KR100893871B1 - 취성재료 기판의 스크라이브 방법 및 스크라이브 장치및 취성재료 기판의 절단 시스템 - Google Patents

취성재료 기판의 스크라이브 방법 및 스크라이브 장치및 취성재료 기판의 절단 시스템 Download PDF

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Publication number
KR100893871B1
KR100893871B1 KR1020077010736A KR20077010736A KR100893871B1 KR 100893871 B1 KR100893871 B1 KR 100893871B1 KR 1020077010736 A KR1020077010736 A KR 1020077010736A KR 20077010736 A KR20077010736 A KR 20077010736A KR 100893871 B1 KR100893871 B1 KR 100893871B1
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South Korea
Prior art keywords
scribe
substrate
brittle material
glass substrate
line
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020077010736A
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English (en)
Korean (ko)
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KR20070067200A (ko
Inventor
기요시 다카마쓰
겐지 오토다
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Publication of KR20070067200A publication Critical patent/KR20070067200A/ko
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020077010736A 2004-10-13 2005-10-05 취성재료 기판의 스크라이브 방법 및 스크라이브 장치및 취성재료 기판의 절단 시스템 Expired - Fee Related KR100893871B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004299446 2004-10-13
JPJP-P-2004-00299446 2004-10-13

Publications (2)

Publication Number Publication Date
KR20070067200A KR20070067200A (ko) 2007-06-27
KR100893871B1 true KR100893871B1 (ko) 2009-04-20

Family

ID=36148283

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077010736A Expired - Fee Related KR100893871B1 (ko) 2004-10-13 2005-10-05 취성재료 기판의 스크라이브 방법 및 스크라이브 장치및 취성재료 기판의 절단 시스템

Country Status (7)

Country Link
US (1) US20090050610A1 (enExample)
EP (1) EP1800820B1 (enExample)
JP (1) JP4818120B2 (enExample)
KR (1) KR100893871B1 (enExample)
CN (1) CN101068666B (enExample)
TW (1) TW200624396A (enExample)
WO (1) WO2006040988A1 (enExample)

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JP2009126780A (ja) * 2007-11-21 2009-06-11 Semes Co Ltd スクライブ装置並びに方法、及びこれを利用した基板切断装置
TWI435850B (zh) * 2008-01-23 2014-05-01 Mitsuboshi Diamond Ind Co Ltd Scribing device and scribing method
KR100989125B1 (ko) * 2008-07-16 2010-10-20 삼성모바일디스플레이주식회사 원장기판 절단 장치 및 이에 의하여 절단된 유기발광표시장치
JP5167160B2 (ja) * 2009-01-30 2013-03-21 三星ダイヤモンド工業株式会社 脆性材料基板の搬送・分断装置
JP5249979B2 (ja) * 2010-03-18 2013-07-31 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法およびこれに用いるレーザ加工装置
JP5508133B2 (ja) * 2010-05-19 2014-05-28 株式会社ディスコ 板状物の分割装置
KR101356217B1 (ko) * 2011-12-20 2014-01-29 참엔지니어링(주) 기판 트리밍 장치 및 방법
KR101407976B1 (ko) * 2012-05-04 2014-07-03 코닝정밀소재 주식회사 실시간 파손 감지 기능을 구비한 유리기판용 레이저 절단 장치 및 이의 유리기판 파손 감지 방법
CN102674676A (zh) * 2012-05-17 2012-09-19 东莞宏威数码机械有限公司 基片切割装置
JP6043149B2 (ja) * 2012-10-29 2016-12-14 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置および脆性材料基板のブレイク方法
CN103056976B (zh) * 2012-12-27 2015-07-22 东莞市拓荒牛自动化设备有限公司 一种led导光板刻线方法及实施该方法的刻线机
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JP2015034111A (ja) * 2013-08-09 2015-02-19 三星ダイヤモンド工業株式会社 積層セラミックス基板の分断方法
EP3155556B1 (en) 2014-06-10 2019-12-18 Sicpa Holding SA Substrate with a fragmented marking thereon
EP2990388B1 (en) * 2014-08-26 2019-01-30 Mecánicas Teruel S.L. Cutting device for a cutting table
KR101648010B1 (ko) * 2015-03-03 2016-08-17 한국미쯔보시다이아몬드공업(주) 스크라이브 라인 형성 방법
DE102015211017B4 (de) * 2015-06-16 2017-06-14 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zum hauptzeitparallelen Entladen eines freigeschnittenen Werkstückteils, zugehörige Laserschneidmaschine und Computerprogrammprodukt
JP6610026B2 (ja) * 2015-06-23 2019-11-27 三星ダイヤモンド工業株式会社 スクライブ装置
CN106891094A (zh) * 2015-12-14 2017-06-27 上海申和热磁电子有限公司 用于覆铜陶瓷基板的激光切割机工作台
JP6699196B2 (ja) * 2016-01-22 2020-05-27 三星ダイヤモンド工業株式会社 ブレイク装置
CN105643823B (zh) * 2016-03-18 2017-11-07 郑招才 一种陶瓷简易切割装置四轴移动机架
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CN107225697B (zh) * 2016-03-18 2019-04-02 唐山国新赛隆科技有限公司 一种气缸推动式陶瓷简易切割装置及其工作方法
CN205874212U (zh) * 2016-07-21 2017-01-11 京东方科技集团股份有限公司 切割刀头以及切割装置
CN106114983B (zh) * 2016-08-11 2018-05-22 新昌县远通农业发展有限公司 一种化妆品盒输送架抓取输送机构
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CN106081249B (zh) * 2016-08-11 2018-05-25 台州市黄岩昱通塑业有限公司 一种化妆品盒输送架搬运输送机构
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KR101899679B1 (ko) * 2016-12-21 2018-09-17 주식회사 포스코 시료 고정장치
CN106626109A (zh) * 2016-12-21 2017-05-10 日照市奥大力精密设备有限公司 一种智能玻璃上片切割一体机
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KR101980606B1 (ko) * 2017-08-29 2019-05-21 한국미쯔보시다이아몬드공업(주) 취성 재료 기판의 경사 타입 분단 장치 및 분단 방법
CN107352786A (zh) * 2017-08-30 2017-11-17 蚌埠朝阳玻璃机械有限公司 Tft视觉定位精密光电玻璃切割机
JP6967276B2 (ja) * 2017-12-28 2021-11-17 三星ダイヤモンド工業株式会社 ブレーク装置
JP2020066539A (ja) * 2018-10-22 2020-04-30 坂東機工株式会社 ガラス板の折割機械
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Also Published As

Publication number Publication date
TW200624396A (en) 2006-07-16
US20090050610A1 (en) 2009-02-26
JP4818120B2 (ja) 2011-11-16
CN101068666B (zh) 2011-05-04
KR20070067200A (ko) 2007-06-27
EP1800820A4 (en) 2011-02-23
WO2006040988A1 (ja) 2006-04-20
CN101068666A (zh) 2007-11-07
TWI374862B (enExample) 2012-10-21
EP1800820A1 (en) 2007-06-27
EP1800820B1 (en) 2012-12-12
JPWO2006040988A1 (ja) 2008-05-15

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