JP4818120B2 - 脆性材料基板のスクライブ方法ならびにスクライブ装置および脆性材料基板の分断システム。 - Google Patents

脆性材料基板のスクライブ方法ならびにスクライブ装置および脆性材料基板の分断システム。 Download PDF

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Publication number
JP4818120B2
JP4818120B2 JP2006540898A JP2006540898A JP4818120B2 JP 4818120 B2 JP4818120 B2 JP 4818120B2 JP 2006540898 A JP2006540898 A JP 2006540898A JP 2006540898 A JP2006540898 A JP 2006540898A JP 4818120 B2 JP4818120 B2 JP 4818120B2
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Prior art keywords
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brittle material
substrate
material substrate
scribe
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Japanese (ja)
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JPWO2006040988A1 (ja
Inventor
生芳 高松
健司 音田
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2006540898A 2004-10-13 2005-10-05 脆性材料基板のスクライブ方法ならびにスクライブ装置および脆性材料基板の分断システム。 Expired - Fee Related JP4818120B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006540898A JP4818120B2 (ja) 2004-10-13 2005-10-05 脆性材料基板のスクライブ方法ならびにスクライブ装置および脆性材料基板の分断システム。

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004299446 2004-10-13
JP2004299446 2004-10-13
JP2006540898A JP4818120B2 (ja) 2004-10-13 2005-10-05 脆性材料基板のスクライブ方法ならびにスクライブ装置および脆性材料基板の分断システム。
PCT/JP2005/018475 WO2006040988A1 (ja) 2004-10-13 2005-10-05 脆性材料基板のスクライブ方法ならびにスクライブ装置および脆性材料基板の分断システム

Publications (2)

Publication Number Publication Date
JPWO2006040988A1 JPWO2006040988A1 (ja) 2008-05-15
JP4818120B2 true JP4818120B2 (ja) 2011-11-16

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JP2006540898A Expired - Fee Related JP4818120B2 (ja) 2004-10-13 2005-10-05 脆性材料基板のスクライブ方法ならびにスクライブ装置および脆性材料基板の分断システム。

Country Status (7)

Country Link
US (1) US20090050610A1 (enExample)
EP (1) EP1800820B1 (enExample)
JP (1) JP4818120B2 (enExample)
KR (1) KR100893871B1 (enExample)
CN (1) CN101068666B (enExample)
TW (1) TW200624396A (enExample)
WO (1) WO2006040988A1 (enExample)

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JP2009126780A (ja) * 2007-11-21 2009-06-11 Semes Co Ltd スクライブ装置並びに方法、及びこれを利用した基板切断装置
TWI435850B (zh) * 2008-01-23 2014-05-01 Mitsuboshi Diamond Ind Co Ltd Scribing device and scribing method
KR100989125B1 (ko) * 2008-07-16 2010-10-20 삼성모바일디스플레이주식회사 원장기판 절단 장치 및 이에 의하여 절단된 유기발광표시장치
JP5167160B2 (ja) * 2009-01-30 2013-03-21 三星ダイヤモンド工業株式会社 脆性材料基板の搬送・分断装置
JP5249979B2 (ja) * 2010-03-18 2013-07-31 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法およびこれに用いるレーザ加工装置
JP5508133B2 (ja) * 2010-05-19 2014-05-28 株式会社ディスコ 板状物の分割装置
KR101356217B1 (ko) * 2011-12-20 2014-01-29 참엔지니어링(주) 기판 트리밍 장치 및 방법
KR101407976B1 (ko) * 2012-05-04 2014-07-03 코닝정밀소재 주식회사 실시간 파손 감지 기능을 구비한 유리기판용 레이저 절단 장치 및 이의 유리기판 파손 감지 방법
CN102674676A (zh) * 2012-05-17 2012-09-19 东莞宏威数码机械有限公司 基片切割装置
JP6043149B2 (ja) * 2012-10-29 2016-12-14 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置および脆性材料基板のブレイク方法
CN103056976B (zh) * 2012-12-27 2015-07-22 东莞市拓荒牛自动化设备有限公司 一种led导光板刻线方法及实施该方法的刻线机
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JP2015034111A (ja) * 2013-08-09 2015-02-19 三星ダイヤモンド工業株式会社 積層セラミックス基板の分断方法
EP3155556B1 (en) 2014-06-10 2019-12-18 Sicpa Holding SA Substrate with a fragmented marking thereon
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JP6610026B2 (ja) * 2015-06-23 2019-11-27 三星ダイヤモンド工業株式会社 スクライブ装置
CN106891094A (zh) * 2015-12-14 2017-06-27 上海申和热磁电子有限公司 用于覆铜陶瓷基板的激光切割机工作台
JP6699196B2 (ja) * 2016-01-22 2020-05-27 三星ダイヤモンド工業株式会社 ブレイク装置
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CN106696102A (zh) * 2016-12-05 2017-05-24 无锡明珠增压器制造有限公司 一种精确控制硅片切片装置
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JPH06144860A (ja) * 1992-11-11 1994-05-24 Fuji Xerox Co Ltd 脆性板用スクライブ装置
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JP2003286044A (ja) * 2002-03-27 2003-10-07 Sharp Corp 基板分断装置および基板分断方法
JP2004145337A (ja) * 2002-10-22 2004-05-20 Lg Philips Lcd Co Ltd 液晶表示パネルの切断装置
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Also Published As

Publication number Publication date
TW200624396A (en) 2006-07-16
US20090050610A1 (en) 2009-02-26
CN101068666B (zh) 2011-05-04
KR20070067200A (ko) 2007-06-27
EP1800820A4 (en) 2011-02-23
WO2006040988A1 (ja) 2006-04-20
CN101068666A (zh) 2007-11-07
TWI374862B (enExample) 2012-10-21
KR100893871B1 (ko) 2009-04-20
EP1800820A1 (en) 2007-06-27
EP1800820B1 (en) 2012-12-12
JPWO2006040988A1 (ja) 2008-05-15

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