KR100664662B1 - 성막 장치 및 그 장치를 이용한 발광장치 제작방법 - Google Patents

성막 장치 및 그 장치를 이용한 발광장치 제작방법 Download PDF

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Publication number
KR100664662B1
KR100664662B1 KR1020000071138A KR20000071138A KR100664662B1 KR 100664662 B1 KR100664662 B1 KR 100664662B1 KR 1020000071138 A KR1020000071138 A KR 1020000071138A KR 20000071138 A KR20000071138 A KR 20000071138A KR 100664662 B1 KR100664662 B1 KR 100664662B1
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South Korea
Prior art keywords
chamber
film forming
substrate
forming apparatus
gate
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Expired - Fee Related
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KR1020000071138A
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English (en)
Korean (ko)
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KR20010061975A (ko
Inventor
야마자키순페이
고누마도시미츠
후쿠나가다케시
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가부시키가이샤 한도오따이 에네루기 켄큐쇼
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Publication of KR20010061975A publication Critical patent/KR20010061975A/ko
Application granted granted Critical
Publication of KR100664662B1 publication Critical patent/KR100664662B1/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/441—Thermal treatment, e.g. annealing in the presence of a solvent vapour in the presence of solvent vapors, e.g. solvent vapour annealing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020000071138A 1999-11-29 2000-11-28 성막 장치 및 그 장치를 이용한 발광장치 제작방법 Expired - Fee Related KR100664662B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP33719099 1999-11-29
JP11-337190 1999-11-29

Publications (2)

Publication Number Publication Date
KR20010061975A KR20010061975A (ko) 2001-07-07
KR100664662B1 true KR100664662B1 (ko) 2007-01-04

Family

ID=37529376

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020000071138A Expired - Fee Related KR100664662B1 (ko) 1999-11-29 2000-11-28 성막 장치 및 그 장치를 이용한 발광장치 제작방법

Country Status (3)

Country Link
US (1) US20100255184A1 (enExample)
JP (5) JP4827294B2 (enExample)
KR (1) KR100664662B1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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JP6220171B2 (ja) * 2013-07-03 2017-10-25 株式会社ジャパンディスプレイ 有機エレクトロルミネッセンス表示装置
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Cited By (2)

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Publication number Priority date Publication date Assignee Title
KR20240008526A (ko) * 2022-07-12 2024-01-19 (주)세경하이테크 인덱스 몰딩 방법 및 그 장치
KR102866552B1 (ko) * 2022-07-12 2025-09-30 (주)세경하이테크 인덱스 몰딩 방법 및 그 장치

Also Published As

Publication number Publication date
JP2001223077A (ja) 2001-08-17
JP5604581B2 (ja) 2014-10-08
JP5463406B2 (ja) 2014-04-09
US20100255184A1 (en) 2010-10-07
KR20010061975A (ko) 2001-07-07
JP2014089963A (ja) 2014-05-15
JP2012074389A (ja) 2012-04-12
JP4827294B2 (ja) 2011-11-30
JP2011049182A (ja) 2011-03-10
JP2013033761A (ja) 2013-02-14

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