JP5443594B2 - チップから導波管ポートへの変換器 - Google Patents
チップから導波管ポートへの変換器 Download PDFInfo
- Publication number
- JP5443594B2 JP5443594B2 JP2012508907A JP2012508907A JP5443594B2 JP 5443594 B2 JP5443594 B2 JP 5443594B2 JP 2012508907 A JP2012508907 A JP 2012508907A JP 2012508907 A JP2012508907 A JP 2012508907A JP 5443594 B2 JP5443594 B2 JP 5443594B2
- Authority
- JP
- Japan
- Prior art keywords
- main surface
- chip
- port
- package
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
- H01L2223/6633—Transition between different waveguide types
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6683—High-frequency adaptations for monolithic microwave integrated circuit [MMIC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
- H01L2924/1027—IV
- H01L2924/10271—Silicon-germanium [SiGe]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
- H01L2924/1032—III-V
- H01L2924/10329—Gallium arsenide [GaAs]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/141—Analog devices
- H01L2924/142—HF devices
- H01L2924/1421—RF devices
- H01L2924/14215—Low-noise amplifier [LNA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/141—Analog devices
- H01L2924/1423—Monolithic Microwave Integrated Circuit [MMIC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
- H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
- H01L2924/15156—Side view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15158—Shape the die mounting substrate being other than a cuboid
- H01L2924/15159—Side view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
- H01L2924/16153—Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1903—Structure including wave guides
- H01L2924/19038—Structure including wave guides being a hybrid line type
- H01L2924/19039—Structure including wave guides being a hybrid line type impedance transition between different types of wave guides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Waveguides (AREA)
Description
−マイクロ波チップから導波管インターフェースへのロバストで低損失の変換器が得られること
−ピックアンドプレース(pick & place)での組立てが可能となる
−パッケージ標準を用いた製造が可能となる
Claims (13)
- チップの形式の第1の平面構造(1、1’、62)から導波管ポート(47、47’、77)への変換器であって、
前記第1の平面構造(1、1’、62)は第1の主面(3、3’、66)と第2の主面(4、4’、67)とを有し、
前記第1の主面(3、3’、66)は、入力信号を受け取るように構成される少なくとも1つの入力ポート(35、36、37、38、39)と、出力信号を出力するように構成される少なくとも1つの出力ポート(44、45、72)と、少なくとも1つの電気的な機能性とを含み、
前記ポート(44、45、72、35、36、37、38、39)のうちの1つのポート(44、72)は、当該1つのポート(44、72)から少なくとも部分的に前記導波管ポート(47、47’、77)上に伸びるように構成される導電性のプローブ(48、48’、73)と直接的に接続されて、それにより前記1つのポート(44、72)と前記導波管ポート(47、47’、77)との間で信号が転送され得、
前記第1の平面構造(1、1’)は、第1の基盤主面(33)と第2の基盤主面(34)とを有する、リードフレームの形式の基盤構造(5)の、当該第1の基盤主面(33)に実装され、
前記第2の主面(4、4’)は、前記第1の基盤主面(33)に面するように構成され、
前記導波管ポート(47、47’)は、前記基盤構造(5)において前記第1の基盤主面(33)から前記第2の基盤主面(34)に及ぶように構成される、
ことを特徴とする、変換器。 - 前記導波管ポート(47)は、前記第1の平面構造(1)においても、前記第1の主面(3)から前記第2の基盤主面(34)に及ぶように構成される、ことを特徴とする請求項1に記載の変換器。
- 前記第1の平面構造は、複数の電気的な機能を有するチップ(1、1’、62)であり、
ボンドワイヤ(46)は、チップ接続部(35、36、37、38、39、40、41、42、43、45)と、前記基盤構造(5)に含まれる対応するパッケージ接続部(22、23、24、25、26、7、8、20、19、9)とを接続し、
前記基盤構造(5)および前記チップ(1、1’)は、鋳物(32)の内部に少なくとも部分的に含まれ、前記パッケージ接続部(22、23、24、25、26、7、8、20、19、9)を接続可能にするパッケージを形成する、
ことを特徴とする請求項1又は2に記載の変換器。 - 前記パッケージは、QFN(Quad Flat No Lead)型のパッケージである、ことを特徴とする請求項3に記載の変換器。
- 導電性の筺体(49、49’、82)が前記導波管ポート(47、47’、77)上に配置されて、それにより導電性の壁(51、52、53、54、55、51’、52’、53’、54’、55’)を有する空洞(50、50’、84)が形成され、また、前記導電性のプローブ(48、48’、73)が囲われ、
前記空洞(50、50’、84)の大きさが適合されて、それにより、前記プローブ(48、48’、73)は、前記導波管ポート(47、47’、77)への信号、および/または前記導波管ポート(47、47’、77)からの信号を所望の手段で転送し得る、
ことを特徴とする請求項1〜4のいずれか1項に記載の変換器。 - 前記筺体は、第1の壁(51、51’)を含み、当該第1の壁(51、51’)は、前記第1の平面構造(1、1’、62)の前記主面(3、4、3’、4’)に実質的に平行である主要な拡張平面を有し、
前記筺体は、第2の壁(52、52’)、第3の壁(53、53’)、第4の壁(54、54’)、および第5の壁(55、55’)を含み、これらの後者の壁(52、53、54、55、52’、53’、54’、55’)は、前記第1の壁(51、51’)の前記主要な拡張平面に実質的に垂直である主要な拡張平面を有し、前記導波管ポート(47、47’、77)に向かって伸び、
前記空洞(50、50’、84)は、前記壁(51、52、53、54、55、51’、52’、53’、54’、55’)により定められる、
ことを特徴とする請求項5に記載の変換器。 - 前記第2の壁(52、52’)は、前記筺体(49、49’、82)との電気的な接触なしに前記空洞(50、50’、84)の中に入ることを前記プローブ(48、48’、73)に可能にするプローブ移行部(56、56’)を含む、ことを特徴とする請求項6に記載の変換器。
- 複数の電気的な機能を有するチップ(1、1’、62)を含むパッケージであって、
ボンドワイヤ(46)は、チップ接続部(35、36、37、38、39、40、41、42、43、45)と、基盤構造(5)に含まれる対応するパッケージ接続部(22、23、24、25、26、7、8、20、19、9)とを接続し、
前記基盤構造(5)および前記チップ(1、1’)は、鋳物(32)の内部に少なくとも部分的に含まれ、前記パッケージ接続部(22、23、24、25、26、7、8、20、19、9)を接続可能にする前記パッケージを形成し、
前記パッケージは、前記チップ(1、1’、62)から導波管ポート(47、47’、77)への変換器を含み、
前記チップ(1、1’、62)は、第1の主面(3、3’、66)と第2の主面(4、4’、67)とを有し、
前記第1の主面(3、3’、66)は、入力信号を受け取るように構成される少なくとも1つの入力ポート(35、36、37、38、39)と、出力信号を出力するように構成される少なくとも1つの出力ポート(44、45、72)と、少なくとも1つの電気的な機能性とを含み、
前記ポート(44、45、72、35、36、37、38、39)のうちの1つのポート(44、72)は、当該1つのポート(44、72)から少なくとも部分的に前記導波管ポート(47、47’、77)上に伸びるように構成される導電性のプローブ(48、48’、73)と直接的に接続されて、それにより前記1つのポート(44、72)と前記導波管ポート(47、47’、77)との間で信号が転送され得、
前記チップ(1、1’)は、第1の基盤主面(33)と第2の基盤主面(34)とを有する、リードフレームの形式の前記基盤構造(5)の、当該第1の基盤主面(33)に実装され、
前記第2の主面(4、4’)は、前記第1の基盤主面(33)に面するように構成され、
前記導波管ポート(47、47’)は、前記基盤構造(5)において前記第1の基盤主面(33)から前記第2の基盤主面(34)に及ぶように構成される、
ことを特徴とする、パッケージ。 - 前記導波管ポート(47)は、前記チップ(1)においても、前記第1の主面(3)から前記第2の基盤主面(34)に及ぶように構成される、ことを特徴とする請求項8に記載のパッケージ。
- 前記パッケージは、QFN(Quad Flat No Lead)型のパッケージである、ことを特徴とする請求項8または9のいずれか1項に記載のパッケージ。
- 導電性の筺体(49、49’)が前記導波管ポート(47、47’)上に配置されて、それにより導電性の壁(51、52、53、54、55、51’、52’、53’、54’、55’)を有する空洞(50、50’)が形成され、また、前記導電性のプローブ(48、48’)が囲われ、
前記空洞(50、50’)の大きさが適合されて、それにより、前記プローブ(48、48’)は、前記導波管ポート(47、47’)への信号、および/または前記導波管ポート(47、47’)からの信号を所望の手段で転送し得る、
ことを特徴とする請求項8から10のいずれか1項に記載のパッケージ。 - 前記筺体は、第1の壁(51、51’)を含み、当該第1の壁(51、51’)は、前記チップ(1、1’)の前記主面(3、4、3’、4’)に実質的に平行である主要な拡張平面を有し、
前記筺体は、第2の壁(52、52’)、第3の壁(53、53’)、第4の壁(54、54’)、および第5の壁(55、55’)を含み、これらの後者の壁(52、53、54、55、52’、53’、54’、55’)は、前記第1の壁(51、51’)の前記主要な拡張平面に実質的に垂直である主要な拡張平面を有し、前記導波管ポート(47、47’)に向かって伸び、
前記空洞(50、50’)は、前記壁(51、52、53、54、55、51’、52’、53’、54’、55’)により定められる、
ことを特徴とする請求項11に記載のパッケージ。 - 前記第2の壁(52、52’)は、前記筺体(49、49’)との電気的な接触なしに前記空洞(50、50’)の中に入ることを前記プローブ(48、48’)に可能にするプローブ移行部(56、56’)を含む、ことを特徴とする請求項12に記載のパッケージ。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2009/055606 WO2010127709A1 (en) | 2009-05-08 | 2009-05-08 | A transition from a chip to a waveguide port |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012526429A JP2012526429A (ja) | 2012-10-25 |
JP5443594B2 true JP5443594B2 (ja) | 2014-03-19 |
Family
ID=41666457
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012508907A Expired - Fee Related JP5443594B2 (ja) | 2009-05-08 | 2009-05-08 | チップから導波管ポートへの変換器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8901719B2 (ja) |
EP (1) | EP2427908A1 (ja) |
JP (1) | JP5443594B2 (ja) |
WO (1) | WO2010127709A1 (ja) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010063167B4 (de) * | 2010-12-15 | 2022-02-24 | Endress+Hauser SE+Co. KG | Mit hochfrequenten Mikrowellen arbeitendes Füllstandsmessgerät |
DE102012203293B4 (de) | 2012-03-02 | 2021-12-02 | Robert Bosch Gmbh | Halbleitermodul mit integriertem Wellenleiter für Radarsignale |
US9219041B2 (en) * | 2012-03-29 | 2015-12-22 | International Business Machines Corporation | Electronic package for millimeter wave semiconductor dies |
JP5639114B2 (ja) * | 2012-05-25 | 2014-12-10 | 日本電信電話株式会社 | ホーンアンテナ一体型mmicパッケージ |
JP6318392B2 (ja) | 2013-06-18 | 2018-05-09 | 日本無線株式会社 | 2ポートトリプレート線路−導波管変換器 |
US9054404B2 (en) * | 2013-08-26 | 2015-06-09 | Microelectronics Technology, Inc. | Multi-layer circuit board with waveguide to microstrip transition structure |
KR20150075347A (ko) * | 2013-12-25 | 2015-07-03 | 가부시끼가이샤 도시바 | 반도체 패키지, 반도체 모듈 및 반도체 디바이스 |
JP6372113B2 (ja) * | 2014-03-17 | 2018-08-15 | 富士通株式会社 | 高周波モジュール及びその製造方法 |
JP6314705B2 (ja) * | 2014-07-04 | 2018-04-25 | 富士通株式会社 | 高周波モジュール及びその製造方法 |
US9666930B2 (en) * | 2014-10-23 | 2017-05-30 | Nxp Usa, Inc. | Interface between a semiconductor die and a waveguide, where the interface is covered by a molding compound |
US9564671B2 (en) | 2014-12-28 | 2017-02-07 | International Business Machines Corporation | Direct chip to waveguide transition including ring shaped antennas disposed in a thinned periphery of the chip |
US10274515B1 (en) * | 2015-08-07 | 2019-04-30 | Johnstech International Corporation | Waveguide integrated testing |
US9692135B1 (en) | 2015-12-10 | 2017-06-27 | Semiconductor Components Industries, Llc | Direct transition from a waveguide to a buried chip |
US9913376B2 (en) | 2016-05-04 | 2018-03-06 | Northrop Grumman Systems Corporation | Bridging electronic inter-connector and corresponding connection method |
US10468736B2 (en) | 2017-02-08 | 2019-11-05 | Aptiv Technologies Limited | Radar assembly with ultra wide band waveguide to substrate integrated waveguide transition |
CN108321479B (zh) * | 2018-04-03 | 2024-02-23 | 中国工程物理研究院电子工程研究所 | 一种半槽式天线型芯片-波导传输过渡结构 |
US11527808B2 (en) * | 2019-04-29 | 2022-12-13 | Aptiv Technologies Limited | Waveguide launcher |
EP3771028A1 (en) * | 2019-07-25 | 2021-01-27 | Nxp B.V. | Semiconductor device and method |
US11362436B2 (en) | 2020-10-02 | 2022-06-14 | Aptiv Technologies Limited | Plastic air-waveguide antenna with conductive particles |
US11757166B2 (en) | 2020-11-10 | 2023-09-12 | Aptiv Technologies Limited | Surface-mount waveguide for vertical transitions of a printed circuit board |
US11749883B2 (en) | 2020-12-18 | 2023-09-05 | Aptiv Technologies Limited | Waveguide with radiation slots and parasitic elements for asymmetrical coverage |
US11681015B2 (en) | 2020-12-18 | 2023-06-20 | Aptiv Technologies Limited | Waveguide with squint alteration |
US11901601B2 (en) | 2020-12-18 | 2024-02-13 | Aptiv Technologies Limited | Waveguide with a zigzag for suppressing grating lobes |
US11626668B2 (en) | 2020-12-18 | 2023-04-11 | Aptiv Technologies Limited | Waveguide end array antenna to reduce grating lobes and cross-polarization |
US11502420B2 (en) | 2020-12-18 | 2022-11-15 | Aptiv Technologies Limited | Twin line fed dipole array antenna |
US11444364B2 (en) | 2020-12-22 | 2022-09-13 | Aptiv Technologies Limited | Folded waveguide for antenna |
US11668787B2 (en) | 2021-01-29 | 2023-06-06 | Aptiv Technologies Limited | Waveguide with lobe suppression |
US11721905B2 (en) | 2021-03-16 | 2023-08-08 | Aptiv Technologies Limited | Waveguide with a beam-forming feature with radiation slots |
US11616306B2 (en) | 2021-03-22 | 2023-03-28 | Aptiv Technologies Limited | Apparatus, method and system comprising an air waveguide antenna having a single layer material with air channels therein which is interfaced with a circuit board |
US11973268B2 (en) | 2021-05-03 | 2024-04-30 | Aptiv Technologies AG | Multi-layered air waveguide antenna with layer-to-layer connections |
US11962085B2 (en) | 2021-05-13 | 2024-04-16 | Aptiv Technologies AG | Two-part folded waveguide having a sinusoidal shape channel including horn shape radiating slots formed therein which are spaced apart by one-half wavelength |
US11616282B2 (en) | 2021-08-03 | 2023-03-28 | Aptiv Technologies Limited | Transition between a single-ended port and differential ports having stubs that match with input impedances of the single-ended and differential ports |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07221223A (ja) | 1994-02-03 | 1995-08-18 | Mitsubishi Electric Corp | 半導体装置,及び混成集積回路装置 |
EP0874415B1 (en) | 1997-04-25 | 2006-08-23 | Kyocera Corporation | High-frequency package |
US5912598A (en) * | 1997-07-01 | 1999-06-15 | Trw Inc. | Waveguide-to-microstrip transition for mmwave and MMIC applications |
US5982250A (en) * | 1997-11-26 | 1999-11-09 | Twr Inc. | Millimeter-wave LTCC package |
US6040739A (en) * | 1998-09-02 | 2000-03-21 | Trw Inc. | Waveguide to microstrip backshort with external spring compression |
US6486748B1 (en) * | 1999-02-24 | 2002-11-26 | Trw Inc. | Side entry E-plane probe waveguide to microstrip transition |
JP2003078310A (ja) * | 2001-09-04 | 2003-03-14 | Murata Mfg Co Ltd | 高周波用線路変換器、部品、モジュールおよび通信装置 |
JP3890999B2 (ja) * | 2002-02-14 | 2007-03-07 | 住友電気工業株式会社 | 光送信モジュール |
KR100993277B1 (ko) | 2002-04-30 | 2010-11-10 | 르네사스 일렉트로닉스 가부시키가이샤 | 반도체장치 및 전자 장치 |
EP1367668A1 (en) | 2002-05-30 | 2003-12-03 | Siemens Information and Communication Networks S.p.A. | Broadband microstrip to waveguide transition on a multilayer printed circuit board |
US6707349B1 (en) * | 2002-09-06 | 2004-03-16 | Industrial Technology Research Institute | Directional coupler for microwave cavities |
FR2847723B1 (fr) * | 2002-11-22 | 2006-02-03 | United Monolithic Semiconduct | Composant electronique en boitier pour applications a des frequences millimetriques |
US20060214842A1 (en) * | 2004-06-29 | 2006-09-28 | Kyocera Corporation | Mixer, High-Frequency transmitting/receiving apparatus having the same, radarapparatus having the high-frequency transmitting/receiving apparatus, and vehicle equipped with radar apparatus |
FR2879889B1 (fr) | 2004-12-20 | 2007-01-26 | United Monolithic Semiconduct | Boitier miniature hyperfrequence et procede de fabrication du boitier |
DE102006023123B4 (de) | 2005-06-01 | 2011-01-13 | Infineon Technologies Ag | Abstandserfassungsradar für Fahrzeuge mit einem Halbleitermodul mit Komponenten für Höchstfrequenztechnik in Kunststoffgehäuse und Verfahren zur Herstellung eines Halbleitermoduls mit Komponenten für ein Abstandserfassungsradar für Fahrzeuge in einem Kunststoffgehäuse |
US7504721B2 (en) * | 2006-01-19 | 2009-03-17 | International Business Machines Corporation | Apparatus and methods for packaging dielectric resonator antennas with integrated circuit chips |
WO2008069714A1 (en) * | 2006-12-05 | 2008-06-12 | Telefonaktiebolaget Lm Ericsson (Publ) | A surface-mountable waveguide arrangement |
US8581113B2 (en) * | 2007-12-19 | 2013-11-12 | Bridgewave Communications, Inc. | Low cost high frequency device package and methods |
US8072065B2 (en) * | 2008-02-14 | 2011-12-06 | Viasat, Inc. | System and method for integrated waveguide packaging |
US8872333B2 (en) * | 2008-02-14 | 2014-10-28 | Viasat, Inc. | System and method for integrated waveguide packaging |
US8760342B2 (en) * | 2009-03-31 | 2014-06-24 | Kyocera Corporation | Circuit board, high frequency module, and radar apparatus |
JP5606061B2 (ja) * | 2009-12-25 | 2014-10-15 | キヤノン株式会社 | 発振素子 |
AU2011218651B2 (en) * | 2010-08-31 | 2014-10-09 | Viasat, Inc. | Leadframe package with integrated partial waveguide interface |
US9219041B2 (en) * | 2012-03-29 | 2015-12-22 | International Business Machines Corporation | Electronic package for millimeter wave semiconductor dies |
-
2009
- 2009-05-08 US US13/319,171 patent/US8901719B2/en not_active Expired - Fee Related
- 2009-05-08 WO PCT/EP2009/055606 patent/WO2010127709A1/en active Application Filing
- 2009-05-08 EP EP09779430A patent/EP2427908A1/en not_active Withdrawn
- 2009-05-08 JP JP2012508907A patent/JP5443594B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US8901719B2 (en) | 2014-12-02 |
EP2427908A1 (en) | 2012-03-14 |
US20120068316A1 (en) | 2012-03-22 |
JP2012526429A (ja) | 2012-10-25 |
WO2010127709A1 (en) | 2010-11-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5443594B2 (ja) | チップから導波管ポートへの変換器 | |
US11456255B2 (en) | Impedance controlled electrical interconnection employing meta-materials | |
US8242588B2 (en) | Lead frame based ceramic air cavity package | |
JPS63177541A (ja) | 集積回路パツケ−ジ | |
JP5697669B2 (ja) | 電子部品収納用部品、電子モジュールおよび電子装置 | |
JPH09283700A (ja) | 高周波用電力増幅器 | |
JP2008244289A (ja) | 電磁シールド構造 | |
JPH0629428A (ja) | 半導体装置 | |
US6531775B1 (en) | High-frequency module | |
KR20070059000A (ko) | 전자 디바이스 및 이것에 이용하는 패키지 | |
US6140698A (en) | Package for microwave and mm-wave integrated circuits | |
US6998292B2 (en) | Apparatus and method for inter-chip or chip-to-substrate connection with a sub-carrier | |
EP2013906B1 (en) | A microwave chip supporting structure | |
US20070108584A1 (en) | Transmitter module with improved heat dissipation | |
US6639305B2 (en) | Single layer surface mount package | |
WO2010130293A1 (en) | A transition from a chip to a waveguide | |
JP3601462B2 (ja) | 電子部品のパッケージ構造 | |
JP7131933B2 (ja) | 半導体装置用パッケージおよび半導体装置 | |
JP2004319905A (ja) | 高周波集積回路パッケージ及び電子装置 | |
JP3987659B2 (ja) | 高周波半導体装置 | |
JP2000353770A (ja) | 集積回路パッケージ、ミリ波集積回路パッケージ、及び集積回路パッケージを基板に組立及び実装する方法 | |
JP2001217331A (ja) | 半導体素子収納用パッケージ | |
JP2004055782A (ja) | 電子回路装置 | |
JP2001308224A (ja) | チップ部品用パッケ−ジ | |
JPH09213875A (ja) | 樹脂封止型半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130516 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130911 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20131015 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131021 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20131119 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20131219 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |