JP4698586B2 - 新規フェノール化合物及び該フェノール化合物から誘導し得る新規エポキシ樹脂 - Google Patents

新規フェノール化合物及び該フェノール化合物から誘導し得る新規エポキシ樹脂 Download PDF

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Publication number
JP4698586B2
JP4698586B2 JP2006519423A JP2006519423A JP4698586B2 JP 4698586 B2 JP4698586 B2 JP 4698586B2 JP 2006519423 A JP2006519423 A JP 2006519423A JP 2006519423 A JP2006519423 A JP 2006519423A JP 4698586 B2 JP4698586 B2 JP 4698586B2
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Japan
Prior art keywords
epoxy resin
acid
general formula
compound
phenolic compound
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JP2006519423A
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English (en)
Japanese (ja)
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JPWO2005092826A1 (ja
Inventor
光男 阿久津
正晶 清水
由恵 真壁
直美 佐藤
智仁 石黒
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Adeka Corp
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Adeka Corp
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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/24Di-epoxy compounds carbocyclic
    • C08G59/245Di-epoxy compounds carbocyclic aromatic
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C39/00Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
    • C07C39/12Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings
    • C07C39/17Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings containing other rings in addition to the six-membered aromatic rings, e.g. cyclohexylphenol
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D303/00Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02Compounds containing oxirane rings
    • C07D303/12Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/28Ethers with hydroxy compounds containing oxirane rings

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Epoxy Compounds (AREA)
JP2006519423A 2004-03-25 2005-03-16 新規フェノール化合物及び該フェノール化合物から誘導し得る新規エポキシ樹脂 Active JP4698586B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006519423A JP4698586B2 (ja) 2004-03-25 2005-03-16 新規フェノール化合物及び該フェノール化合物から誘導し得る新規エポキシ樹脂

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004090129 2004-03-25
JP2004090129 2004-03-25
JP2006519423A JP4698586B2 (ja) 2004-03-25 2005-03-16 新規フェノール化合物及び該フェノール化合物から誘導し得る新規エポキシ樹脂
PCT/JP2005/004625 WO2005092826A1 (ja) 2004-03-25 2005-03-16 新規フェノール化合物及び該フェノール化合物から誘導し得る新規エポキシ樹脂

Publications (2)

Publication Number Publication Date
JPWO2005092826A1 JPWO2005092826A1 (ja) 2008-02-14
JP4698586B2 true JP4698586B2 (ja) 2011-06-08

Family

ID=35056117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006519423A Active JP4698586B2 (ja) 2004-03-25 2005-03-16 新規フェノール化合物及び該フェノール化合物から誘導し得る新規エポキシ樹脂

Country Status (4)

Country Link
JP (1) JP4698586B2 (zh)
CN (1) CN100386298C (zh)
TW (1) TW200609207A (zh)
WO (1) WO2005092826A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101169822B1 (ko) 2004-09-17 2012-07-30 가부시키가이샤 아데카 착색 알칼리 현상성 감광성 수지조성물 및 상기 착색 알칼리 현상성 감광성 수지조성물을 이용한 컬러필터
JP4198101B2 (ja) * 2004-09-17 2008-12-17 株式会社Adeka アルカリ現像性樹脂組成物
KR101317223B1 (ko) 2005-06-20 2013-10-15 가부시키가이샤 아데카 착색 알칼리 현상형 감광성 수지 조성물, 및 상기 착색 알칼리 현상형 감광성 수지 조성물을 이용한 컬러필터
JP4916224B2 (ja) * 2005-06-20 2012-04-11 株式会社Adeka アルカリ現像性感光性樹脂組成物
JP4878845B2 (ja) * 2006-01-10 2012-02-15 凸版印刷株式会社 アルカリ現像型感光性樹脂組成物を用いて形成した液晶分割配向制御用突起付き基板、及び液晶表示装置
JP4667261B2 (ja) * 2006-02-01 2011-04-06 株式会社Adeka アルカリ現像性感光性樹脂組成物
JP4738190B2 (ja) * 2006-02-01 2011-08-03 株式会社Adeka エポキシ樹脂、アルカリ現像性樹脂組成物及びアルカリ現像性感光性樹脂組成物
JP4878876B2 (ja) * 2006-03-15 2012-02-15 株式会社Adeka エポキシ樹脂、アルカリ現像性樹脂組成物及びアルカリ現像性感光性樹脂組成物
JP5546093B2 (ja) * 2006-12-26 2014-07-09 株式会社Adeka 重合性化合物及び重合性組成物
JP5311750B2 (ja) * 2007-02-28 2013-10-09 株式会社Adeka フェノール樹脂、エポキシ樹脂、アルカリ現像性樹脂組成物及びアルカリ現像性感光性樹脂組成物
KR20120101090A (ko) 2009-12-02 2012-09-12 다우 글로벌 테크놀로지스 엘엘씨 코팅 조성물
SG181461A1 (en) 2009-12-02 2012-07-30 Dow Global Technologies Llc Epoxy resin compositions
US9006312B2 (en) * 2009-12-02 2015-04-14 Dow Global Technologies Llc Composite compositions
JP7465673B2 (ja) * 2020-02-25 2024-04-11 株式会社Adeka 重合体、成形体及び光学材料

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000239206A (ja) * 1998-12-25 2000-09-05 Honshu Chem Ind Co Ltd 非対称アルキリデン多価フェノール類とその製造方法
JP2002316963A (ja) * 2001-02-15 2002-10-31 Osaka Gas Co Ltd 低ホルモン活性ビスフェノール類
JP2003064121A (ja) * 2001-08-23 2003-03-05 Tosoh Corp ポリオレフィンの製造方法
JP2003306461A (ja) * 2002-02-15 2003-10-28 Honshu Chem Ind Co Ltd 1,3,5−トリス(4−ヒドロキシフェニル)アダマンタン類及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0263129B1 (en) * 1986-04-14 1993-02-03 Hughes Aircraft Company Structural epoxy paste adhesive curable at ambient temperature and process for preparation thereof
JP3200123B2 (ja) * 1991-11-27 2001-08-20 住友化学工業株式会社 電子部品封止用エポキシ樹脂組成物
JP3173629B2 (ja) * 1992-02-12 2001-06-04 日本化薬株式会社 エポキシ樹脂組成物及びその硬化物
JPH05295089A (ja) * 1992-04-21 1993-11-09 Daihachi Chem Ind Co Ltd 硬化性樹脂組成物
MY129953A (en) * 1996-02-09 2007-05-31 Nippon Kayaku Kk Epoxy resin, epoxy resin composition and hardened product thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000239206A (ja) * 1998-12-25 2000-09-05 Honshu Chem Ind Co Ltd 非対称アルキリデン多価フェノール類とその製造方法
JP2002316963A (ja) * 2001-02-15 2002-10-31 Osaka Gas Co Ltd 低ホルモン活性ビスフェノール類
JP2003064121A (ja) * 2001-08-23 2003-03-05 Tosoh Corp ポリオレフィンの製造方法
JP2003306461A (ja) * 2002-02-15 2003-10-28 Honshu Chem Ind Co Ltd 1,3,5−トリス(4−ヒドロキシフェニル)アダマンタン類及びその製造方法

Also Published As

Publication number Publication date
TW200609207A (en) 2006-03-16
TWI367204B (zh) 2012-07-01
CN1771219A (zh) 2006-05-10
WO2005092826A1 (ja) 2005-10-06
JPWO2005092826A1 (ja) 2008-02-14
CN100386298C (zh) 2008-05-07

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