DE10085266B4 - Elektrostatischer Scheibenhalter - Google Patents

Elektrostatischer Scheibenhalter Download PDF

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Publication number
DE10085266B4
DE10085266B4 DE10085266T DE10085266T DE10085266B4 DE 10085266 B4 DE10085266 B4 DE 10085266B4 DE 10085266 T DE10085266 T DE 10085266T DE 10085266 T DE10085266 T DE 10085266T DE 10085266 B4 DE10085266 B4 DE 10085266B4
Authority
DE
Germany
Prior art keywords
metal
electrode
electrical contact
disk holder
electrostatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE10085266T
Other languages
German (de)
English (en)
Other versions
DE10085266T1 (de
Inventor
Ramesh N.Y. Divakar
Morteza Mass. Zandi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Ceramics and Plastics Inc
Original Assignee
Saint Gobain Ceramics and Plastics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Ceramics and Plastics Inc filed Critical Saint Gobain Ceramics and Plastics Inc
Publication of DE10085266T1 publication Critical patent/DE10085266T1/de
Application granted granted Critical
Publication of DE10085266B4 publication Critical patent/DE10085266B4/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Ceramic Products (AREA)
  • Resistance Heating (AREA)
DE10085266T 1999-12-09 2000-12-05 Elektrostatischer Scheibenhalter Expired - Lifetime DE10085266B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/457,968 US6603650B1 (en) 1999-12-09 1999-12-09 Electrostatic chuck susceptor and method for fabrication
US09/457,968 1999-12-09
PCT/US2000/042553 WO2001043183A2 (en) 1999-12-09 2000-12-05 Electrostatic chuck, susceptor and method for fabrication

Publications (2)

Publication Number Publication Date
DE10085266T1 DE10085266T1 (de) 2002-12-12
DE10085266B4 true DE10085266B4 (de) 2011-08-11

Family

ID=23818807

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10085266T Expired - Lifetime DE10085266B4 (de) 1999-12-09 2000-12-05 Elektrostatischer Scheibenhalter

Country Status (8)

Country Link
US (1) US6603650B1 (enExample)
JP (1) JP4768185B2 (enExample)
KR (1) KR100459748B1 (enExample)
CN (1) CN1275309C (enExample)
AU (1) AU4516001A (enExample)
DE (1) DE10085266B4 (enExample)
GB (1) GB2375889B (enExample)
WO (1) WO2001043183A2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6744618B2 (en) * 1999-12-09 2004-06-01 Saint-Gobain Ceramics & Plastics, Inc. Electrostatic chucks with flat film electrode
CN1655022A (zh) * 2004-02-14 2005-08-17 鸿富锦精密工业（深圳）有限公司 基板贴合装置
TWI350394B (en) * 2004-04-16 2011-10-11 Chimei Innolux Corp Apparatus and method for connecting two substrates
JP4542485B2 (ja) 2004-12-14 2010-09-15 日本碍子株式会社 アルミナ部材及びその製造方法
JP2007258610A (ja) 2006-03-24 2007-10-04 Ngk Insulators Ltd アルミナ焼成体
JP5094863B2 (ja) * 2007-07-23 2012-12-12 株式会社クリエイティブ テクノロジー 基板吸着装置及びその製造方法
JP4469006B2 (ja) * 2007-09-25 2010-05-26 キヤノンアネルバ株式会社 表示用基板の製造方法
TWI450353B (zh) * 2008-01-08 2014-08-21 Ngk Insulators Ltd A bonding structure and a semiconductor manufacturing apparatus
DE102008035240B4 (de) * 2008-07-29 2017-07-06 Ivoclar Vivadent Ag Vorrichtung zur Erwärmung von Formteilen, insbesondere dentalkeramischen Formteilen
KR102382823B1 (ko) 2015-09-04 2022-04-06 삼성전자주식회사 에어 홀을 갖는 링 부재 및 그를 포함하는 기판 처리 장치
WO2020086122A1 (en) * 2018-10-24 2020-04-30 Applied Materials, Inc. Substrate support designs for a deposition chamber

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0704887A2 (en) * 1994-09-30 1996-04-03 International Business Machines Corporation A method and device for controlling tensile and compressive stresses and mechanical problems in thin films on substrates
EP0791956A2 (en) * 1995-09-06 1997-08-27 Ngk Insulators, Ltd. Electrostatic chuck
EP0856881A2 (en) * 1997-01-29 1998-08-05 Ngk Insulators, Ltd. Joint structure of metal member and ceramic member and method of producing the same
EP0886312A2 (en) * 1997-06-20 1998-12-23 Ngk Insulators, Ltd. Ceramics joint structure and method of producing the same
US5880922A (en) * 1995-03-10 1999-03-09 Lam Research Corporation Multilayered electrostatic chuck and method of manufacture thereof
US6723274B1 (en) * 1999-12-09 2004-04-20 Saint-Gobain Ceramics & Plastics, Inc. High-purity low-resistivity electrostatic chucks
US6744618B2 (en) * 1999-12-09 2004-06-01 Saint-Gobain Ceramics & Plastics, Inc. Electrostatic chucks with flat film electrode

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5944797A (ja) 1982-09-07 1984-03-13 増田　閃一 物体の静電的処理装置
JPS6278170A (ja) * 1985-10-02 1987-04-10 三菱重工業株式会社 ＳｉＣ又はＳｉ↓３Ｎ↓４と金属との接合体
DE3608326A1 (de) 1986-03-13 1987-09-17 Kempten Elektroschmelz Gmbh Praktisch porenfreie formkoerper aus polykristallinem aluminiumnitrid und verfahren zu ihrer herstellung ohne mitverwendung von sinterhilfsmitteln
US4778778A (en) 1987-06-03 1988-10-18 Keramont Advanced Ceramic Products Corporation Process for the production of sintered aluminum nitrides
JP2665242B2 (ja) 1988-09-19 1997-10-22 東陶機器株式会社 静電チャック
JP3016514B2 (ja) * 1988-12-19 2000-03-06 株式会社東芝 耐熱性モリブデン線
JPH0617214B2 (ja) 1989-12-29 1994-03-09 ナショナル サイエンス カウンシル 超微粒子な窒化アルミニウム粉末の製造方法
EP0493089B1 (en) 1990-12-25 1998-09-16 Ngk Insulators, Ltd. Wafer heating apparatus and method for producing the same
EP1120817B8 (en) 1991-03-26 2007-10-10 Ngk Insulators, Ltd. Use of a corrosion-resistant member
EP0506537A1 (en) 1991-03-28 1992-09-30 Shin-Etsu Chemical Co., Ltd. Electrostatic chuck
JPH06737A (ja) 1991-03-29 1994-01-11 Shin Etsu Chem Co Ltd 静電チャック基板
JPH0659008A (ja) 1992-08-06 1994-03-04 Sumitomo Electric Ind Ltd 物性測定装置およびその測定方法
US5800618A (en) 1992-11-12 1998-09-01 Ngk Insulators, Ltd. Plasma-generating electrode device, an electrode-embedded article, and a method of manufacturing thereof
US5413360A (en) 1992-12-01 1995-05-09 Kyocera Corporation Electrostatic chuck
US5320990A (en) 1993-03-30 1994-06-14 The Dow Chemical Company Process for sintering aluminum nitride to a high thermal conductivity and resultant sintered bodies
JPH06326175A (ja) 1993-04-22 1994-11-25 Applied Materials Inc 集積回路処理装置において使用されるウエハサポートの誘電材への保護被覆とその形成方法
EP0635870A1 (en) 1993-07-20 1995-01-25 Applied Materials, Inc. An electrostatic chuck having a grooved surface
DE69429243T2 (de) 1993-11-18 2002-06-27 Ngk Insulators, Ltd. Elektrode zur herstellung von plasma und verfahren zur herstellung der elektrode
US5541145A (en) 1993-12-22 1996-07-30 The Carborundum Company/Ibm Corporation Low temperature sintering route for aluminum nitride ceramics
JPH08507196A (ja) 1994-01-31 1996-07-30 アプライド マテリアルズ インコーポレイテッド 共形な絶縁体フィルムを有する静電チャック
US5677253A (en) 1995-03-30 1997-10-14 Kyocera Corporation Wafer holding member
US5886863A (en) 1995-05-09 1999-03-23 Kyocera Corporation Wafer support member
US5817406A (en) 1995-07-14 1998-10-06 Applied Materials, Inc. Ceramic susceptor with embedded metal electrode and brazing material connection
US5633073A (en) * 1995-07-14 1997-05-27 Applied Materials, Inc. Ceramic susceptor with embedded metal electrode and eutectic connection
DE69610673T2 (de) 1995-08-03 2001-05-10 Ngk Insulators, Ltd. Gesinterte Aluminiumnitridkörper und ihr Herstellungsverfahren
JP3670416B2 (ja) 1995-11-01 2005-07-13 日本碍子株式会社 金属包含材および静電チャック
US6017485A (en) 1996-03-28 2000-01-25 Carborundum Corporation Process for making a low electrical resistivity, high purity aluminum nitride electrostatic chuck
US5764471A (en) 1996-05-08 1998-06-09 Applied Materials, Inc. Method and apparatus for balancing an electrostatic force produced by an electrostatic chuck
US5708557A (en) 1996-08-22 1998-01-13 Packard Hughes Interconnect Company Puncture-resistant electrostatic chuck with flat surface and method of making the same
US5958813A (en) 1996-11-26 1999-09-28 Kyocera Corporation Semi-insulating aluminum nitride sintered body
US5705450A (en) 1996-12-17 1998-01-06 The Dow Chemical Company A1N sintered body containing a rare earth aluminum oxynitride and method to produce said body
JP3790000B2 (ja) 1997-01-27 2006-06-28 日本碍子株式会社 セラミックス部材と電力供給用コネクターとの接合構造
US6255601B1 (en) * 1997-04-01 2001-07-03 Applied Materials, Inc. Conductive feedthrough for a ceramic body and method of fabricating same
US6303879B1 (en) 1997-04-01 2001-10-16 Applied Materials, Inc. Laminated ceramic with multilayer electrodes and method of fabrication
JP3670444B2 (ja) 1997-06-06 2005-07-13 日本碍子株式会社 窒化アルミニウム基複合体、電子機能材料、静電チャックおよび窒化アルミニウム基複合体の製造方法
US5909355A (en) 1997-12-02 1999-06-01 Applied Materials, Inc. Ceramic electrostatic chuck and method of fabricating same
JP3271601B2 (ja) * 1998-03-05 2002-04-02 ウシオ電機株式会社 管球用電気導入体およびその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0704887A2 (en) * 1994-09-30 1996-04-03 International Business Machines Corporation A method and device for controlling tensile and compressive stresses and mechanical problems in thin films on substrates
US5880922A (en) * 1995-03-10 1999-03-09 Lam Research Corporation Multilayered electrostatic chuck and method of manufacture thereof
EP0791956A2 (en) * 1995-09-06 1997-08-27 Ngk Insulators, Ltd. Electrostatic chuck
EP0856881A2 (en) * 1997-01-29 1998-08-05 Ngk Insulators, Ltd. Joint structure of metal member and ceramic member and method of producing the same
EP0886312A2 (en) * 1997-06-20 1998-12-23 Ngk Insulators, Ltd. Ceramics joint structure and method of producing the same
US6723274B1 (en) * 1999-12-09 2004-04-20 Saint-Gobain Ceramics & Plastics, Inc. High-purity low-resistivity electrostatic chucks
US6744618B2 (en) * 1999-12-09 2004-06-01 Saint-Gobain Ceramics & Plastics, Inc. Electrostatic chucks with flat film electrode

Also Published As

Publication number Publication date
JP4768185B2 (ja) 2011-09-07
DE10085266T1 (de) 2002-12-12
WO2001043183A9 (en) 2002-11-28
KR20020059440A (ko) 2002-07-12
WO2001043183A2 (en) 2001-06-14
JP2003517730A (ja) 2003-05-27
GB2375889B (en) 2004-03-10
AU4516001A (en) 2001-06-18
GB2375889A (en) 2002-11-27
KR100459748B1 (ko) 2004-12-03
CN1275309C (zh) 2006-09-13
US6603650B1 (en) 2003-08-05
WO2001043183A3 (en) 2002-05-10
GB0215883D0 (en) 2002-08-14
CN1409870A (zh) 2003-04-09

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
R018 Grant decision by examination section/examining division
R020 Patent grant now final

Effective date: 20111112

R071 Expiry of right