JP2007266417A5 - - Google Patents

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Publication number
JP2007266417A5
JP2007266417A5 JP2006091162A JP2006091162A JP2007266417A5 JP 2007266417 A5 JP2007266417 A5 JP 2007266417A5 JP 2006091162 A JP2006091162 A JP 2006091162A JP 2006091162 A JP2006091162 A JP 2006091162A JP 2007266417 A5 JP2007266417 A5 JP 2007266417A5
Authority
JP
Japan
Prior art keywords
base substrate
frequency signal
signal line
microstrip line
impedance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006091162A
Other languages
English (en)
Japanese (ja)
Other versions
JP4817924B2 (ja
JP2007266417A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006091162A priority Critical patent/JP4817924B2/ja
Priority claimed from JP2006091162A external-priority patent/JP4817924B2/ja
Priority to US11/535,311 priority patent/US20070230145A1/en
Publication of JP2007266417A publication Critical patent/JP2007266417A/ja
Priority to US12/353,100 priority patent/US7838990B2/en
Publication of JP2007266417A5 publication Critical patent/JP2007266417A5/ja
Application granted granted Critical
Publication of JP4817924B2 publication Critical patent/JP4817924B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006091162A 2006-03-29 2006-03-29 半導体パッケージ Expired - Fee Related JP4817924B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006091162A JP4817924B2 (ja) 2006-03-29 2006-03-29 半導体パッケージ
US11/535,311 US20070230145A1 (en) 2006-03-29 2006-09-26 Semiconductor package
US12/353,100 US7838990B2 (en) 2006-03-29 2009-01-13 High-frequency hermetically-sealed circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006091162A JP4817924B2 (ja) 2006-03-29 2006-03-29 半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2007266417A JP2007266417A (ja) 2007-10-11
JP2007266417A5 true JP2007266417A5 (enExample) 2009-04-16
JP4817924B2 JP4817924B2 (ja) 2011-11-16

Family

ID=38558611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006091162A Expired - Fee Related JP4817924B2 (ja) 2006-03-29 2006-03-29 半導体パッケージ

Country Status (2)

Country Link
US (2) US20070230145A1 (enExample)
JP (1) JP4817924B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4903738B2 (ja) * 2007-03-28 2012-03-28 京セラ株式会社 電子部品収納用パッケージおよび電子装置
AU323139S (en) * 2008-05-15 2008-12-11 Tyco Electronics Services Gmbh Printed circuit board
CN102007823B (zh) * 2008-05-15 2013-09-25 Adc有限公司 电连接器和用于电连接器的电路板
JP4982596B2 (ja) * 2009-09-08 2012-07-25 株式会社東芝 モジュールの接続構造
JP6375584B2 (ja) * 2014-03-31 2018-08-22 住友電工デバイス・イノベーション株式会社 電子部品搭載用パッケージ
JP6591912B2 (ja) * 2016-02-25 2019-10-16 京セラ株式会社 半導体素子パッケージおよび半導体装置
JP6412900B2 (ja) * 2016-06-23 2018-10-24 株式会社東芝 高周波半導体用パッケージ

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3784884A (en) * 1972-11-03 1974-01-08 Motorola Inc Low parasitic microwave package
US4150393A (en) * 1975-09-29 1979-04-17 Motorola, Inc. High frequency semiconductor package
JPS596513B2 (ja) * 1978-12-28 1984-02-13 富士通株式会社 マイクロ波装置モジユ−ル
JPS60210853A (ja) * 1984-03-06 1985-10-23 Fujitsu Ltd 半導体装置
US4626805A (en) * 1985-04-26 1986-12-02 Tektronix, Inc. Surface mountable microwave IC package
JPH0720919Y2 (ja) * 1987-01-22 1995-05-15 日本電信電話株式会社 マイクロ波集積回路用パツケ−ジ
JPH0390503U (enExample) * 1989-12-29 1991-09-13
JPH05121913A (ja) * 1991-10-24 1993-05-18 Shinko Electric Ind Co Ltd 高周波素子用パツケージ
US5406120A (en) * 1992-10-20 1995-04-11 Jones; Robert M. Hermetically sealed semiconductor ceramic package
JPH1174396A (ja) * 1997-08-28 1999-03-16 Kyocera Corp 高周波用入出力端子ならびに高周波用半導体素子収納用パッケージ
US6441697B1 (en) * 1999-01-27 2002-08-27 Kyocera America, Inc. Ultra-low-loss feedthrough for microwave circuit package
JP3460631B2 (ja) * 1999-07-23 2003-10-27 株式会社日立製作所 高周波半導体素子
JP3328235B2 (ja) * 1999-08-17 2002-09-24 山形日本電気株式会社 半導体装置用セラミックパッケージ
JP3996330B2 (ja) * 1999-08-31 2007-10-24 株式会社住友金属エレクトロデバイス 高周波パッケージ
JP2001156196A (ja) * 1999-09-17 2001-06-08 Toshiba Corp 高周波パッケージおよびその製造方法
JP3771853B2 (ja) * 2002-02-22 2006-04-26 京セラ株式会社 入出力端子および半導体素子収納用パッケージ

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