JP4827294B2 - 成膜装置及び発光装置の作製方法 - Google Patents

成膜装置及び発光装置の作製方法 Download PDF

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Publication number
JP4827294B2
JP4827294B2 JP2000358857A JP2000358857A JP4827294B2 JP 4827294 B2 JP4827294 B2 JP 4827294B2 JP 2000358857 A JP2000358857 A JP 2000358857A JP 2000358857 A JP2000358857 A JP 2000358857A JP 4827294 B2 JP4827294 B2 JP 4827294B2
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Prior art keywords
chamber
liquid phase
phase film
substrate
film
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Expired - Fee Related
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JP2000358857A
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English (en)
Japanese (ja)
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JP2001223077A (ja
JP2001223077A5 (enExample
Inventor
舜平 山崎
利光 小沼
健司 福永
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2000358857A priority Critical patent/JP4827294B2/ja
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Publication of JP2001223077A5 publication Critical patent/JP2001223077A5/ja
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/12Deposition of organic active material using liquid deposition, e.g. spin coating
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/441Thermal treatment, e.g. annealing in the presence of a solvent vapour in the presence of solvent vapors, e.g. solvent vapour annealing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2000358857A 1999-11-29 2000-11-27 成膜装置及び発光装置の作製方法 Expired - Fee Related JP4827294B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000358857A JP4827294B2 (ja) 1999-11-29 2000-11-27 成膜装置及び発光装置の作製方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP11-337190 1999-11-29
JP1999337190 1999-11-29
JP33719099 1999-11-29
JP2000358857A JP4827294B2 (ja) 1999-11-29 2000-11-27 成膜装置及び発光装置の作製方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010250808A Division JP2011049182A (ja) 1999-11-29 2010-11-09 El表示装置

Publications (3)

Publication Number Publication Date
JP2001223077A JP2001223077A (ja) 2001-08-17
JP2001223077A5 JP2001223077A5 (enExample) 2008-01-17
JP4827294B2 true JP4827294B2 (ja) 2011-11-30

Family

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Family Applications (5)

Application Number Title Priority Date Filing Date
JP2000358857A Expired - Fee Related JP4827294B2 (ja) 1999-11-29 2000-11-27 成膜装置及び発光装置の作製方法
JP2010250808A Withdrawn JP2011049182A (ja) 1999-11-29 2010-11-09 El表示装置
JP2011251411A Withdrawn JP2012074389A (ja) 1999-11-29 2011-11-17 El表示装置
JP2012248558A Expired - Fee Related JP5463406B2 (ja) 1999-11-29 2012-11-12 発光装置の作製方法
JP2013247602A Expired - Lifetime JP5604581B2 (ja) 1999-11-29 2013-11-29 発光装置の作製方法

Family Applications After (4)

Application Number Title Priority Date Filing Date
JP2010250808A Withdrawn JP2011049182A (ja) 1999-11-29 2010-11-09 El表示装置
JP2011251411A Withdrawn JP2012074389A (ja) 1999-11-29 2011-11-17 El表示装置
JP2012248558A Expired - Fee Related JP5463406B2 (ja) 1999-11-29 2012-11-12 発光装置の作製方法
JP2013247602A Expired - Lifetime JP5604581B2 (ja) 1999-11-29 2013-11-29 発光装置の作製方法

Country Status (3)

Country Link
US (1) US20100255184A1 (enExample)
JP (5) JP4827294B2 (enExample)
KR (1) KR100664662B1 (enExample)

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Also Published As

Publication number Publication date
US20100255184A1 (en) 2010-10-07
JP2013033761A (ja) 2013-02-14
JP2001223077A (ja) 2001-08-17
KR100664662B1 (ko) 2007-01-04
KR20010061975A (ko) 2001-07-07
JP2012074389A (ja) 2012-04-12
JP5604581B2 (ja) 2014-10-08
JP2011049182A (ja) 2011-03-10
JP2014089963A (ja) 2014-05-15
JP5463406B2 (ja) 2014-04-09

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