JP4888473B2 - 実装基板 - Google Patents
実装基板 Download PDFInfo
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- JP4888473B2 JP4888473B2 JP2008296512A JP2008296512A JP4888473B2 JP 4888473 B2 JP4888473 B2 JP 4888473B2 JP 2008296512 A JP2008296512 A JP 2008296512A JP 2008296512 A JP2008296512 A JP 2008296512A JP 4888473 B2 JP4888473 B2 JP 4888473B2
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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Description
1.第1実施形態(発光素子からなるチップを搭載した実装基板を有する表示装置を作製する例)
2.第2実施形態(発光素子からなるチップを搭載したパッケージ素子を有する表示装置を作製する例)
先ず、図1Aの断面図および図1Bの平面図に示すように、表示装置用の基板1上に必要に応じたレイアウトで配線3をパターン形成する。尚、以下の実施形態において、各図におけるAの断面図は、Bの平面図におけるA−A’断面に相当する。
本第2実施形態は、複数の発光素子をパッケージ化したパッケージ素子を基板上に搭載させた表示装置を作製する例であり、発光素子の実装固定に関する主要部分は第1実施形態と同様である。以下、図7〜図9を参照しつつ、第1実施形態と同一の構成要素には同一の符号を付し、重複する説明は省略する。
以上説明した本発明に係る表示装置は、図9〜図13に示す様々な電子機器、例えば、デジタルカメラ、ノート型パーソナルコンピュータ、携帯電話等の携帯端末装置、ビデオカメラなど、電子機器に入力された映像信号、若しくは、電子機器内で生成した映像信号を、画像若しくは映像として表示する電子機器の表示装置に適用することが可能である。以下に、本発明が適用される電子機器の一例について説明する。
Claims (7)
- 基板上に設けられた配線と、
前記配線に対向して複数の開口部を有すると共に、前記開口部の開口形状が中央部から放射状に突起部を有してなる絶縁膜と、
前記絶縁膜の前記複数の開口部のそれぞれに設けられ、前記開口部の開口形状と略同一の平面形状を有する半田パターンと、
前記半田パターンの前記中央部に対応する領域に固定されると共に、2つの電極間に発光層を有し、かつ前記中央部と略同一の底面形状を有するチップとを備え、
前記絶縁膜の開口部の開口形状において、
前記中央部は円形状を有し、
前記突起部は、前記中央部から対称となる少なくとも3方向に沿って互いに等角度を保って配置されると共に、その先端が前記中央部を中心とした円周上に配置され、かつ前記先端に向かって細くなる形状を有し、
前記チップの前記2つの電極のうちの一方の電極が前記半田パターンに接続され、
前記半田パターンが前記絶縁膜の開口部において前記配線と接続されている
実装基板。 - 前記絶縁膜の複数の開口部のそれぞれに半田濡れ層を有し、
前記半田濡れ層上に前記半田パターンが設けられている
請求項1に記載の実装基板。 - 前記半田濡れ層は、ニッケル(Ni)を用いて構成されている
請求項2に記載の実装基板。 - 前記半田濡れ層は、ニッケルおよび金を積層したものである
請求項3に記載の実装基板。 - 前記半田パターン上に半田フラックスを有し、
前記半田フラックス上に前記チップが設けられている
請求項2に記載の実装基板。 - 前記絶縁膜は、前記複数の開口部の他に、前記配線層に対向して複数の接続孔を有し、
前記複数の接続孔に半田バンプが設けられている
請求項1ないし請求項5のいずれか1項に記載の実装基板。 - 前記チップは、前記半田パターンに接続された一方の電極側から他方の電極側に向かって前記基板面に平行な面形状の径が小さくなっている
請求項1ないし請求項5のいずれか1項に記載の実装基板。
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