JP4817924B2 - 半導体パッケージ - Google Patents

半導体パッケージ Download PDF

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Publication number
JP4817924B2
JP4817924B2 JP2006091162A JP2006091162A JP4817924B2 JP 4817924 B2 JP4817924 B2 JP 4817924B2 JP 2006091162 A JP2006091162 A JP 2006091162A JP 2006091162 A JP2006091162 A JP 2006091162A JP 4817924 B2 JP4817924 B2 JP 4817924B2
Authority
JP
Japan
Prior art keywords
frequency signal
signal line
base substrate
microstrip line
semiconductor package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006091162A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007266417A (ja
JP2007266417A5 (enExample
Inventor
文朗 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2006091162A priority Critical patent/JP4817924B2/ja
Priority to US11/535,311 priority patent/US20070230145A1/en
Publication of JP2007266417A publication Critical patent/JP2007266417A/ja
Priority to US12/353,100 priority patent/US7838990B2/en
Publication of JP2007266417A5 publication Critical patent/JP2007266417A5/ja
Application granted granted Critical
Publication of JP4817924B2 publication Critical patent/JP4817924B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0056—Casings specially adapted for microwave applications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6611—Wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6644—Packaging aspects of high-frequency amplifiers
    • H01L2223/6655—Matching arrangements, e.g. arrangement of inductive and capacitive components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48153—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/48195—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being a discrete passive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Waveguides (AREA)
  • Semiconductor Lasers (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
JP2006091162A 2006-03-29 2006-03-29 半導体パッケージ Expired - Fee Related JP4817924B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006091162A JP4817924B2 (ja) 2006-03-29 2006-03-29 半導体パッケージ
US11/535,311 US20070230145A1 (en) 2006-03-29 2006-09-26 Semiconductor package
US12/353,100 US7838990B2 (en) 2006-03-29 2009-01-13 High-frequency hermetically-sealed circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006091162A JP4817924B2 (ja) 2006-03-29 2006-03-29 半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2007266417A JP2007266417A (ja) 2007-10-11
JP2007266417A5 JP2007266417A5 (enExample) 2009-04-16
JP4817924B2 true JP4817924B2 (ja) 2011-11-16

Family

ID=38558611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006091162A Expired - Fee Related JP4817924B2 (ja) 2006-03-29 2006-03-29 半導体パッケージ

Country Status (2)

Country Link
US (2) US20070230145A1 (enExample)
JP (1) JP4817924B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4903738B2 (ja) * 2007-03-28 2012-03-28 京セラ株式会社 電子部品収納用パッケージおよび電子装置
AU323139S (en) * 2008-05-15 2008-12-11 Tyco Electronics Services Gmbh Printed circuit board
CN102007823B (zh) * 2008-05-15 2013-09-25 Adc有限公司 电连接器和用于电连接器的电路板
JP4982596B2 (ja) * 2009-09-08 2012-07-25 株式会社東芝 モジュールの接続構造
JP6375584B2 (ja) * 2014-03-31 2018-08-22 住友電工デバイス・イノベーション株式会社 電子部品搭載用パッケージ
JP6591912B2 (ja) * 2016-02-25 2019-10-16 京セラ株式会社 半導体素子パッケージおよび半導体装置
JP6412900B2 (ja) * 2016-06-23 2018-10-24 株式会社東芝 高周波半導体用パッケージ

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3784884A (en) * 1972-11-03 1974-01-08 Motorola Inc Low parasitic microwave package
US4150393A (en) * 1975-09-29 1979-04-17 Motorola, Inc. High frequency semiconductor package
JPS596513B2 (ja) * 1978-12-28 1984-02-13 富士通株式会社 マイクロ波装置モジユ−ル
JPS60210853A (ja) * 1984-03-06 1985-10-23 Fujitsu Ltd 半導体装置
US4626805A (en) * 1985-04-26 1986-12-02 Tektronix, Inc. Surface mountable microwave IC package
JPH0720919Y2 (ja) * 1987-01-22 1995-05-15 日本電信電話株式会社 マイクロ波集積回路用パツケ−ジ
JPH0390503U (enExample) * 1989-12-29 1991-09-13
JPH05121913A (ja) * 1991-10-24 1993-05-18 Shinko Electric Ind Co Ltd 高周波素子用パツケージ
US5406120A (en) * 1992-10-20 1995-04-11 Jones; Robert M. Hermetically sealed semiconductor ceramic package
JPH1174396A (ja) * 1997-08-28 1999-03-16 Kyocera Corp 高周波用入出力端子ならびに高周波用半導体素子収納用パッケージ
US6441697B1 (en) * 1999-01-27 2002-08-27 Kyocera America, Inc. Ultra-low-loss feedthrough for microwave circuit package
JP3460631B2 (ja) * 1999-07-23 2003-10-27 株式会社日立製作所 高周波半導体素子
JP3328235B2 (ja) * 1999-08-17 2002-09-24 山形日本電気株式会社 半導体装置用セラミックパッケージ
JP3996330B2 (ja) * 1999-08-31 2007-10-24 株式会社住友金属エレクトロデバイス 高周波パッケージ
JP2001156196A (ja) * 1999-09-17 2001-06-08 Toshiba Corp 高周波パッケージおよびその製造方法
JP3771853B2 (ja) * 2002-02-22 2006-04-26 京セラ株式会社 入出力端子および半導体素子収納用パッケージ

Also Published As

Publication number Publication date
JP2007266417A (ja) 2007-10-11
US7838990B2 (en) 2010-11-23
US20070230145A1 (en) 2007-10-04
US20090127675A1 (en) 2009-05-21

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