JP4863093B2 - ケイ化ニッケルおよびケイ化コバルトをエッチングする方法ならびに導電線を形成する方法 - Google Patents
ケイ化ニッケルおよびケイ化コバルトをエッチングする方法ならびに導電線を形成する方法 Download PDFInfo
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- JP4863093B2 JP4863093B2 JP2008515729A JP2008515729A JP4863093B2 JP 4863093 B2 JP4863093 B2 JP 4863093B2 JP 2008515729 A JP2008515729 A JP 2008515729A JP 2008515729 A JP2008515729 A JP 2008515729A JP 4863093 B2 JP4863093 B2 JP 4863093B2
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- 229910021334 nickel silicide Inorganic materials 0.000 title claims abstract description 56
- RUFLMLWJRZAWLJ-UHFFFAOYSA-N nickel silicide Chemical compound [Ni]=[Si]=[Ni] RUFLMLWJRZAWLJ-UHFFFAOYSA-N 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 53
- 238000005530 etching Methods 0.000 title claims abstract description 42
- 229910017052 cobalt Inorganic materials 0.000 title claims abstract description 39
- 239000010941 cobalt Substances 0.000 title claims abstract description 39
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 title claims abstract description 39
- 229910021332 silicide Inorganic materials 0.000 title claims abstract description 38
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 239000012530 fluid Substances 0.000 claims abstract description 38
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 81
- 239000000377 silicon dioxide Substances 0.000 claims description 40
- 235000012239 silicon dioxide Nutrition 0.000 claims description 39
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 31
- 229910052710 silicon Inorganic materials 0.000 claims description 31
- 239000010703 silicon Substances 0.000 claims description 31
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 28
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 23
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 23
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 11
- 238000000137 annealing Methods 0.000 claims description 4
- 230000005669 field effect Effects 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 description 31
- 239000004065 semiconductor Substances 0.000 description 15
- 239000012634 fragment Substances 0.000 description 13
- 239000000203 mixture Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 229910005883 NiSi Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910019001 CoSi Inorganic materials 0.000 description 1
- 229910005881 NiSi 2 Inorganic materials 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- KMTYGNUPYSXKGJ-UHFFFAOYSA-N [Si+4].[Si+4].[Ni++] Chemical compound [Si+4].[Si+4].[Ni++] KMTYGNUPYSXKGJ-UHFFFAOYSA-N 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66613—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation
- H01L29/66621—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation using etching to form a recess at the gate location
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
- H01L29/7834—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with a non-planar structure, e.g. the gate or the source or the drain being non-planar
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- Ceramic Engineering (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- ing And Chemical Polishing (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
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Description
Claims (23)
- ケイ化ニッケルまたはケイ化コバルトのうちの少なくとも一方をエッチングする方法であって、
ケイ化ニッケルまたはケイ化コバルトのうちの少なくとも一方を含む基板を、H2SO4、H2O2、H2O、およびHFを含む流体に、少なくとも50℃の温度および350トル〜1100トルの圧力で曝露して、前記基板からケイ化ニッケルまたはケイ化コバルトのうちの前記少なくとも一方をエッチングすることを含む方法。 - 前記エッチングが、ケイ化ニッケルのエッチングである、請求項1に記載の方法。
- 前記エッチングが、ケイ化コバルトのエッチングである、請求項1に記載の方法。
- 前記流体が主に液体を含む、請求項1に記載の方法。
- 前記温度が少なくとも100℃である、請求項1に記載の方法。
- 前記流体が実質的にH2SO4、H2O2、H2O、およびHFからなる、請求項1に記載の方法。
- 前記HFが、H2SO4、H2O2、およびH2Oの合計に対して0.0005:1〜0.1:1の体積比で前記流体中に存在する、請求項1に記載の方法。
- 前記体積比が0.001:1〜0.002:1である、請求項7に記載の方法。
- 前記H2SO4が、H2O2に対して20:1〜40:1の体積比で前記流体中に存在する、請求項1に記載の方法。
- 前記H2Oが、H2SO4およびH2O2の合計に対して0.03:1〜1:1の体積比で流体中に存在する、請求項1に記載の方法。
- 前記体積比が0.05:1〜0.07:1である、請求項10に記載の方法。
- 前記HFが、H2SO4、H2O2、およびH2Oの合計に対して0.0005:1〜0.1:1の体積比で流体中に存在し、
前記H2SO4が、H2O2に対して20:1〜40:1の体積比で前記流体中に存在する、請求項1に記載の方法。 - 前記HFが、H2SO4、H2O2、およびH2Oの合計に対して0.0005:1〜0.1:1の体積比で前記流体中に存在し、
前記H2SO4が、H2O2に対して20:1〜40:1の体積比で前記流体中に存在し、
前記H2Oが、H2SO4およびH2O2の合計に対して0.03:1〜1:1の体積比で流体中に存在する、請求項1に記載の方法。 - 前記基板が、前記エッチング処理の少なくとも一部の期間中に、露出されたアンドープの二酸化ケイ素、露出された元素ケイ素、または露出された窒化ケイ素のうちの少なくとも1種類を含み、且つ前記エッチング処理が、前記露出されたアンドープの二酸化ケイ素、前記露出された元素ケイ素、または前記露出された窒化ケイ素のうちの前記少なくとも1種類に対して選択的である、請求項1に記載の方法。
- 前記露出されたアンドープの二酸化ケイ素、前記露出された元素ケイ素、または前記露出された窒化ケイ素のうちの前記少なくとも1種類に対する選択性が、少なくとも10:1である、請求項14に記載の方法。
- 前記露出されたアンドープの二酸化ケイ素、前記露出された元素ケイ素、または前記露出された窒化ケイ素のうちの前記少なくとも1種類に対する選択性が少なくとも100:1である、請求項15に記載の方法。
- 前記基板が、前記エッチング処理の少なくとも一部の期間中に、露出されたアンドープの二酸化ケイ素を含む、請求項14に記載の方法。
- 前記基板が、前記エッチング処理の少なくとも一部の期間中に、露出された元素ケイ素を含む、請求項14に記載の方法。
- 前記基板が、前記エッチング処理の少なくとも一部の期間中に、露出された窒化ケイ素を含む、請求項14に記載の方法。
- ケイ化ニッケルまたはケイ化コバルトのうちの少なくとも一方をエッチングする方法であって、
ケイ化ニッケルまたはケイ化コバルトのうちの少なくとも一方を含む基板を、H2SO4、H2O2、H2O、およびHFを含む液体に、少なくとも50℃の温度および600トル〜900トルの圧力で曝露して、前記基板からケイ化ニッケルまたはケイ化コバルトのうちの前記少なくとも一方をエッチングすることを含み、前記HFはH2SO4、H2O2、およびH2Oの合計に対して0.0005:1〜0.1:1の体積比で前記液体中に存在し、且つ前記H2SO4は、H2O2に対して20:1〜40:1の体積比で前記液体中に存在し、且つ前記H2Oは、H2SO4およびH2O2の合計に対して0.03:1〜1:1の体積比で前記液体中に存在し、また、
前記基板は、前記エッチング処理の少なくとも一部の期間中に、露出されたアンドープの二酸化ケイ素、露出された元素ケイ素、または露出された窒化ケイ素のうちの少なくとも1種類を含み、且つ前記エッチング処理が、前記露出されたアンドープの二酸化ケイ素、前記露出された元素ケイ素、または前記露出された窒化ケイ素のうちの前記少なくとも1種類に対して選択的であることを特徴とする方法。 - ケイ化ニッケルまたはケイ化コバルトのうちの少なくとも一方を含む導電線を形成する方法であって、
互いに反対側を向いた面上で横方向に支持された、窒化ケイ素またはアンドープの二酸化ケイ素のうちの少なくとも一方を有する、シリコンを含む線を形成することと、
元素ニッケルまたは元素コバルトのうちの少なくとも一方を、前記シリコンを含む線の上、および前記窒化ケイ素または前記アンドープの二酸化ケイ素のうちの前記少なくとも一方の上に堆積させることと、
前記元素ニッケルまたは前記元素コバルトのうちの前記少なくとも一方ならびに該線中のケイ素をアニールして、ケイ化ニッケルを含む線またはケイ化コバルトを含む線のうちの少なくとも一方を形成することと、
前記ケイ化ニッケルを含む線または前記ケイ化コバルトを含む線のうちの前記少なくとも一方を、H2SO4、H2O2、H2O、およびHFを含む流体で、少なくとも50℃の温度および350トル〜1100トルの圧力にて、前記窒化ケイ素または前記アンドープの二酸化ケイ素のうちの前記少なくとも一方に対して選択的にエッチングすることで、前記窒化ケイ素または前記アンドープの二酸化ケイ素のうちの前記少なくとも一方に対して、前記ケイ化ニッケルを含む線または前記ケイ化コバルトを含む線のうちの前記少なくとも一方にくぼみを形成することと、
を含む方法。 - 前記ケイ化ニッケルを含む線または前記ケイ化コバルトを含む線のうちの前記少なくとも一方はトランジタゲート線を含み、かつ、前記窒化ケイ素または前記アンドープの二酸化ケイ素のうちの前記少なくとも一方は、前記トランジスタゲート線を含む電界効果トランジスタのゲート絶縁体を含む、請求項21に記載の方法。
- 前記エッチングの後に、前記トランジスタゲート線上に電気絶縁性キャップを形成することと、
前記電気絶縁性キャップの横方向近傍に前記電界効果トランジスタのソース/ドレイン領域を形成することと、
を含む、請求項22に記載の方法。
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US11/146,648 US7371333B2 (en) | 2005-06-07 | 2005-06-07 | Methods of etching nickel silicide and cobalt silicide and methods of forming conductive lines |
US11/146,648 | 2005-06-07 | ||
PCT/US2006/019693 WO2006132789A2 (en) | 2005-06-07 | 2006-05-19 | Methods of etching nickel silicide and cobalt silicide and methods of forming conductive lines |
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EP (2) | EP2276062B1 (ja) |
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KR (1) | KR100966002B1 (ja) |
CN (1) | CN100536088C (ja) |
AT (2) | ATE550780T1 (ja) |
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US8283258B2 (en) | 2007-08-16 | 2012-10-09 | Micron Technology, Inc. | Selective wet etching of hafnium aluminum oxide films |
US20120315754A1 (en) * | 2011-06-08 | 2012-12-13 | Micron Technology, Inc. | Interconnection barrier material device and method |
TWI517235B (zh) * | 2013-03-01 | 2016-01-11 | 栗田工業股份有限公司 | 半導體基板洗淨系統以及半導體基板的洗淨方法 |
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JP2008543108A (ja) | 2008-11-27 |
EP2276062A1 (en) | 2011-01-19 |
US20060276048A1 (en) | 2006-12-07 |
EP2276062B1 (en) | 2012-03-21 |
TW200735270A (en) | 2007-09-16 |
EP1891665A2 (en) | 2008-02-27 |
TWI299202B (en) | 2008-07-21 |
WO2006132789A3 (en) | 2007-03-08 |
ATE550779T1 (de) | 2012-04-15 |
KR100966002B1 (ko) | 2010-06-24 |
CN101194347A (zh) | 2008-06-04 |
US7371333B2 (en) | 2008-05-13 |
CN100536088C (zh) | 2009-09-02 |
EP1891665B1 (en) | 2012-03-21 |
KR20080017450A (ko) | 2008-02-26 |
WO2006132789A2 (en) | 2006-12-14 |
ATE550780T1 (de) | 2012-04-15 |
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