JP4768185B2 - 静電チャック、サセプタおよびその製造方法 - Google Patents

静電チャック、サセプタおよびその製造方法 Download PDF

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Publication number
JP4768185B2
JP4768185B2 JP2001543772A JP2001543772A JP4768185B2 JP 4768185 B2 JP4768185 B2 JP 4768185B2 JP 2001543772 A JP2001543772 A JP 2001543772A JP 2001543772 A JP2001543772 A JP 2001543772A JP 4768185 B2 JP4768185 B2 JP 4768185B2
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Japan
Prior art keywords
metal
electrode
terminal
precursor
electrostatic chuck
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2001543772A
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Japanese (ja)
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JP2003517730A (ja
JP2003517730A5 (enExample
Inventor
ディバカー，ラメシュ
ザンディ，モーテザ
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Saint Gobain Ceramics and Plastics Inc
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Saint Gobain Ceramics and Plastics Inc
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Publication of JP2003517730A5 publication Critical patent/JP2003517730A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Ceramic Products (AREA)
  • Resistance Heating (AREA)
JP2001543772A 1999-12-09 2000-12-05 静電チャック、サセプタおよびその製造方法 Expired - Lifetime JP4768185B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/457,968 US6603650B1 (en) 1999-12-09 1999-12-09 Electrostatic chuck susceptor and method for fabrication
US09/457,968 1999-12-09
PCT/US2000/042553 WO2001043183A2 (en) 1999-12-09 2000-12-05 Electrostatic chuck, susceptor and method for fabrication

Publications (3)

Publication Number Publication Date
JP2003517730A JP2003517730A (ja) 2003-05-27
JP2003517730A5 JP2003517730A5 (enExample) 2008-01-31
JP4768185B2 true JP4768185B2 (ja) 2011-09-07

Family

ID=23818807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001543772A Expired - Lifetime JP4768185B2 (ja) 1999-12-09 2000-12-05 静電チャック、サセプタおよびその製造方法

Country Status (8)

Country Link
US (1) US6603650B1 (enExample)
JP (1) JP4768185B2 (enExample)
KR (1) KR100459748B1 (enExample)
CN (1) CN1275309C (enExample)
AU (1) AU4516001A (enExample)
DE (1) DE10085266B4 (enExample)
GB (1) GB2375889B (enExample)
WO (1) WO2001043183A2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6744618B2 (en) * 1999-12-09 2004-06-01 Saint-Gobain Ceramics & Plastics, Inc. Electrostatic chucks with flat film electrode
CN1655022A (zh) * 2004-02-14 2005-08-17 鸿富锦精密工业（深圳）有限公司 基板贴合装置
TWI350394B (en) * 2004-04-16 2011-10-11 Chimei Innolux Corp Apparatus and method for connecting two substrates
JP4542485B2 (ja) 2004-12-14 2010-09-15 日本碍子株式会社 アルミナ部材及びその製造方法
JP2007258610A (ja) 2006-03-24 2007-10-04 Ngk Insulators Ltd アルミナ焼成体
JP5094863B2 (ja) * 2007-07-23 2012-12-12 株式会社クリエイティブ テクノロジー 基板吸着装置及びその製造方法
JP4469006B2 (ja) * 2007-09-25 2010-05-26 キヤノンアネルバ株式会社 表示用基板の製造方法
TWI450353B (zh) * 2008-01-08 2014-08-21 Ngk Insulators Ltd A bonding structure and a semiconductor manufacturing apparatus
DE102008035240B4 (de) * 2008-07-29 2017-07-06 Ivoclar Vivadent Ag Vorrichtung zur Erwärmung von Formteilen, insbesondere dentalkeramischen Formteilen
KR102382823B1 (ko) 2015-09-04 2022-04-06 삼성전자주식회사 에어 홀을 갖는 링 부재 및 그를 포함하는 기판 처리 장치
WO2020086122A1 (en) * 2018-10-24 2020-04-30 Applied Materials, Inc. Substrate support designs for a deposition chamber

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Publication number Priority date Publication date Assignee Title
JPS6278170A (ja) * 1985-10-02 1987-04-10 三菱重工業株式会社 ＳｉＣ又はＳｉ↓３Ｎ↓４と金属との接合体
JPH02163338A (ja) * 1988-12-19 1990-06-22 Toshiba Corp 耐熱性モリブデン
JPH10326823A (ja) * 1997-04-01 1998-12-08 Applied Materials Inc セラミック体のための導電性フィードスルー及びその製造方法
JPH11502062A (ja) * 1995-03-10 1999-02-16 ラム リサーチ コーポレイション 多層型の静電チャック及びその製造方法
JPH11317199A (ja) * 1998-03-05 1999-11-16 Ushio Inc 管球用電気導入体およびその製造方法

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JPS5944797A (ja) 1982-09-07 1984-03-13 増田　閃一 物体の静電的処理装置
DE3608326A1 (de) 1986-03-13 1987-09-17 Kempten Elektroschmelz Gmbh Praktisch porenfreie formkoerper aus polykristallinem aluminiumnitrid und verfahren zu ihrer herstellung ohne mitverwendung von sinterhilfsmitteln
US4778778A (en) 1987-06-03 1988-10-18 Keramont Advanced Ceramic Products Corporation Process for the production of sintered aluminum nitrides
JP2665242B2 (ja) 1988-09-19 1997-10-22 東陶機器株式会社 静電チャック
JPH0617214B2 (ja) 1989-12-29 1994-03-09 ナショナル サイエンス カウンシル 超微粒子な窒化アルミニウム粉末の製造方法
EP0493089B1 (en) 1990-12-25 1998-09-16 Ngk Insulators, Ltd. Wafer heating apparatus and method for producing the same
EP1120817B8 (en) 1991-03-26 2007-10-10 Ngk Insulators, Ltd. Use of a corrosion-resistant member
EP0506537A1 (en) 1991-03-28 1992-09-30 Shin-Etsu Chemical Co., Ltd. Electrostatic chuck
JPH06737A (ja) 1991-03-29 1994-01-11 Shin Etsu Chem Co Ltd 静電チャック基板
JPH0659008A (ja) 1992-08-06 1994-03-04 Sumitomo Electric Ind Ltd 物性測定装置およびその測定方法
US5800618A (en) 1992-11-12 1998-09-01 Ngk Insulators, Ltd. Plasma-generating electrode device, an electrode-embedded article, and a method of manufacturing thereof
US5413360A (en) 1992-12-01 1995-05-09 Kyocera Corporation Electrostatic chuck
US5320990A (en) 1993-03-30 1994-06-14 The Dow Chemical Company Process for sintering aluminum nitride to a high thermal conductivity and resultant sintered bodies
JPH06326175A (ja) 1993-04-22 1994-11-25 Applied Materials Inc 集積回路処理装置において使用されるウエハサポートの誘電材への保護被覆とその形成方法
EP0635870A1 (en) 1993-07-20 1995-01-25 Applied Materials, Inc. An electrostatic chuck having a grooved surface
DE69429243T2 (de) 1993-11-18 2002-06-27 Ngk Insulators, Ltd. Elektrode zur herstellung von plasma und verfahren zur herstellung der elektrode
US5541145A (en) 1993-12-22 1996-07-30 The Carborundum Company/Ibm Corporation Low temperature sintering route for aluminum nitride ceramics
JPH08507196A (ja) 1994-01-31 1996-07-30 アプライド マテリアルズ インコーポレイテッド 共形な絶縁体フィルムを有する静電チャック
US5834374A (en) * 1994-09-30 1998-11-10 International Business Machines Corporation Method for controlling tensile and compressive stresses and mechanical problems in thin films on substrates
US5677253A (en) 1995-03-30 1997-10-14 Kyocera Corporation Wafer holding member
US5886863A (en) 1995-05-09 1999-03-23 Kyocera Corporation Wafer support member
US5817406A (en) 1995-07-14 1998-10-06 Applied Materials, Inc. Ceramic susceptor with embedded metal electrode and brazing material connection
US5633073A (en) * 1995-07-14 1997-05-27 Applied Materials, Inc. Ceramic susceptor with embedded metal electrode and eutectic connection
DE69610673T2 (de) 1995-08-03 2001-05-10 Ngk Insulators, Ltd. Gesinterte Aluminiumnitridkörper und ihr Herstellungsverfahren
JP3457477B2 (ja) 1995-09-06 2003-10-20 日本碍子株式会社 静電チャック
JP3670416B2 (ja) 1995-11-01 2005-07-13 日本碍子株式会社 金属包含材および静電チャック
US6017485A (en) 1996-03-28 2000-01-25 Carborundum Corporation Process for making a low electrical resistivity, high purity aluminum nitride electrostatic chuck
US5764471A (en) 1996-05-08 1998-06-09 Applied Materials, Inc. Method and apparatus for balancing an electrostatic force produced by an electrostatic chuck
US5708557A (en) 1996-08-22 1998-01-13 Packard Hughes Interconnect Company Puncture-resistant electrostatic chuck with flat surface and method of making the same
US5958813A (en) 1996-11-26 1999-09-28 Kyocera Corporation Semi-insulating aluminum nitride sintered body
US5705450A (en) 1996-12-17 1998-01-06 The Dow Chemical Company A1N sintered body containing a rare earth aluminum oxynitride and method to produce said body
JP3790000B2 (ja) 1997-01-27 2006-06-28 日本碍子株式会社 セラミックス部材と電力供給用コネクターとの接合構造
JP3954177B2 (ja) 1997-01-29 2007-08-08 日本碍子株式会社 金属部材とセラミックス部材との接合構造およびその製造方法
US6303879B1 (en) 1997-04-01 2001-10-16 Applied Materials, Inc. Laminated ceramic with multilayer electrodes and method of fabrication
JP3670444B2 (ja) 1997-06-06 2005-07-13 日本碍子株式会社 窒化アルミニウム基複合体、電子機能材料、静電チャックおよび窒化アルミニウム基複合体の製造方法
JP3746594B2 (ja) 1997-06-20 2006-02-15 日本碍子株式会社 セラミックスの接合構造およびその製造方法
US5909355A (en) 1997-12-02 1999-06-01 Applied Materials, Inc. Ceramic electrostatic chuck and method of fabricating same
US6744618B2 (en) * 1999-12-09 2004-06-01 Saint-Gobain Ceramics & Plastics, Inc. Electrostatic chucks with flat film electrode
US6723274B1 (en) * 1999-12-09 2004-04-20 Saint-Gobain Ceramics & Plastics, Inc. High-purity low-resistivity electrostatic chucks

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6278170A (ja) * 1985-10-02 1987-04-10 三菱重工業株式会社 ＳｉＣ又はＳｉ↓３Ｎ↓４と金属との接合体
JPH02163338A (ja) * 1988-12-19 1990-06-22 Toshiba Corp 耐熱性モリブデン
JPH11502062A (ja) * 1995-03-10 1999-02-16 ラム リサーチ コーポレイション 多層型の静電チャック及びその製造方法
JPH10326823A (ja) * 1997-04-01 1998-12-08 Applied Materials Inc セラミック体のための導電性フィードスルー及びその製造方法
JPH11317199A (ja) * 1998-03-05 1999-11-16 Ushio Inc 管球用電気導入体およびその製造方法

Also Published As

Publication number Publication date
DE10085266T1 (de) 2002-12-12
WO2001043183A9 (en) 2002-11-28
KR20020059440A (ko) 2002-07-12
WO2001043183A2 (en) 2001-06-14
JP2003517730A (ja) 2003-05-27
GB2375889B (en) 2004-03-10
AU4516001A (en) 2001-06-18
GB2375889A (en) 2002-11-27
KR100459748B1 (ko) 2004-12-03
CN1275309C (zh) 2006-09-13
DE10085266B4 (de) 2011-08-11
US6603650B1 (en) 2003-08-05
WO2001043183A3 (en) 2002-05-10
GB0215883D0 (en) 2002-08-14
CN1409870A (zh) 2003-04-09

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