12-07 2019-06-13 엘지이노텍 주식회사 열전 모듈
KR102072577B1 (ko) 2017-12-07 2020-02-03 엘지이노텍 주식회사 열전 모듈
DE102018104716B3 (de) * 2018-03-01 2019-03-28 Isabellenhütte Heusler Gmbh & Co. Kg Thermoelektrisches Modul zur Stromerzeugung und zugehöriges Herstellungsverfahren
KR102434260B1 (ko) * 2018-06-26 2022-08-19 엘지이노텍 주식회사 열전소자
WO2020071036A1 (ja) * 2018-10-04 2020-04-09 パナソニックＩｐマネジメント株式会社 熱電変換モジュールおよびそれを用いた冷却装置または温度測定装置または熱流センサまたは発電装置
JP2021036563A (ja) * 2019-08-30 2021-03-04 株式会社安永 熱電変換装置
CN114080695A (zh) * 2019-09-19 2022-02-22 雅马哈株式会社 热电转换模块
WO2021112566A1 (ko) * 2019-12-06 2021-06-10 엘티메탈 주식회사 열전 소자 및 그 제조방법
JP7552023B2 (ja) * 2020-02-07 2024-09-18 三菱マテリアル株式会社 熱電変換構造体
JP7524556B2 (ja) * 2020-03-05 2024-07-30 株式会社プロテリアル 熱電変換装置
WO2022244773A1 (ja) * 2021-05-19 2022-11-24 ダイキン工業株式会社 熱電素子モジュール、及び熱電装置
JP7531647B1 (ja) 2023-03-24 2024-08-09 三菱電機エンジニアリング株式会社 熱電変換装置、熱電変換装置の製造方法、および、電子冷却装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4118988Y1 (enExample) * 1966-02-03 1966-09-05
JP3951315B2 (ja) * 1995-05-26 2007-08-01 松下電工株式会社 ペルチェモジュール
JP2003222426A (ja) * 2002-01-31 2003-08-08 Komatsu Ltd 熱交換器
JP4488778B2 (ja) * 2003-07-25 2010-06-23 株式会社東芝 熱電変換装置
JP2005133876A (ja) * 2003-10-31 2005-05-26 Ntn Corp 電食防止型転がり軸受
US20060005873A1 (en) * 2004-07-06 2006-01-12 Mitsuru Kambe Thermoelectric conversion module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202014009040U1 (de) 2014-01-09 2015-02-12 Showa Denko K.K. Vorrichtung zur thermoelektrischen Umwandlung

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JP2007110082A (ja) 2007-04-26
US20070028955A1 (en) 2007-02-08
US20100101619A1 (en) 2010-04-29

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