JP4749760B2 - 三次元微小成形体の製造方法 - Google Patents

三次元微小成形体の製造方法 Download PDF

Info

Publication number
JP4749760B2
JP4749760B2 JP2005139912A JP2005139912A JP4749760B2 JP 4749760 B2 JP4749760 B2 JP 4749760B2 JP 2005139912 A JP2005139912 A JP 2005139912A JP 2005139912 A JP2005139912 A JP 2005139912A JP 4749760 B2 JP4749760 B2 JP 4749760B2
Authority
JP
Japan
Prior art keywords
meth
resin composition
photosensitive resin
compound
acrylate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2005139912A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006317698A (ja
Inventor
隆宏 浅井
亨 高橋
浩輝 前田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2005139912A priority Critical patent/JP4749760B2/ja
Priority to TW095116292A priority patent/TWI328716B/zh
Priority to DE112006001192T priority patent/DE112006001192T5/de
Priority to PCT/JP2006/309471 priority patent/WO2006121113A1/ja
Priority to KR1020077025288A priority patent/KR100904576B1/ko
Priority to CNA2006800156507A priority patent/CN101185025A/zh
Priority to US11/913,345 priority patent/US20090286020A1/en
Priority to CN2011101586844A priority patent/CN102226868A/zh
Publication of JP2006317698A publication Critical patent/JP2006317698A/ja
Application granted granted Critical
Publication of JP4749760B2 publication Critical patent/JP4749760B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133526—Lenses, e.g. microlenses or Fresnel lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Polymerisation Methods In General (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2005139912A 2005-05-12 2005-05-12 三次元微小成形体の製造方法 Active JP4749760B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2005139912A JP4749760B2 (ja) 2005-05-12 2005-05-12 三次元微小成形体の製造方法
TW095116292A TWI328716B (en) 2005-05-12 2006-05-08 Photosensitive dry film for producing three-dimensional micromolded product and photosensitive resin composition
PCT/JP2006/309471 WO2006121113A1 (ja) 2005-05-12 2006-05-11 三次元微小成形体製造用感光性ドライフィルムおよび感光性樹脂組成物
KR1020077025288A KR100904576B1 (ko) 2005-05-12 2006-05-11 3차원 미소 성형체 제조용 감광성 드라이 필름 및 감광성수지 조성물
DE112006001192T DE112006001192T5 (de) 2005-05-12 2006-05-11 Photoempfindlicher Trockenfilm für die Herstellung von dreidimensionalen mikrogeformten Produkten und photoempfindliche Harzzusammensetzung
CNA2006800156507A CN101185025A (zh) 2005-05-12 2006-05-11 用于制造三维微成型体的感光性干薄膜和感光性树脂组合物
US11/913,345 US20090286020A1 (en) 2005-05-12 2006-05-11 Photosensitive dry film for production of three-dimensional micro-molded product, and photosensitive resin composition
CN2011101586844A CN102226868A (zh) 2005-05-12 2006-05-11 用于制造三维微成型体的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005139912A JP4749760B2 (ja) 2005-05-12 2005-05-12 三次元微小成形体の製造方法

Publications (2)

Publication Number Publication Date
JP2006317698A JP2006317698A (ja) 2006-11-24
JP4749760B2 true JP4749760B2 (ja) 2011-08-17

Family

ID=37396621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005139912A Active JP4749760B2 (ja) 2005-05-12 2005-05-12 三次元微小成形体の製造方法

Country Status (7)

Country Link
US (1) US20090286020A1 (ko)
JP (1) JP4749760B2 (ko)
KR (1) KR100904576B1 (ko)
CN (2) CN101185025A (ko)
DE (1) DE112006001192T5 (ko)
TW (1) TWI328716B (ko)
WO (1) WO2006121113A1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4987521B2 (ja) * 2007-03-14 2012-07-25 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
JP5494847B2 (ja) * 2007-03-30 2014-05-21 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP5277679B2 (ja) * 2007-03-30 2013-08-28 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
CN101971097B (zh) 2008-03-21 2013-04-17 日立化成株式会社 感光性树脂组合物、感光性元件、抗蚀剂图案的形成方法及印刷配线板的制造方法
JP5685400B2 (ja) * 2010-08-06 2015-03-18 株式会社クラレ 微細構造体の製造方法
CN102540284B (zh) * 2012-02-07 2013-11-20 中国科学院光电技术研究所 基于负性光刻胶和掩膜移动曝光工艺的微透镜阵列制备方法
JP6150178B2 (ja) * 2012-07-02 2017-06-21 パナソニックＩｐマネジメント株式会社 光導波路および光導波路作製用のドライフィルム
JP6460672B2 (ja) * 2013-09-18 2019-01-30 キヤノン株式会社 膜の製造方法、光学部品の製造方法、回路基板の製造方法及び電子部品の製造方法
EP3541602A4 (en) * 2016-11-17 2020-10-28 Orbotech Ltd. 3D HYBRID PRINTING FROM MULTIPLE MATERIALS
KR20210052452A (ko) 2018-08-30 2021-05-10 닛산 가가쿠 가부시키가이샤 네가티브형 감광성 수지조성물
US20230042586A1 (en) * 2021-08-05 2023-02-09 Toyota Motor Engineering & Manufacturing North America, Inc. Interference lithography using reflective base surfaces

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3901705A (en) * 1973-09-06 1975-08-26 Du Pont Method of using variable depth photopolymerization imaging systems
US4264708A (en) * 1978-03-31 1981-04-28 E. I. Du Pont De Nemours And Company Radiation sensitive element having a thin photopolymerizable layer
JPS61199916A (ja) * 1985-03-01 1986-09-04 Asahi Chem Ind Co Ltd 立体成形品の製造方法
JPH0820733B2 (ja) * 1988-08-11 1996-03-04 富士写真フイルム株式会社 ドライフイルムレジスト用光重合性組成物
US5428468A (en) * 1993-11-05 1995-06-27 Alliedsignal Inc. Illumination system employing an array of microprisms
JPH07281181A (ja) * 1994-04-11 1995-10-27 Toray Ind Inc 面状光学素子の製造方法
DE19630705A1 (de) * 1995-08-30 1997-03-20 Deutsche Telekom Ag Verfahren zur Herstellung von 3-dimensional strukturierten Polymerschichten für die integrierte Optik
US6010747A (en) * 1996-12-02 2000-01-04 Alliedsignal Inc. Process for making optical structures for diffusing light
JP3701123B2 (ja) * 1998-06-24 2005-09-28 株式会社日立製作所 隔壁転写凹版用元型の製造方法及びプラズマディスプレイパネルの隔壁形成方法
JP2000265087A (ja) * 1999-03-11 2000-09-26 Mikuni Color Ltd 金属パターン形成方法
JP3619852B2 (ja) * 1999-06-08 2005-02-16 ニチゴー・モートン株式会社 感光性樹脂組成物及びこれを用いたドライフィルムレジスト
JP2001246671A (ja) * 2000-03-06 2001-09-11 Nippon Synthetic Chem Ind Co Ltd:The 立体構造物の形成方法
JP2001290014A (ja) * 2000-04-04 2001-10-19 Nikon Corp 光学素子の製造方法及び製造システム並びにこの製造方法を用いて製作された光学素子及びこの光学素子を用いた露光装置
JP2004198995A (ja) * 2002-12-20 2004-07-15 Hitachi Chem Co Ltd 液晶表示装置用基板の表面凹凸形状を有する有機物層に用いられる感光性樹脂組成物及び感光性エレメント
JP2004020643A (ja) * 2002-06-12 2004-01-22 Fuji Photo Film Co Ltd ドライフィルムレジスト及びプリント基板の製造方法
JP2004317659A (ja) * 2003-04-14 2004-11-11 Fuji Photo Film Co Ltd ドライフィルムフォトレジスト
JP2004334184A (ja) * 2003-04-16 2004-11-25 Sharp Corp 三次元構造物形成方法および露光装置
JP4561280B2 (ja) * 2004-09-24 2010-10-13 日立化成工業株式会社 マイクロレンズアレイの製造方法、マイクロレンズアレイ用感光性樹脂組成物及びマイクロレンズアレイ用感光性エレメント

Also Published As

Publication number Publication date
CN101185025A (zh) 2008-05-21
US20090286020A1 (en) 2009-11-19
CN102226868A (zh) 2011-10-26
TWI328716B (en) 2010-08-11
DE112006001192T5 (de) 2008-02-28
WO2006121113A1 (ja) 2006-11-16
TW200708889A (en) 2007-03-01
KR20070116684A (ko) 2007-12-10
JP2006317698A (ja) 2006-11-24
KR100904576B1 (ko) 2009-06-25

Similar Documents

Publication Publication Date Title
JP4749760B2 (ja) 三次元微小成形体の製造方法
EP1825328B1 (en) Photosensitive resin composition and photosensitive dry film by the use thereof
JP3849950B2 (ja) 色フィルタ用感光性組成物
US20050258406A1 (en) Black resist composition for color filter
KR100805862B1 (ko) 안료분산형 감방사선 수지조성물 및 착색패턴의 형성방법
TWI509357B (zh) A photosensitive resin composition, a photosensitive member using the same, a partition wall forming method of an image display device, a method of manufacturing an image display device, and an image display device
JPH10171119A (ja) 光重合性樹脂組成物、およびこれを用いた色フィルタの製造方法
JP2006308960A (ja) マイクロレンズアレイの製造方法、マイクロレンズアレイ用感光性樹脂組成物及びマイクロレンズアレイ用感光性エレメント
JP4583449B2 (ja) 三次元微小成形体の製造方法
JP4668742B2 (ja) 三次元微小成形体の製造方法
JP2012053180A (ja) 透明絶縁保護膜形成用感光性樹脂組成物および透明絶縁膜
JP2007003860A (ja) 感光性樹脂組成物及びその用途
JP2010020077A (ja) マイクロレンズ保護膜形成用感光性樹脂組成物、マイクロレンズ保護膜形成用感光性ドライフィルム、及び液晶表示ディスプレイ
JPH11323143A (ja) 遮光性感光性樹脂組成物及びそれを用いたカラーフィルター
JP2005195758A (ja) 感光性樹脂組成物及びその用途
WO2005103823A1 (en) Photosensitive composition for black matrix
JP3572731B2 (ja) カラーフィルター
JPS60195849A (ja) 遮光スクリ−ンの製造方法
JP2005074632A (ja) 感光性ドライフィルム
JP2008033342A (ja) 緑色カラーフィルタ用組成物、緑色カラーフィルタ、及び液晶パネル
JPH0571994A (ja) 立体画像表示盤の製造方法
JP2005141239A (ja) 緑色カラーフィルタ用感光性組成物、これを用いた緑色カラーフィルタの製造方法、得られた緑色カラーフィルタ及び該緑色カラーフィルタを備えたカラーフィルタ
KR20150107082A (ko) 착색 감광성 수지 조성물
JPH0933716A (ja) カラーフィルター
JP2006088675A (ja) 感光性フィルムの製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080215

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101214

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110207

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110517

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110518

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 4749760

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140527

Year of fee payment: 3