WO2017090651A1 - 電子部品搭載用パッケージおよび電子装置 - Google Patents
電子部品搭載用パッケージおよび電子装置 Download PDFInfo
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- WO2017090651A1 WO2017090651A1 PCT/JP2016/084731 JP2016084731W WO2017090651A1 WO 2017090651 A1 WO2017090651 A1 WO 2017090651A1 JP 2016084731 W JP2016084731 W JP 2016084731W WO 2017090651 A1 WO2017090651 A1 WO 2017090651A1
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- WIPO (PCT)
- Prior art keywords
- electronic component
- notch
- component mounting
- hole
- recess
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/03—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on ceramics or electro-optical crystals, e.g. exhibiting Pockels effect or Kerr effect
- G02F1/0327—Operation of the cell; Circuit arrangements
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/03—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on ceramics or electro-optical crystals, e.g. exhibiting Pockels effect or Kerr effect
- G02F1/035—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on ceramics or electro-optical crystals, e.g. exhibiting Pockels effect or Kerr effect in an optical waveguide structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
Definitions
- the present invention relates to an electronic element mounting package for storing electronic components that operate in a high frequency band and an electronic device using the same.
- an electronic component mounting package for such an electronic device for example, a housing that houses the electronic component, a flexible substrate that is connected to a side wall of the housing, and a lead that electrically connects the electronic component and the flexible substrate. Some have pins.
- an electronic component mounting package has an upper surface having a recess and a lower surface having a notch, and a main body having a through hole from the bottom of the recess to the bottom of the notch.
- a casing provided on the bottom surface of the cutout portion and extending along the cutout side end portion of the main body, a coaxial connector provided in the cutout portion, And a flexible substrate extending from the inside of the notch to the outside of the notch.
- the coaxial connector includes a terminal having an upper end protruding into the recess through the through hole and a lower end protruding into the notch.
- the flexible substrate has a fixed end joined to the lower end of the terminal and a free end opposite to the fixed end. The flexible substrate is bent in contact with the protrusion.
- an electronic device includes an electronic component mounting package having the above configuration, an electronic component housed in a recess of the electronic component mounting package, and a lid joined to the electronic component mounting package. And have.
- FIG. 5 is a cross-sectional view taken along line XX in FIG. 4. It is sectional drawing which shows the package for electronic component mounting of 2nd Embodiment of this invention. It is sectional drawing which shows the package for electronic component mounting of 3rd Embodiment of this invention. It is sectional drawing which shows the electronic device of this invention.
- the electronic component mounting package 20 according to the first embodiment of the present invention will be described with reference to FIGS.
- the electronic component mounting package 20 of the present embodiment includes a housing 1, a coaxial connector 3, and a flexible substrate 6.
- the housing 1 includes a main body 1a having an upper surface having a recess 1b in which an electronic component is accommodated and a lower surface having a notch 1c.
- the cutout portion 1 c is open on the lower surface and side surface of the housing 1. Further, the main body 1a has a through hole 2 from the bottom surface of the recess 1b to the bottom surface of the notch 1c.
- the bottom surface of the cutout portion 1c refers to an inner surface close to the concave portion 1b on the upper surface side with respect to the cutout portion 1c.
- the main body 1a functions as a housing member for housing electronic components.
- the main body 1 a has a function of electromagnetically shielding the outside of the electronic component mounting package 20.
- the main body 1a is made of stainless steel such as Fe—Ni—Cr alloy (JIS standard SUS304, SUS310, etc.), Fe—Ni—Cr—Mo alloy (JIS standard SUS303, SUS316, etc.), Fe—Ni—Co alloy or the like. It is made of a metal material such as a Cu—Zn alloy.
- the thermal expansion coefficient of the LN element is 15.4 ⁇ 10. -6 / ° C.
- the main body 1a is manufactured using a metal material such as Fe-Ni-Cr alloy or Fe-Ni-Cr-Mo alloy such as SUS316 (thermal expansion coefficient 16.0 ⁇ 10 ⁇ 6 / ° C.).
- the main body 1a is manufactured by subjecting the ingot of the metal material to a base body and a frame body by applying a conventionally known metal processing method such as rolling and punching, and joining the base body and the frame body. Further, a metal having excellent corrosion resistance and excellent wettability with the brazing material may be deposited on the surface of the main body 1a. Specifically, a Ni layer having a thickness of 0.5 to 9 ⁇ m and an Au layer having a thickness of 0.5 to 9 ⁇ m are sequentially deposited by a plating method. In this case, the possibility that the main body 1a is oxidatively corroded can be reduced. Moreover, the base 5 for mounting the circuit board 4 on the bottom surface of the recess 1b of the main body 1a can be firmly bonded and fixed.
- the base and the frame may be integrally formed.
- an integral molding method there is a method in which a metal working method such as cutting or electric discharge machining is applied to an ingot of a metal material such as the Fe—Ni—Cr alloy or the Fe—Ni—Cr—Mo alloy described above.
- a metal working method such as cutting or electric discharge machining
- the main body 1a can be manufactured in a predetermined shape.
- the main body 1a has a through hole 2 from the bottom surface of the recess 1b to the bottom surface of the notch 1c.
- One or a plurality of through holes 2 exist.
- the through hole 2 may be formed such that the opening area on the bottom surface side of the cutout portion 1c is larger than the opening area on the bottom surface side of the recess portion 1b.
- the through-hole 2 is circular, as shown in FIG. 5, the through-hole 2 is a cylinder with a small diameter on the bottom surface side of the recess 1 b and a cylinder with a large diameter opening to the notch 1 c below the through-hole 2.
- It may be a shape that connects Thereby, when inserting and fixing the coaxial connector 3 in the through-hole 2, the level
- the protrusion 7 is provided on the bottom surface of the notch 1c. Further, the ridge 7 extends along an end portion on the side surface where the main body 1a is cut out.
- the protrusion 7 may be made of a material different from that of the main body 1a, or may be a separate member from the main body 1a.
- the protrusion 7 may be integrally formed with the main body 1a using the same metal material as the main body 1a. When integrally forming the protrusion 7 and the main body 1a, the notch 1c and the protrusion 7 can be formed on the lower surface of the base by cutting the lower surface of the base.
- the coaxial connector 3 includes a terminal 3a, a holding member 3b having a hole through which the terminal 3a is inserted, and a sealing material 3c.
- the coaxial connector 3 may have a plurality of terminals 3a.
- the plurality of terminals 3a may be used as signal terminals, and a plurality of high-frequency signals may be input to and output from the electronic device 30.
- the terminal 3a is made of a metal such as an Fe—Ni—Co alloy or an Fe—Ni alloy.
- a metal processing method such as rolling or punching is applied to the ingot (lumb) of the alloy. By these processes, the terminal 3a is manufactured in a linear shape having a length of 1.5 to 22 mm and a diameter of 0.1 to 0.5 mm.
- the diameter of the terminal 3a is smaller than 0.1 mm, the terminal 3a is easily bent, and the terminal 3a is easily bent even with a little carelessness in handling. If the terminal 3a is bent, when it has an air coaxial part, the impedance at this part (which is a characteristic impedance, and the impedance thereafter is also the same) is likely to go wrong. In addition, the workability of connection between the terminal 3a and the external circuit may be deteriorated. If the diameter of the terminal 3a exceeds 0.5 mm, the diameters of the through hole 2 and the insertion hole 5a necessary for impedance matching become unnecessarily large, and it is difficult to reduce the size of the electronic device. Accordingly, the diameter of the terminal 3a is set to 0.1 to 0.5 mm, for example.
- the holding member 3b is made of the same metal material as that of the main body 1a.
- the processing method of this metal material is the same as that of the main body 1a.
- the structure in which the main body 1a further includes a holding member 3b and the holding member 3b is interposed as a part of the main body 1a between the through hole 2 and the sealing material 3c is also the present embodiment. include.
- the holding member 3b is brazed to the inner peripheral surface of the through hole 2 provided in the main body 1a. Further, as shown in FIG.
- the member 3b may be brazed to the inner peripheral surface of the through-hole 2 having a larger diameter that opens to the notch 1c.
- the terminal 3a is inserted through the holding member 3b and fixed to the holding member 3b via a sealing material 3c.
- Sealing material 3c is made of an insulating inorganic material such as glass or ceramics.
- the sealing material 3b ensures insulation between the terminal 3a and the housing 1 or the holding member 3b.
- a sealing material 3c examples include glass such as borosilicate glass and soda glass, and a glass filler added with a ceramic filler for adjusting the thermal expansion coefficient and relative dielectric constant of the sealing material 3c.
- a filler is used by appropriately adjusting the relative dielectric constant thereof for impedance matching.
- the filler that lowers the dielectric constant include lithium oxide.
- the following conditions may be set. That is, when the inner diameter of the through hole 2 is 1.75 mm and the outer diameter of the terminal 3a is 0.2 mm, a material with a relative dielectric constant of 6.8 for the sealing material 3c may be used. Further, when the inner diameter of the through hole 2 is 1.65 mm and the outer diameter of the terminal 3a is 0.25 mm, the sealing material 3c having a relative dielectric constant of 5 may be used.
- the flexible substrate 6 extends out of the notch 1c from the notch 1c toward the ridge 7.
- the flexible substrate 6 has a fixed end 6b joined to the lower end of the terminal 3a via a joining material 8, and a free end 6a opposite to the fixed end.
- the fixed end 6b is the proximal end in the extending direction
- the free end 6a is the distal end in the extending direction.
- the flexible substrate 6 is bent so that the free end portion 6a extends obliquely downward in contact with the protruding portion 7. As a result, the free end 6a is positioned lower than the fixed end 6b.
- the terminal 3 a is inserted into a penetrating portion provided in the flexible substrate 6, and is bonded and fixed by the bonding material 8.
- the flexible substrate 6 is electrically connected to the terminal 3a through the bonding material 8 and is provided around the through portion and the holding member 3b through the conductive member.
- the flexible substrate 6 is arranged such that the surface facing the bottom surface of the cutout portion 1c is in contact with the end surface on the cutout portion 1c side of the holding member 3b and the bottom surface of the cutout portion 1c. And fixed to the coaxial connector 3.
- the flexible substrate 6 is less likely to be displaced with respect to the coaxial connector 3 due to deformation or the like, and can maintain a desired frequency characteristic.
- the flexible substrate 6 may be disposed so that one end in the direction opposite to the free end portion 6 a abuts the side surface of the cutout portion 1 c located on the opposite side to the protruding portion 7, and may be fixed to the coaxial connector 3. The desired frequency characteristics can be maintained with the same effect as described above.
- the fixed end portion 6b has the lever principle. It becomes difficult to generate stress due to. Further, even if a force in the pulling direction is applied, the force applied to the fixed end 6b can be reduced. In addition, the possibility that the flexible substrate 6 is displaced from a desired position can be reduced. That is, even if force is applied to the free end portion 6a, the fixed end portion 6b can be hardly damaged and desired frequency characteristics can be maintained. Therefore, when connecting the flexible substrate 6 and the external circuit board 14, the connection reliability between the electronic component mounting package 20 and the external circuit board 14 can be improved.
- FIG. 6 shows an electronic component mounting package 20A according to the second embodiment of the present invention.
- the through hole 2 has an opening area on the bottom surface side of the cutout portion 1c larger than an opening area on the bottom surface side of the recess portion 1b.
- the coaxial connector 3 includes a holding member 3b having a hole through which the terminal 3a is inserted.
- the holding member 3 b is accommodated in the through hole 2.
- a groove 9 extending along the ridge 7 is formed in a region between the ridge 7 on the bottom surface of the notch 1 c and the coaxial connector 3.
- the groove 9 communicates with the through hole 2. Thereby, possibility that a high frequency resonance will generate
- channel 9 may be a part of cyclic
- FIG. 7 shows an electronic component mounting package 20B according to the third embodiment of the present invention.
- the electronic component mounting package 20 ⁇ / b> B according to the third embodiment of the present invention has a rectangular parallelepiped shape in which the protruding portion 7 has a chamfered portion 10 formed at an inner corner facing the coaxial connector 3.
- the chamfered portion 10 is in contact with the flexible substrate 6. With such a configuration, it is possible to reduce the possibility of breakage of the portion of the flexible substrate 6 that is in contact with the protrusion 7.
- the chamfered portion 10 may have a vertical height smaller than a horizontal width, for example. Thereby, the flexible substrate 6 which bends in contact with the protrusion 7 can be moderately bent. The stress applied to the fixed end portion 6b when the flexible substrate 6 is bent and the stress applied to the portion where the flexible substrate 6 is bent are reduced. Therefore, the possibility that the fixed end portion 6b and the flexible substrate 6 are damaged can be reduced, and the possibility that the flexible substrate 6 is displaced or deformed from a desired position can be reduced. Further, the chamfered portion 10 may have a convex curved shape. Thereby, the area where the chamfered part 10 contacts the flexible substrate 6 can be reduced. Thereby, the possibility that the flexible substrate 6 is damaged can be further reduced.
- FIG. 8 is a cross-sectional view of the electronic device 30 according to the embodiment of the present invention.
- the electronic device 30 covers the electronic component mounting packages 20, 20 ⁇ / b> A, 20 ⁇ / b> B configured as described above, the electronic component 11 accommodated in the recess 1 b of the electronic component mounting packages 20, 20 ⁇ / b> A, 20 ⁇ / b> B, and the electronic component 11. And a lid 13 joined to the electronic component mounting packages 20, 20A, 20B.
- a notch 1c is provided on the lower surface of the main body 1a, and at least a part of the flexible substrate 6 is accommodated in the notch 1c. Therefore, when the flat part on the lower surface of the main body 1a where the notch 1c is not provided and the external circuit board 14 are mounted in contact with each other, the fixing part between the coaxial connector 3 and the flexible board 6 becomes the notch.
- the flexible substrate 6 and the terminal 3a are not interposed between the flat portion where the notch 1c on the lower surface of the main body 1a is not provided and the external circuit board 14. Therefore, the electronic device 30 is not easily tilted and is stably mounted on the external circuit board 14. Therefore, the heat dissipation and the mounting reliability are improved, and the frequency characteristics of the electronic component mounting packages 20, 20A, 20B can be stably maintained.
- the free end 6a which is a part of the flexible substrate 6 provided outside the notch 1c, is lower than the flat part on the lower surface of the housing 1 where the notch 1c is not provided. May be located. This part contacts the external circuit board 14 under a constant pressure during mounting. Therefore, it becomes easy to join the wiring conductor provided on the flexible substrate 6 and the external circuit substrate 14 via the brazing material such as solder. Further, the free end portion 6a, which is a part of the flexible substrate 6 provided outside the notch portion 1c, is located above a flat portion where the notch portion 1c on the lower surface of the housing 1 is not provided. Good.
- the electronic component mounting packages 20, 20 ⁇ / b> A, 20 ⁇ / b> B of the present invention are provided with a gap between the free end portion 6 a and the external circuit board 14. it can. Therefore, when the electronic device 30 is mounted on the external circuit board 14, the free end portion 6a comes into contact with the external circuit board 14, and the electronic device 30 is difficult to tilt. As a result, the electronic component mounting packages 20, 20 ⁇ / b> A, 20 ⁇ / b> B of the present invention can maintain heat dissipation via the lower surface of the housing 1.
- the base 5 and the electronic component 11 are joined to the bottom surface of the recess 1b of the main body 1a.
- a circuit board 4 having a conductor line (not shown) is placed on and bonded to the upper surface of the base 5.
- Circuit board 4 is made of alumina (Al 2 O 3) ceramic or aluminum nitride (AlN) ceramic insulating substrate such as ceramics.
- the circuit board 4 functions as an impedance matching board.
- the alumina ceramic insulating substrate or the like may be simply referred to as an insulating substrate.
- a conductor line is arranged on the circuit board 4.
- the conductor line is, for example, a microstrip line having an impedance of 50 ⁇ . This impedance is the same as the impedance of the terminal 3a, for example.
- the end of the microstrip line opposite to the terminal 3 a is connected to the electronic component 11 via the bonding wire 12.
- the end of the microstrip line on the terminal 3a side is joined to the upper end of the terminal 3a via a joining material 8. Thereby, the terminal 3a and the electronic component 11 are electrically connected.
- ground conductor (not shown) is formed on the lower surface of the circuit board 4 and the like.
- the ground potential (ground potential) is supplied from the ground wiring conductor of the flexible substrate 6 to the ground conductor via the housing 1 and the base 5.
- the ground conductor is joined to the base 5 via a brazing material or the like, and is electrically connected to the ground wiring conductor of the flexible substrate 6.
- the ground conductor 5c is formed on the lower surface of the insulating substrate having a relative dielectric constant of 9.5 and having a dielectric constant of 9.5, and the thickness is 0.3 mm.
- the thickness may be 4 ⁇ m.
- the conductor line may have a thickness of 4 ⁇ m and a width of 0.5 mm.
- the circuit board 4 is made of, for example, an alumina sintered body (alumina ceramics), it can be manufactured by the following method. First, a ceramic green sheet is formed by molding a slurry obtained by adding and mixing a suitable organic binder, plasticizer, and solvent to raw material powders such as aluminum oxide, magnesium oxide, and calcium oxide by the doctor blade method or the calender roll method. (Ceramic raw sheet) is formed. Next, the ceramic green sheet is appropriately punched to have a predetermined shape. A plurality of the processed ceramic green sheets are laminated as necessary to form a molded body. Thereafter, the compact is fired at a temperature of about 1600 ° C. The circuit board 4 is manufactured by the above process. The fired insulating substrate has a thickness of about 0.2 to 0.3 mm. In order to match the impedance of the conductor line to 50 ⁇ , for example, the insulating substrate is made thin.
- the base 5 is provided with an insertion hole 5a.
- the terminal 3a is inserted through the insertion hole 5a to form an air coaxial structure. This makes it difficult for impedance mismatching to occur at the portion where the terminal 3 a protrudes from the bottom surface of the recess 1 b of the housing 1. Therefore, it is possible to transmit a high frequency signal satisfactorily.
- the insertion hole 5a communicates with the through hole 2 and has a diameter of 0.23 to 1.15 mm, for example.
- the diameter of the insertion hole 5a through which the terminal 3a passes is dimensioned so that an air coaxial with a characteristic impedance of 50 ⁇ is formed by the terminal 3a passing through the center. For example, if the diameter of the terminal 3a is 0.2 mm, the diameter of the insertion hole 5a may be 0.46 mm.
- the base 5 is joined to the bottom surface of the recess 1b of the housing 1 via a low melting point brazing material such as Au—Sn alloy.
- the circuit board 4 is placed on the upper surface of the base 5.
- the circuit board 4 is bonded to the base 5 via a low melting point brazing material such as an Au—Sn alloy.
- the base 5 is made of a metal such as Fe—Ni alloy having a thermal expansion coefficient intermediate between the thermal expansion coefficient of the housing 1 and the thermal expansion coefficient of the circuit board 4.
- the base 5 functions as a buffer material for preventing a large stress from being applied to the circuit board 4 placed on the upper surface due to a temperature change and cracking. That is, the base 5 functions as a relay base 5.
- the base 5 is placed directly on the housing 1 that matches the thermal expansion coefficient of the LN element, the difference between the thermal expansion coefficient of the main body 1a and the thermal expansion coefficient of the circuit board 4 is large. Cracks may occur in the circuit board 4 due to the difference in thermal expansion coefficient.
- the base 5 is placed on the bottom surface of the recess 1b of the main body 1a, and the circuit board 4 is placed on the top surface of the base 5.
- the base 5 is, for example, It is made of a metal material of Fe-50Ni alloy (thermal expansion coefficient 9.9 ⁇ 10 ⁇ 6 / ° C.) having an intermediate thermal expansion coefficient between the main body 1a and the circuit board 4. In this case, the stress applied to the circuit board 4 is relieved by the base 5. Therefore, the possibility that the circuit board 4 will break is reduced.
- the base 5 can be formed by subjecting the material ingot to a metal processing method such as rolling or punching.
- the thickness of the base 5 is 1 to 2 mm, the possibility of generating cracks or the like in the circuit board 4 can be reduced.
- the thickness of the base 5 is 1 mm or more, the stress generated by the difference in the thermal expansion coefficient between the main body 1a and the circuit board 4 can be effectively reduced.
- the thickness of the base 5 is 2 mm or less, the height of the electronic device can be effectively reduced, and the device can be thinned.
- the thickness of the base 5 may be 1.7 to 2 mm.
- the conductor lines and ground conductors (not shown) of the circuit board 4 are metal materials selected from metal materials such as tungsten, molybdenum, manganese, copper, silver, palladium, platinum, and gold.
- the conductor line and the ground conductor are made of tungsten, for example, they are formed as follows. First, an organic solvent and a binder are added and kneaded to tungsten powder to prepare a metal paste. Next, this metal paste is printed on a ceramic green sheet serving as an insulating substrate using a screen printing method so as to form a predetermined wiring pattern.
- the conductor line and the ground conductor can be formed by a method including the above steps.
- Conductor lines and ground conductors can also be fabricated by thin film processing.
- the conductor line and the ground conductor can be formed in a highly accurate pattern when manufactured by thin film processing.
- the conductor line and ground conductor by thin film processing are composed of a conductor layer having a three-layer structure in which an adhesion metal layer, a diffusion prevention layer, and a main conductor layer are sequentially laminated.
- each layer (adhesion metal layer, diffusion prevention layer, and main conductor layer) was sequentially laminated on the insulating substrate after firing by a thin film forming method such as vapor deposition, sputtering, or ion plating.
- a conductor layer having a three-layer structure) is formed.
- a resist film is formed, and a conductor line and a ground conductor are formed by thin film processing such as photolithography and etching.
- the entire side surface of the base 5 may be in contact with the side wall of the recess 1 b of the housing 1. In this case, a space is not formed between the side surface of the base 5 and the inner surface of the housing 1 and is in contact. Therefore, resonance does not occur in the first place, and it is unlikely that noise due to resonance is added to the high-frequency signal transmitted through the conductor line. And it becomes possible to transmit a high frequency signal satisfactorily.
- the side surface of the base 5 may be brought into contact with the side wall of the recess 1b.
- the corner formed by the side wall and the bottom surface of the recess 1b is not a right angle, the entire side surface of the base 5 is covered. It is difficult to contact the side wall of the recess 1b. In this case, a space is generated between the side surface of the base 5 and the side wall of the recess 1b. Then, resonance may occur in the space. Noise due to resonance may be added to the high-frequency signal in the conductor line, making it difficult to transmit the high-frequency signal satisfactorily.
- a notch or a chamfer may be formed in the lower corner of the base 5.
- the side surface of the base 5 can be easily brought into contact with the side wall of the recess 1b.
- the possibility of occurrence of resonance between the side surface of the base 5 and the side wall of the recess 1b is reduced, and a high-frequency signal can be transmitted satisfactorily.
- the width of the space is 50 ⁇ m or more and 0.1 mm or less. That is, the resonance intensity decreases in inverse proportion to the square of the width of the space. Therefore, when the width of the space, that is, the distance between the side surface of the base 5 and the side wall of the recess 1b is 50 ⁇ m or more, resonance hardly occurs. Noise due to resonance is also reduced, and a high-frequency signal transmitted through the conductor line is improved. Therefore, if the width of the space is 50 ⁇ m or more, high-frequency signal transmission can be improved. Also, the greater the space width, the weaker the resonance. Therefore, in terms of electrical characteristics, the larger the width of the space, the more effective. However, considering the miniaturization of the electronic device, the width of the space is set to 0.1 mm or less.
- the lid 13 is joined to the outer periphery of the upper surface of the housing 1 by a soldering method or a seam welding method.
- the lid 13 hermetically seals the electronic component 11 in the electronic component mounting packages 20, 20A, 20B.
- the material of the lid 13 is, for example, a metal material such as an Fe—Ni—Co alloy, or a ceramic such as alumina ceramic.
- the lid 13 is joined to the outer periphery of the upper surface of the housing 1 via a low melting point brazing material such as an Au—Sn alloy, or by welding such as seam welding.
- the electronic component 11 is sealed in the electronic component mounting packages 20, 20A, 20B.
- the upper ends of the terminals 3 a are connected to the conductor lines of the circuit board 4 by a brazing material.
- the center of the insertion hole 5a is inserted coaxially with the air so that the terminal 3a has a high frequency impedance of 50 ⁇ , for example. Moreover, it fixes to the center of the through-hole 2 of the main-body part 1a so that it may become a 50 ohm high frequency impedance.
- the lower end of the terminal 3a is connected to the wiring conductor of the flexible substrate 6 with a brazing material.
- the ground wiring conductor of the flexible substrate 6 is arranged on both sides of the wiring conductor so as to sandwich the wiring conductor.
- Each ground wiring conductor is connected to the lower surface of the main body 1a with a brazing material.
- the wiring conductor and the ground wiring conductor constitute a coplanar line. This coplanar line is formed to have an impedance of 50 ⁇ even outside the housing 1.
- the present invention is not limited to the above-described embodiments and examples, and various modifications can be made without departing from the scope of the present invention.
- the LN element is described as the electronic component 11, but the present invention is not limited to this, and the electronic component 11 such as a high-frequency semiconductor element may be used.
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
1a・・・・・・本体部
1b・・・・・・凹部
1c・・・・・・切り欠き部
2・・・・・・・貫通孔
3・・・・・・・同軸コネクタ
3a・・・・・・端子
3b・・・・・・保持部材
3c・・・・・・封止材
4・・・・・・・回路基板
5・・・・・・・基台
5a・・・・・・挿通孔
6・・・・・・・フレキシブル基板
6a・・・・・・遊端部
6b・・・・・・固定端部
7・・・・・・・突条部
7a・・・・・・面取り部
8・・・・・・・接合材
9・・・・・・・溝
10・・・・・・面取り部
11・・・・・・電子部品
12・・・・・・ボンディングワイヤ
13・・・・・・蓋体
20・・・・・・電子部品搭載用パッケージ
30・・・・・・電子装置
Claims (4)
- 電子部品が収容される凹部を有する上面、および切り欠き部を有する下面を有し、前記凹部の底面から前記切り欠き部の底面にかけて貫通孔がある本体部と、前記切り欠き部の前記底面に位置し、前記本体部の切り欠かれた側面側の端部に沿って延在する突条部とを含む筐体と、
前記切り欠き部に設けられた同軸コネクタであって、前記貫通孔を通って前記凹部内に突出する上端と前記切り欠き部内に突出する下端とを有する端子を含む同軸コネクタと、
前記切り欠き部内から前記切り欠き部外に延在するフレキシブル基板であって、前記端子の前記下端に接合された固定端部と、該第固定端部と反対側の遊端部とを有しているとともに、前記突条部に当接してたわんでいるフレキシブル基板と
を備える電子部品搭載用パッケージ。 - 前記貫通孔は、前記切り欠き部の前記底面側の開口面積が、前記凹部の前記底面側の開口面積よりも大きく、
前記同軸コネクタは、前記端子が挿通される孔を有する保持部材を有し、該保持部材は、前記貫通孔に収容されており、
前記突条部に沿って延びる溝が、前記切り欠き部の底面の前記突条部と前記同軸コネクタとの間の領域にあり、前記溝は、前記貫通孔に連通している請求項1に記載の電子部品搭載用パッケージ。 - 前記突条部は、前記同軸コネクタに臨む内側の角部に面取り部を有する直方体形状であり、前記面取り部が前記フレキシブル基板に当接している請求項1または2に記載の電子部品搭載用パッケージ。
- 請求項1~3のいずれか1項に記載の電子部品搭載用パッケージと、
前記電子部品搭載用パッケージの前記凹部に収容された電子部品と、
前記電子部品を覆うように前記電子部品搭載用パッケージに接合された蓋体とを備える電子装置。
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JP2017552680A JP6470428B2 (ja) | 2015-11-27 | 2016-11-24 | 電子部品搭載用パッケージおよび電子装置 |
CN201680047050.2A CN107924880B (zh) | 2015-11-27 | 2016-11-24 | 电子部件搭载用封装体以及电子装置 |
US15/754,670 US10136517B2 (en) | 2015-11-27 | 2016-11-24 | Electronic component mounting package and electronic device |
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US (1) | US10136517B2 (ja) |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019041045A (ja) * | 2017-08-28 | 2019-03-14 | 京セラ株式会社 | 電子部品収納用パッケージおよび電子装置 |
JP2020096039A (ja) * | 2018-12-11 | 2020-06-18 | 新光電気工業株式会社 | ステム |
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---|---|---|---|---|
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WO2020138209A1 (ja) * | 2018-12-26 | 2020-07-02 | 京セラ株式会社 | 配線基体、電子部品収納用パッケージおよび電子装置 |
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WO2021055584A1 (en) | 2019-09-19 | 2021-03-25 | Amphenol Corporation | High speed electronic system with midboard cable connector |
CN113258325A (zh) * | 2020-01-28 | 2021-08-13 | 富加宜(美国)有限责任公司 | 高频中板连接器 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014165289A (ja) * | 2013-02-23 | 2014-09-08 | Kyocera Corp | 電子部品搭載用パッケージおよびそれを用いた電子装置 |
JP2014179432A (ja) * | 2013-03-14 | 2014-09-25 | Kyocera Corp | 電子部品搭載用パッケージおよびそれを用いた電子装置 |
JP2014195061A (ja) * | 2013-02-27 | 2014-10-09 | Kyocera Corp | 電子部品搭載用パッケージおよびそれを用いた電子装置 |
JP2015172682A (ja) * | 2014-03-12 | 2015-10-01 | 富士通オプティカルコンポーネンツ株式会社 | 光モジュール |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW311267B (ja) * | 1994-04-11 | 1997-07-21 | Raychem Ltd | |
IL113065A (en) * | 1994-04-11 | 2000-06-01 | Raychem Corp | Sealed electronic packaging and a method for environmental protection of active electronics |
TW518806B (en) * | 2001-01-12 | 2003-01-21 | Northrop Grumman Corp | High speed, high density interconnect system for differential and single-ended transmission applications |
US6843657B2 (en) * | 2001-01-12 | 2005-01-18 | Litton Systems Inc. | High speed, high density interconnect system for differential and single-ended transmission applications |
KR20060080756A (ko) * | 2005-01-06 | 2006-07-11 | 삼성전자주식회사 | 신호전송필름, 이를 갖는 표시장치 및 이의 제조 방법 |
JP5682182B2 (ja) | 2010-08-30 | 2015-03-11 | 富士通オプティカルコンポーネンツ株式会社 | 光変調器モジュール |
US8836587B2 (en) * | 2012-03-30 | 2014-09-16 | Apple Inc. | Antenna having flexible feed structure with components |
JP6430160B2 (ja) * | 2014-07-07 | 2018-11-28 | 日本オクラロ株式会社 | 光モジュール及び光モジュールの製造方法 |
JP5949858B2 (ja) * | 2014-08-29 | 2016-07-13 | 住友大阪セメント株式会社 | 光変調器、及び光スイッチ |
JP6203802B2 (ja) | 2015-09-30 | 2017-09-27 | 住友大阪セメント株式会社 | 光変調器 |
-
2016
- 2016-11-24 WO PCT/JP2016/084731 patent/WO2017090651A1/ja active Application Filing
- 2016-11-24 US US15/754,670 patent/US10136517B2/en active Active
- 2016-11-24 JP JP2017552680A patent/JP6470428B2/ja active Active
- 2016-11-24 CN CN201680047050.2A patent/CN107924880B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014165289A (ja) * | 2013-02-23 | 2014-09-08 | Kyocera Corp | 電子部品搭載用パッケージおよびそれを用いた電子装置 |
JP2014195061A (ja) * | 2013-02-27 | 2014-10-09 | Kyocera Corp | 電子部品搭載用パッケージおよびそれを用いた電子装置 |
JP2014179432A (ja) * | 2013-03-14 | 2014-09-25 | Kyocera Corp | 電子部品搭載用パッケージおよびそれを用いた電子装置 |
JP2015172682A (ja) * | 2014-03-12 | 2015-10-01 | 富士通オプティカルコンポーネンツ株式会社 | 光モジュール |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019041045A (ja) * | 2017-08-28 | 2019-03-14 | 京セラ株式会社 | 電子部品収納用パッケージおよび電子装置 |
JP2020096039A (ja) * | 2018-12-11 | 2020-06-18 | 新光電気工業株式会社 | ステム |
JP7240160B2 (ja) | 2018-12-11 | 2023-03-15 | 新光電気工業株式会社 | ステム |
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