GB2375889B - Electrostatic chuck, susceptor and method for fabrication - Google Patents

Electrostatic chuck, susceptor and method for fabrication

Info

Publication number
GB2375889B
GB2375889B GB0215883A GB0215883A GB2375889B GB 2375889 B GB2375889 B GB 2375889B GB 0215883 A GB0215883 A GB 0215883A GB 0215883 A GB0215883 A GB 0215883A GB 2375889 B GB2375889 B GB 2375889B
Authority
GB
United Kingdom
Prior art keywords
susceptor
fabrication
electrostatic chuck
chuck
electrostatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB0215883A
Other languages
English (en)
Other versions
GB2375889A (en
GB0215883D0 (en
Inventor
Ramesh Divakar
Morteza Zandi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Ceramics and Plastics Inc
Original Assignee
Saint Gobain Ceramics and Plastics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Ceramics and Plastics Inc filed Critical Saint Gobain Ceramics and Plastics Inc
Publication of GB0215883D0 publication Critical patent/GB0215883D0/en
Publication of GB2375889A publication Critical patent/GB2375889A/en
Application granted granted Critical
Publication of GB2375889B publication Critical patent/GB2375889B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Ceramic Products (AREA)
  • Resistance Heating (AREA)
GB0215883A 1999-12-09 2000-12-05 Electrostatic chuck, susceptor and method for fabrication Expired - Lifetime GB2375889B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/457,968 US6603650B1 (en) 1999-12-09 1999-12-09 Electrostatic chuck susceptor and method for fabrication
PCT/US2000/042553 WO2001043183A2 (en) 1999-12-09 2000-12-05 Electrostatic chuck, susceptor and method for fabrication

Publications (3)

Publication Number Publication Date
GB0215883D0 GB0215883D0 (en) 2002-08-14
GB2375889A GB2375889A (en) 2002-11-27
GB2375889B true GB2375889B (en) 2004-03-10

Family

ID=23818807

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0215883A Expired - Lifetime GB2375889B (en) 1999-12-09 2000-12-05 Electrostatic chuck, susceptor and method for fabrication

Country Status (8)

Country Link
US (1) US6603650B1 (enExample)
JP (1) JP4768185B2 (enExample)
KR (1) KR100459748B1 (enExample)
CN (1) CN1275309C (enExample)
AU (1) AU4516001A (enExample)
DE (1) DE10085266B4 (enExample)
GB (1) GB2375889B (enExample)
WO (1) WO2001043183A2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6744618B2 (en) * 1999-12-09 2004-06-01 Saint-Gobain Ceramics & Plastics, Inc. Electrostatic chucks with flat film electrode
CN1655022A (zh) * 2004-02-14 2005-08-17 鸿富锦精密工业（深圳）有限公司 基板贴合装置
TWI350394B (en) * 2004-04-16 2011-10-11 Chimei Innolux Corp Apparatus and method for connecting two substrates
JP4542485B2 (ja) 2004-12-14 2010-09-15 日本碍子株式会社 アルミナ部材及びその製造方法
JP2007258610A (ja) 2006-03-24 2007-10-04 Ngk Insulators Ltd アルミナ焼成体
JP5094863B2 (ja) * 2007-07-23 2012-12-12 株式会社クリエイティブ テクノロジー 基板吸着装置及びその製造方法
JP4469006B2 (ja) * 2007-09-25 2010-05-26 キヤノンアネルバ株式会社 表示用基板の製造方法
TWI450353B (zh) * 2008-01-08 2014-08-21 Ngk Insulators Ltd A bonding structure and a semiconductor manufacturing apparatus
DE102008035240B4 (de) * 2008-07-29 2017-07-06 Ivoclar Vivadent Ag Vorrichtung zur Erwärmung von Formteilen, insbesondere dentalkeramischen Formteilen
KR102382823B1 (ko) 2015-09-04 2022-04-06 삼성전자주식회사 에어 홀을 갖는 링 부재 및 그를 포함하는 기판 처리 장치
WO2020086122A1 (en) * 2018-10-24 2020-04-30 Applied Materials, Inc. Substrate support designs for a deposition chamber

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Publication number Priority date Publication date Assignee Title
EP0506537A1 (en) * 1991-03-28 1992-09-30 Shin-Etsu Chemical Co., Ltd. Electrostatic chuck
EP0360529B1 (en) * 1988-09-19 1997-06-04 Toto Ltd. Electrostatic chuck
EP0791956A2 (en) * 1995-09-06 1997-08-27 Ngk Insulators, Ltd. Electrostatic chuck
EP0856881A2 (en) * 1997-01-29 1998-08-05 Ngk Insulators, Ltd. Joint structure of metal member and ceramic member and method of producing the same
EP0886312A2 (en) * 1997-06-20 1998-12-23 Ngk Insulators, Ltd. Ceramics joint structure and method of producing the same
US5880922A (en) * 1995-03-10 1999-03-09 Lam Research Corporation Multilayered electrostatic chuck and method of manufacture thereof
EP1030364A2 (en) * 1999-02-17 2000-08-23 Applied Materials, Inc. Laminated ceramic with multilayer electrodes and method of fabrication

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JPS5944797A (ja) 1982-09-07 1984-03-13 増田　閃一 物体の静電的処理装置
JPS6278170A (ja) * 1985-10-02 1987-04-10 三菱重工業株式会社 ＳｉＣ又はＳｉ↓３Ｎ↓４と金属との接合体
DE3608326A1 (de) 1986-03-13 1987-09-17 Kempten Elektroschmelz Gmbh Praktisch porenfreie formkoerper aus polykristallinem aluminiumnitrid und verfahren zu ihrer herstellung ohne mitverwendung von sinterhilfsmitteln
US4778778A (en) 1987-06-03 1988-10-18 Keramont Advanced Ceramic Products Corporation Process for the production of sintered aluminum nitrides
JP3016514B2 (ja) * 1988-12-19 2000-03-06 株式会社東芝 耐熱性モリブデン線
JPH0617214B2 (ja) 1989-12-29 1994-03-09 ナショナル サイエンス カウンシル 超微粒子な窒化アルミニウム粉末の製造方法
EP0493089B1 (en) 1990-12-25 1998-09-16 Ngk Insulators, Ltd. Wafer heating apparatus and method for producing the same
EP1120817B8 (en) 1991-03-26 2007-10-10 Ngk Insulators, Ltd. Use of a corrosion-resistant member
JPH06737A (ja) 1991-03-29 1994-01-11 Shin Etsu Chem Co Ltd 静電チャック基板
JPH0659008A (ja) 1992-08-06 1994-03-04 Sumitomo Electric Ind Ltd 物性測定装置およびその測定方法
US5800618A (en) 1992-11-12 1998-09-01 Ngk Insulators, Ltd. Plasma-generating electrode device, an electrode-embedded article, and a method of manufacturing thereof
US5413360A (en) 1992-12-01 1995-05-09 Kyocera Corporation Electrostatic chuck
US5320990A (en) 1993-03-30 1994-06-14 The Dow Chemical Company Process for sintering aluminum nitride to a high thermal conductivity and resultant sintered bodies
JPH06326175A (ja) 1993-04-22 1994-11-25 Applied Materials Inc 集積回路処理装置において使用されるウエハサポートの誘電材への保護被覆とその形成方法
EP0635870A1 (en) 1993-07-20 1995-01-25 Applied Materials, Inc. An electrostatic chuck having a grooved surface
DE69429243T2 (de) 1993-11-18 2002-06-27 Ngk Insulators, Ltd. Elektrode zur herstellung von plasma und verfahren zur herstellung der elektrode
US5541145A (en) 1993-12-22 1996-07-30 The Carborundum Company/Ibm Corporation Low temperature sintering route for aluminum nitride ceramics
JPH08507196A (ja) 1994-01-31 1996-07-30 アプライド マテリアルズ インコーポレイテッド 共形な絶縁体フィルムを有する静電チャック
US5834374A (en) * 1994-09-30 1998-11-10 International Business Machines Corporation Method for controlling tensile and compressive stresses and mechanical problems in thin films on substrates
US5677253A (en) 1995-03-30 1997-10-14 Kyocera Corporation Wafer holding member
US5886863A (en) 1995-05-09 1999-03-23 Kyocera Corporation Wafer support member
US5817406A (en) 1995-07-14 1998-10-06 Applied Materials, Inc. Ceramic susceptor with embedded metal electrode and brazing material connection
US5633073A (en) * 1995-07-14 1997-05-27 Applied Materials, Inc. Ceramic susceptor with embedded metal electrode and eutectic connection
DE69610673T2 (de) 1995-08-03 2001-05-10 Ngk Insulators, Ltd. Gesinterte Aluminiumnitridkörper und ihr Herstellungsverfahren
JP3670416B2 (ja) 1995-11-01 2005-07-13 日本碍子株式会社 金属包含材および静電チャック
US6017485A (en) 1996-03-28 2000-01-25 Carborundum Corporation Process for making a low electrical resistivity, high purity aluminum nitride electrostatic chuck
US5764471A (en) 1996-05-08 1998-06-09 Applied Materials, Inc. Method and apparatus for balancing an electrostatic force produced by an electrostatic chuck
US5708557A (en) 1996-08-22 1998-01-13 Packard Hughes Interconnect Company Puncture-resistant electrostatic chuck with flat surface and method of making the same
US5958813A (en) 1996-11-26 1999-09-28 Kyocera Corporation Semi-insulating aluminum nitride sintered body
US5705450A (en) 1996-12-17 1998-01-06 The Dow Chemical Company A1N sintered body containing a rare earth aluminum oxynitride and method to produce said body
JP3790000B2 (ja) 1997-01-27 2006-06-28 日本碍子株式会社 セラミックス部材と電力供給用コネクターとの接合構造
US6255601B1 (en) * 1997-04-01 2001-07-03 Applied Materials, Inc. Conductive feedthrough for a ceramic body and method of fabricating same
JP3670444B2 (ja) 1997-06-06 2005-07-13 日本碍子株式会社 窒化アルミニウム基複合体、電子機能材料、静電チャックおよび窒化アルミニウム基複合体の製造方法
US5909355A (en) 1997-12-02 1999-06-01 Applied Materials, Inc. Ceramic electrostatic chuck and method of fabricating same
JP3271601B2 (ja) * 1998-03-05 2002-04-02 ウシオ電機株式会社 管球用電気導入体およびその製造方法
US6744618B2 (en) * 1999-12-09 2004-06-01 Saint-Gobain Ceramics & Plastics, Inc. Electrostatic chucks with flat film electrode
US6723274B1 (en) * 1999-12-09 2004-04-20 Saint-Gobain Ceramics & Plastics, Inc. High-purity low-resistivity electrostatic chucks

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0360529B1 (en) * 1988-09-19 1997-06-04 Toto Ltd. Electrostatic chuck
EP0506537A1 (en) * 1991-03-28 1992-09-30 Shin-Etsu Chemical Co., Ltd. Electrostatic chuck
US5880922A (en) * 1995-03-10 1999-03-09 Lam Research Corporation Multilayered electrostatic chuck and method of manufacture thereof
EP0791956A2 (en) * 1995-09-06 1997-08-27 Ngk Insulators, Ltd. Electrostatic chuck
EP0856881A2 (en) * 1997-01-29 1998-08-05 Ngk Insulators, Ltd. Joint structure of metal member and ceramic member and method of producing the same
EP0886312A2 (en) * 1997-06-20 1998-12-23 Ngk Insulators, Ltd. Ceramics joint structure and method of producing the same
EP1030364A2 (en) * 1999-02-17 2000-08-23 Applied Materials, Inc. Laminated ceramic with multilayer electrodes and method of fabrication

Also Published As

Publication number Publication date
JP4768185B2 (ja) 2011-09-07
DE10085266T1 (de) 2002-12-12
WO2001043183A9 (en) 2002-11-28
KR20020059440A (ko) 2002-07-12
WO2001043183A2 (en) 2001-06-14
JP2003517730A (ja) 2003-05-27
AU4516001A (en) 2001-06-18
GB2375889A (en) 2002-11-27
KR100459748B1 (ko) 2004-12-03
CN1275309C (zh) 2006-09-13
DE10085266B4 (de) 2011-08-11
US6603650B1 (en) 2003-08-05
WO2001043183A3 (en) 2002-05-10
GB0215883D0 (en) 2002-08-14
CN1409870A (zh) 2003-04-09

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Expiry date: 20201204